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EP0961928A4 - Method of scanning semiconductor wafers to inspect for defects - Google Patents

Method of scanning semiconductor wafers to inspect for defects

Info

Publication number
EP0961928A4
EP0961928A4 EP98907527A EP98907527A EP0961928A4 EP 0961928 A4 EP0961928 A4 EP 0961928A4 EP 98907527 A EP98907527 A EP 98907527A EP 98907527 A EP98907527 A EP 98907527A EP 0961928 A4 EP0961928 A4 EP 0961928A4
Authority
EP
European Patent Office
Prior art keywords
inspect
defects
semiconductor wafers
scanning semiconductor
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98907527A
Other languages
German (de)
French (fr)
Other versions
EP0961928A1 (en
Inventor
Sidney Braginsky
Robert Parks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0961928A1 publication Critical patent/EP0961928A1/en
Publication of EP0961928A4 publication Critical patent/EP0961928A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
EP98907527A 1997-02-21 1998-02-20 Method of scanning semiconductor wafers to inspect for defects Withdrawn EP0961928A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3901797P 1997-02-21 1997-02-21
US39017P 1997-02-21
PCT/US1998/003239 WO1998037404A1 (en) 1997-02-21 1998-02-20 Method of scanning semiconductor wafers to inspect for defects

Publications (2)

Publication Number Publication Date
EP0961928A1 EP0961928A1 (en) 1999-12-08
EP0961928A4 true EP0961928A4 (en) 2000-04-26

Family

ID=21903212

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98907527A Withdrawn EP0961928A4 (en) 1997-02-21 1998-02-20 Method of scanning semiconductor wafers to inspect for defects

Country Status (3)

Country Link
EP (1) EP0961928A4 (en)
JP (1) JP2001512576A (en)
WO (1) WO1998037404A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6690473B1 (en) 1999-02-01 2004-02-10 Sensys Instruments Corporation Integrated surface metrology
US7042580B1 (en) 1999-02-01 2006-05-09 Tokyo Electron Limited Apparatus for imaging metrology
US6563586B1 (en) 1999-02-01 2003-05-13 Therma-Wave, Inc. Wafer metrology apparatus and method
US7177019B2 (en) 1999-02-01 2007-02-13 Tokyo Electron Limited Apparatus for imaging metrology
AU4175800A (en) * 1999-03-22 2000-10-09 Sensys Instruments Corporation Method and apparatus for wafer metrology
KR20220103201A (en) 2014-12-05 2022-07-21 케이엘에이 코포레이션 Apparatus, method and computer program product for defect detection in work pieces
JP2017116293A (en) * 2015-12-21 2017-06-29 株式会社ディスコ Inspection device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4505585A (en) * 1981-03-31 1985-03-19 Olympus Optical Co., Ltd. System for detecting defects on an optical surface
US4740079A (en) * 1984-10-29 1988-04-26 Hitachi, Ltd. Method of and apparatus for detecting foreign substances
US5135303A (en) * 1990-02-20 1992-08-04 Hitachi, Ltd. Method of and apparatus for inspecting surface defects
US5225886A (en) * 1989-09-18 1993-07-06 Hitachi, Ltd. Method of and apparatus for detecting foreign substances
US5402001A (en) * 1992-10-05 1995-03-28 Matsushita Electric Industrial Co., Ltd. Method of checking for foreign matter on a substrate with light of maximum reflectivity for that substrate
JPH0830997A (en) * 1994-07-15 1996-02-02 Yamaha Corp Tracking controller of disk drive device
JPH08271438A (en) * 1995-03-31 1996-10-18 New Kurieishiyon:Kk Inspection equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4402613A (en) * 1979-03-29 1983-09-06 Advanced Semiconductor Materials America Surface inspection system
US4938654A (en) * 1985-05-17 1990-07-03 Schram Richard R Automated wafer inspection system
US4893932A (en) * 1986-05-02 1990-01-16 Particle Measuring Systems, Inc. Surface analysis system and method
US5189481A (en) * 1991-07-26 1993-02-23 Tencor Instruments Particle detector for rough surfaces

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4505585A (en) * 1981-03-31 1985-03-19 Olympus Optical Co., Ltd. System for detecting defects on an optical surface
US4740079A (en) * 1984-10-29 1988-04-26 Hitachi, Ltd. Method of and apparatus for detecting foreign substances
US5225886A (en) * 1989-09-18 1993-07-06 Hitachi, Ltd. Method of and apparatus for detecting foreign substances
US5135303A (en) * 1990-02-20 1992-08-04 Hitachi, Ltd. Method of and apparatus for inspecting surface defects
US5402001A (en) * 1992-10-05 1995-03-28 Matsushita Electric Industrial Co., Ltd. Method of checking for foreign matter on a substrate with light of maximum reflectivity for that substrate
JPH0830997A (en) * 1994-07-15 1996-02-02 Yamaha Corp Tracking controller of disk drive device
JPH08271438A (en) * 1995-03-31 1996-10-18 New Kurieishiyon:Kk Inspection equipment
US5757479A (en) * 1995-03-31 1998-05-26 New Creation Co., Ltd. Optical inspection apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9837404A1 *

Also Published As

Publication number Publication date
EP0961928A1 (en) 1999-12-08
JP2001512576A (en) 2001-08-21
WO1998037404A1 (en) 1998-08-27

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