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EP0834956B1 - Verfahren und Stuktur zur Kontaktierung umhüllter Drähte - Google Patents

Verfahren und Stuktur zur Kontaktierung umhüllter Drähte Download PDF

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Publication number
EP0834956B1
EP0834956B1 EP19970117001 EP97117001A EP0834956B1 EP 0834956 B1 EP0834956 B1 EP 0834956B1 EP 19970117001 EP19970117001 EP 19970117001 EP 97117001 A EP97117001 A EP 97117001A EP 0834956 B1 EP0834956 B1 EP 0834956B1
Authority
EP
European Patent Office
Prior art keywords
covered
portions
resin chips
wires
covered wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19970117001
Other languages
English (en)
French (fr)
Other versions
EP0834956A3 (de
EP0834956A2 (de
Inventor
Tetsuro c/o Yazaki Parts Co. Ltd. Ide
Nobuyuki. Yazaki Parts Co. Ltd. Asakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP26092896A external-priority patent/JP3311604B2/ja
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of EP0834956A2 publication Critical patent/EP0834956A2/de
Publication of EP0834956A3 publication Critical patent/EP0834956A3/de
Application granted granted Critical
Publication of EP0834956B1 publication Critical patent/EP0834956B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding

Definitions

  • This invention relates to a method of connecting covered wires with each other or connecting a covered wire to another members and a covered wire structure.
  • the anvil includes a base stand and a support portion projecting from the base stand.
  • the support portion is designed in a substantially cylindrical shape.
  • the support portion has a bore portion which is opened at the opposite side to the base stand side.
  • Two pairs of grooves are formed on the peripheral wall of the support portion so as to cross with each other substantially at the center of the bore portion.
  • the four grooves are formed so as to open on the same side as the bore portion, extending along the projection direction of the support portion and intercommunicate with one another through the bore portion.
  • the pair of resin chips are designed in a disc shape having a slightly smaller outer diameter than the diameter of the bore portion of the anvil. Furthermore, an end face of a head portion of the horn is designed in a disc shape having an outer diameter which is substantially equal to or slightly smaller than that of the resin chips.
  • the respective resin chips have solder as soldering material.
  • the solder 15 is embedded substantially in the center of the bottom/top surface such that a circular top face thereof is flush with the bottom/top surface (melting surface) of the upper and lower resin chips.
  • both of the covered wires are overlapped with each other at the connection portion thereof and the overlapped connection portions are pinched through a solder by the pair of resin chips from the upper and lower sides of the connection portions.
  • one of the resin chips (the resin chip at the lower side) is inserted into the bore portion of the anvil such that the melting surface thereof is directed upward.
  • one covered wire is inserted into the pair of confronting grooves from the upper side of the inserted resin chip.
  • the other covered wire is inserted into the other pair of the confronting grooves.
  • the other (upper side) resin chip is inserted such that the melting surface is directed downward.
  • the covered wires are arranged in the bore portion so that the respective connection portions thereof cross each other at the center of the bore portion. Through this arrangement, the connection portions of the covered wires are pinched substantially at the center of the melting surfaces of the upper and lower resin chips respectively in the overlapping direction.
  • the cover portions at the connection portions of the covered wires are melted so as to be dispersed by ultrasonic vibration. Furthermore, the conductive wire portions (core) of the covered wires are conductively contacted with each other at the connection portion by pressing the covered wires from the outside of the resin chips. Thereafter, the pair of the resin chips are mutually melt-fixed at the melting surfaces to seal the connection portion.
  • the head portion of the horn is inserted into the bore portion from the upper side bore portion from the upper side of the finally-inserted upper (other) resin chip and placed on the upper resin chip to excite and press the connection portions of the covered wires from the outside of the upper and lower resin chips between the horn and the anvil.
  • the cover portions are first melted and the conductive wire portions of the covered wires are exposed at the connection portion between the resin chips.
  • the melted cover portions are extruded from the center side of the resin chips toward the outside thereof because the connection portions are pressed from the upper and lower sides, so that the conductive wire portions are more excellently exposed and surely conductively contacted with each other.
  • the direction of the excitation of the connection portions is set to be coincident with the overlapping direction of the covered wires, so that the action of extruding the melted cover portions from the center side of the resin chips to the outside thereof is promoted.
  • the resin chips are melted and the confronting melting surfaces of the resin chips are melt-fixed to each other.
  • the outer peripheral surface portions of the cover portions which are adjacent to the conductively contacted conductive wire portions and the resin chips are melt-fixed. With this operation, the outer peripheral portions of the conductively-contacted conductive wire portions are kept to be coated with the resin chips.
  • the solder provided in the resin chips is melted by heat generated when the resin chips are melted. Consequently the conductive wire portions of the conductively contacted covered wires are soldered at the connection portions in the resin chips. As a result, a higher electric performance can be obtained at the connection portions thereby further stabilizing the conductive characteristic.
  • solder in this connection structure, solder must be melted accurately at the same timing in a series connecting process as when the cover portion is melted such that the conductive wire portion is exposed and contacted with each other. Thus, the solder needs to be buried inside of the resin chips without being exposed from melting surfaces of resin chips respectively.
  • a special treatment for sealing opening portions for the burying with resin material is needed after the solder is buried in the resin chips. Thus, increase in cost of the resin chips cannot be avoided.
  • solder needs to contain a mixture of chemical active substance (flux) for improving leaking characteristic for core wires composing the conductive wire portion.
  • fluorescent chemical active substance
  • this kind of flux needs to be contained in the resin chips.
  • an object of the present invention is to provide a method of connecting a covered wire and a connection structure in which covered wires can be conductively connected with each other at cheap price and easily and a connection state with excellent electric characteristic can be obtained stably.
  • the covered wires are overlapped with each other at the connection portions (overlapping portion) and the overlapped connection portions are pinched by a pair of the resin chips. Then, the cover portions are melted and dispersed by ultrasonic excitation and further pressed from outside of the resin chips.
  • the covered wires can be conductively contacted with each other with the connection portions in sealing condition.
  • the pair of the resin chips are melt-fixed to each other so as to seal the connection portions. With melted and hardened resin chips, a high mechanical strength can be obtained at the connection portions.
  • the crossing angle of the covered wires is set to not less than 45° to not greater than 135° in which a pressure applied from the resin chips acts on the covered wires substantially equally without losing balance so that the core wires are excellently loosened and the loosened core wires are gradually spread to flat shape.
  • the conductive wire portions of both the covered wires are in contact with each other at plural positions, so that connecting state having excellent electric characteristic and with low contact resistance can be obtained. That is, the crossing angle of the covered wires is set to not less than 45° to not greater than 135° in which a pressure applied from resin chips acts on covered wires substantially equally without losing balance so that the core wires are excellently loosened and the loosened core wires are gradually spread to flat shape.
  • the conductive wire portions of both the covered wires are in contact with each other at plural positions.
  • At least one of the resin chips contains wire supporting portions for restricting the crossing angle of the two covered wires at the overlapping portion at a desired angle.
  • At least one of the resin chips may be made of a transparent material.
  • the spreading of the core wires on the connection portions can be visually checked.
  • simplification of quality inspection can be achieved.
  • a covered wire connection structure may comprise a protective case for covering the overlapping portion of the two wires as well as neighboring portions thereof.
  • the protective case may contain a case body and lid body, one side of the case body may be open, the lid body may be to close an opening portion of the case body, the resin chips may be formed in the case body and the lid body such that they are integral therewith respectively, and at least one of the case body and the lid body may contain protruding portions for restricting the crossing angle of the two wