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EP0841668A1 - Résistance électrique et son procédé de fabrication - Google Patents

Résistance électrique et son procédé de fabrication Download PDF

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Publication number
EP0841668A1
EP0841668A1 EP97119468A EP97119468A EP0841668A1 EP 0841668 A1 EP0841668 A1 EP 0841668A1 EP 97119468 A EP97119468 A EP 97119468A EP 97119468 A EP97119468 A EP 97119468A EP 0841668 A1 EP0841668 A1 EP 0841668A1
Authority
EP
European Patent Office
Prior art keywords
resistance
substrate
resistors
adhesive layer
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97119468A
Other languages
German (de)
English (en)
Other versions
EP0841668B1 (fr
Inventor
Ullrich Dr. Hetzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IsabellenHuette Heusler GmbH and Co KG
Original Assignee
IsabellenHuette Heusler GmbH and Co KG
Isabellen Huette GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IsabellenHuette Heusler GmbH and Co KG, Isabellen Huette GmbH filed Critical IsabellenHuette Heusler GmbH and Co KG
Publication of EP0841668A1 publication Critical patent/EP0841668A1/fr
Application granted granted Critical
Publication of EP0841668B1 publication Critical patent/EP0841668B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/07—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding

Definitions

  • the invention relates to an electrical resistor according to the preamble of claim 1, preferably with on the Arranged side of the resistance film facing away from the substrate Terminal contact surfaces, and method for producing such Resistances.
  • Low-resistance measuring power resistors of this type their resistance values are often in the milliohm range, for some applications but also up to orders of magnitude of more than 100 Ohm can be enough, are often required in SMD design, so that they like the well-known chip components with their flat Connection contacts directly on flat connection conductors from PCBs soldered or with their substrate flat on the Surface of a heat sink can be soldered or glued.
  • the resistors can also be used together with power semiconductors and other passive components in so-called power hybrid circuits are used, with the connection contact layers the resistors external leads be attached (“bonding").
  • a major advantage of this Surface mounting is next to a possible downsizing and better use of space the good heat dissipation from the resistance element.
  • connection contact Pearl made of solder.
  • an aluminum substrate e.g. made of AlMg3 sheet
  • a foil made of a resistance alloy between which there is an adhesive film.
  • the resistance foil is photo-etched into the desired one Form with the required path structures.
  • the surface of the resistor foil carrying the resistance foil is etched Composite body in the screen printing process with a layer of Solder mask coated, the later connection contact areas defined and left out, which are then screen printed be printed with a solder paste from which finally through a remelting process the connection contact forming solder pearl is created.
  • the object of the invention is a suitable as a power resistor for current measurements To create resistance that is even more resilient than before and easy to manufacture and reuse in large quantities is without the required precision and reliability resistance is impaired.
  • the invention enables the production of a large number of Resistors with the properties mentioned above from the prefabricated Triple composite laminate made of resistance film, adhesive layer and substrate with little effort. If it extreme miniaturization is important, for example 8000 resistors from a "benefit" of 300 x 400 mm produce.
  • the resistors can be used as needed SMD components for printed circuit boards or as internal elements used for other types of resistance, e.g. built into housing or attached to thicker copper supports, heat sinks, etc. be etc.
  • a relatively strong resin adhesive filled with ceramic powder preferably in the form of a film as an adhesive layer of the laminate advantageous, both in the manufacture, in particular when separating the resistors, as well as when manufacturing Component.
  • This adhesive layer is mechanical and thermal resilient and so far in the manufacture of resistors used polyimide adhesive films with regard to the derivation of the Superior heat loss of the resistance foil.
  • Those with ceramic powder or other thermally conductive, but electrically insulating granular material are filled plastic adhesive layers known per se, namely for gluing semiconductor components on heat-dissipating housing parts or heat sinks. In which however, they have resistance described here in the known case non-relevant advantages such as brittleness and easy breakability.
  • the contact layers are not as before after Etching of the resistance structure, but by partial Pre-metallization of the resistance foil are applied, either on the top or e.g. in previously etched Cutouts in the resistance foil. If the connection contact layers larger to simplify the procedure can be formed as desired later, the resistance and contact structures can be combined in a single Operation can be etched. This advantage also applies to Use of other adhesive layers without ceramic filling. On the other hand there are advantages of using the filled Adhesive even for resistors whose resistance foil does not have pre-metallized contact layers, but only Terminal contact surfaces, which only occur when the resistance is isolated be contacted.
  • the invention is particularly suitable for extremely small resistors, but also for large components with side lengths of a few cm.
  • the resistance shown in Fig. 1A essentially exists from a substrate 1 made of a metal such as copper or Aluminum, the resistance foil 2 made of metal such as one of the CuNi alloys known for precision measuring resistors and an interposed adhesive layer 3 with which the Resistance film 2 is attached to the substrate 1.
  • the Substrate 1 is usually thicker than the resistance film and can serve as a heat sink in addition to the supporting function.
  • the resistance foil is in the usual way for the one you want Structured resistance value, for example in a four-pole version (see FIG. 2B) and / or in the form of a meander track, and has on its surface facing away from the substrate opposite ends each at the edge of the resistor its electrical connection to external circuits separate contact pads.
  • connection contacts can each consist of several Layers consist of different metals, e.g. out a lower layer 5 made of copper, which has a low resistance Creates contact transition, and a layer thereon 6 made of nickel, which makes subsequent external contacting easier, So depending on the application, a soldered connection or that Connect connecting wires.
  • the adhesive layer 3 which is is a flexible plastic film that e.g. a thickness can be on the order of 75 or 100 ⁇ m. she should on the one hand in addition to the required electrical insulation firm and permanently reliable adhesion of the resistance foil on the substrate even at high mechanical and thermal Load and on the other hand the best possible thermal conductivity guarantee.
  • layer 3 consists of a plastic adhesive such as Epoxy resin or polyimide material, which is filled with a heat-conducting powder, preferably with ceramic powder, e.g. Alumina, boron nitride or the same as is known per se for other purposes.
  • connection contact layer 4 ' can be made from or at Several different metal layers are required. As can be seen from Fig. 1 and also from the following described method results, there are the contact layers 4 completely within the outer circumference of the Resistance layer, which in turn is inside the outer circumference of the substrate.
  • the resistance element shown schematically can then provide protective layers in the usual way and / or easily in housing or other external Arrangements are installed.
  • the laminate shown in FIG. 2A is first made from a metal sheet forming the substrate 1, which can be, for example, a 0.5 mm thick copper sheet, the adhesive layer 3 and the metallic resistance film 2 in a several thousand resistors resulting size generated.
  • the adhesive is either applied in several layers using the screen printing process, for example to the substrate, or transferred as a prefabricated dry film in a tempered press.
  • the resistance structure 22 for two separate pads be formed at their opposite ends, as at 23 is indicated.
  • this four-pole design can two connection contacts for the power connection and the serve the other two for the voltage connection, as it is for Measurement purposes is required.
  • Fig. 2C shows a section through Fig. 2B along the plane A-A.
  • the metallization of the areas 42 can be with or according to Fig. 2C several layers are carried out.
  • the bottom, Layer 5 preferably made of copper (see also FIG. 1A) is used to make this area less resistive, while the uppermost layer 6, preferably made of nickel later contacting made easier, as already mentioned.
  • the resistance foil in the defined areas 42 before Metallization etched by an amount thinner, approximately corresponds to the later thickness of the copper layer.
  • the etched trough-like depressions or recesses are in the (corresponding in Fig. 2C) 2D at 43 recognizable. Again, this can be done in the Recesses 43 introduced copper preferably a thinner Nickel layer 6 are metallized.
  • the "benefit" Only after the partial precoating described Resistance side of the laminate (the "benefit") becomes the real one Structure of the resistors and the contact areas defined another photolithography process and by etching generated.
  • the etching is advantageously carried out in one Operation, being in the area of the actual resistance only the resistance material and in the contact area the resistance foil etched through with their metallization up to the adhesive layer 3 as shown in Fig. 2E using the example of (to Fig. 2C alternative) embodiment according to Fig. 2D can be seen.
  • the resistors After etching the resistance structure and after removing the auxiliary layers required for etching and cleaning of the laminate the resistors are now ready to be separated. If needed, can do a comparison of the resistance values beforehand, ie while still "using” in a known manner e.g. through incisions in the resistance foil be performed.
  • the resistors could be e.g. in the so far usual way (DE 43 39 551 C1) with a coordinate punch are punched out in order.
  • the ceramic filling of the preferably used in the method described here glue can have a highly abrasive effect on the punching tools have, which are therefore constantly reworked must, for example after every less than 1000 work steps, so that not even the resistances of a "benefit" could be separated without reworking the punch.
  • the edge area 31, by means of which the adhesive can be detached from the substrate be more than 0.5 mm. This danger arises in particular in the one used here, due to the high degree of ceramic filling relatively brittle adhesive and limits the desired miniaturization of resistance.
  • One way to avoid this difficulty would be Separating the resistors by cutting, especially with a laser cutting system, which is relatively complex and is slow and also the electrical properties of the Components can affect.
  • the method described here is less complex and more gentle separation method applied.
  • the metal substrate 1 of its the back of the resistance film 2 facing away in one narrow area etched following the outline of the resistance so that the continuous up to the adhesive layer 3 Incisions 50 and consequently side surfaces etched on the substrate 1 51 of the component to be produced, similar to the etched side surfaces 44 (FIG. 2E) of the resistance foil 2 and the connection contact surfaces 5 and 6. Since the contour of the Separation lines or incisions 50 photolithographically and etching defined and generated, it can easily be almost arbitrarily complex. It is also particularly advantageous that this also desired other recesses as required or creates holes in the resistor with no extra effort can be.
  • the resistors of the type described here which are made of foils, are suitable for both SMD assembly and for contacting via bond wires and can be used above all as measuring resistors with resistance values in the milliohm range (typically between 1 and 500 mOhm). They are highly resilient and, due to their extremely low internal thermal resistance (typically less than 1 K / W x cm 2 ), can also be considerably overloaded for a short time.
  • resistors according to the invention with the filled Glue between its resistance film and its substrate methods other than those described above are also suitable.
  • the resistors could be known per se Isolated by cutting the laminate with a laser will.
  • the described method can also Have advantages over comparable known methods, if adhesive films without ceramic powder filling are used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
EP19970119468 1996-11-11 1997-11-06 Résistance électrique et son procédé de fabrication Expired - Lifetime EP0841668B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19646441 1996-11-11
DE1996146441 DE19646441A1 (de) 1996-11-11 1996-11-11 Elektrischer Widerstand und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
EP0841668A1 true EP0841668A1 (fr) 1998-05-13
EP0841668B1 EP0841668B1 (fr) 2007-01-10

Family

ID=7811243

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970119468 Expired - Lifetime EP0841668B1 (fr) 1996-11-11 1997-11-06 Résistance électrique et son procédé de fabrication

Country Status (3)

Country Link
EP (1) EP0841668B1 (fr)
JP (1) JPH10149901A (fr)
DE (2) DE19646441A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139323C1 (de) * 2001-08-10 2002-12-05 Heusler Isabellenhuette Niederohmiger elektrischer Widerstand und Verfahren zur Herstellung solcher Widerstände
DE10122468C1 (de) * 2001-05-09 2003-03-20 Heusler Isabellenhuette Elektrischer Widerstand und Verfahren zu seiner Herstellung
DE10338041B3 (de) * 2003-08-19 2005-02-24 Isabellenhütte Heusler GmbH KG Elektrischer Widerstand und Verfahren zum Herstellen von Widerständen
WO2008055582A1 (fr) * 2006-12-20 2008-05-15 Isabellenhütte Heusler Gmbh & Co. Kg Résistance, notamment résistance smd et procédé de production associé
US9620267B2 (en) 2013-04-18 2017-04-11 Panasonic Intellectual Property Management Co., Ltd. Resistor and manufacturing method for same
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
EP3514806A1 (fr) * 2018-01-23 2019-07-24 BIOTRONIK SE & Co. KG Résistance électrique, en particulier pour implants médicaux
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
WO2022252657A1 (fr) * 2021-06-04 2022-12-08 深圳市卓力能技术有限公司 Ensemble élément chauffant, procédé de préparation d'élément chauffant, et atomiseur

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19905156A1 (de) * 1999-02-08 2000-08-10 Hbm Waegetechnik Gmbh Abgleichelement für einen Aufnehmer
DE10116531B4 (de) * 2000-04-04 2008-06-19 Koa Corp., Ina Widerstand mit niedrigem Widerstandswert
JP3803025B2 (ja) 2000-12-05 2006-08-02 富士電機ホールディングス株式会社 抵抗器
JP2006344776A (ja) * 2005-06-09 2006-12-21 Alpha Electronics Corp チップ抵抗器とその製造方法
DE102006060978B4 (de) * 2006-12-20 2014-09-11 Ifm Electronic Gmbh SMD-Temperaturmesselement und Vorrichtung
DE102011109007A1 (de) 2011-07-29 2013-01-31 Epcos Ag Verfahren zum Herstellen eines elektrischen Bauelements und elektrisches Bauelement

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254493A (en) * 1990-10-30 1993-10-19 Microelectronics And Computer Technology Corporation Method of fabricating integrated resistors in high density substrates
DE4339551C1 (de) * 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
US5547758A (en) * 1992-04-20 1996-08-20 Denki Kagaku Kogyo Kabushiki Kaisha Insulating material
JPH08236325A (ja) * 1996-01-16 1996-09-13 Hokuriku Electric Ind Co Ltd チップ抵抗器の製造方法
US5567917A (en) * 1993-08-06 1996-10-22 Mitsubishi Denki Kabushiki Kaisha Metal base board and electronic equipment using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254493A (en) * 1990-10-30 1993-10-19 Microelectronics And Computer Technology Corporation Method of fabricating integrated resistors in high density substrates
US5547758A (en) * 1992-04-20 1996-08-20 Denki Kagaku Kogyo Kabushiki Kaisha Insulating material
US5567917A (en) * 1993-08-06 1996-10-22 Mitsubishi Denki Kabushiki Kaisha Metal base board and electronic equipment using the same
DE4339551C1 (de) * 1993-11-19 1994-10-13 Heusler Isabellenhuette Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand
JPH08236325A (ja) * 1996-01-16 1996-09-13 Hokuriku Electric Ind Co Ltd チップ抵抗器の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 097, no. 001 31 January 1997 (1997-01-31) *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10122468C1 (de) * 2001-05-09 2003-03-20 Heusler Isabellenhuette Elektrischer Widerstand und Verfahren zu seiner Herstellung
DE10139323C1 (de) * 2001-08-10 2002-12-05 Heusler Isabellenhuette Niederohmiger elektrischer Widerstand und Verfahren zur Herstellung solcher Widerstände
DE10338041B3 (de) * 2003-08-19 2005-02-24 Isabellenhütte Heusler GmbH KG Elektrischer Widerstand und Verfahren zum Herstellen von Widerständen
WO2008055582A1 (fr) * 2006-12-20 2008-05-15 Isabellenhütte Heusler Gmbh & Co. Kg Résistance, notamment résistance smd et procédé de production associé
US8013713B2 (en) 2006-12-20 2011-09-06 Isabellenhutte Heusler Gmbh & Co. Kg Resistor, particularly SMD resistor, and associated production method
US9620267B2 (en) 2013-04-18 2017-04-11 Panasonic Intellectual Property Management Co., Ltd. Resistor and manufacturing method for same
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10418157B2 (en) 2015-10-30 2019-09-17 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
EP3514806A1 (fr) * 2018-01-23 2019-07-24 BIOTRONIK SE & Co. KG Résistance électrique, en particulier pour implants médicaux
CN110070969A (zh) * 2018-01-23 2019-07-30 百多力两合公司 尤其用于医用植入体的电阻
US10964459B2 (en) 2018-01-23 2021-03-30 Biotronik Se & Co. Kg Electrical resistor, in particular for medical implants
CN110070969B (zh) * 2018-01-23 2022-12-06 百多力两合公司 尤其用于医用植入体的电阻
WO2022252657A1 (fr) * 2021-06-04 2022-12-08 深圳市卓力能技术有限公司 Ensemble élément chauffant, procédé de préparation d'élément chauffant, et atomiseur

Also Published As

Publication number Publication date
EP0841668B1 (fr) 2007-01-10
DE59712796D1 (de) 2007-02-22
DE19646441A1 (de) 1998-05-14
JPH10149901A (ja) 1998-06-02

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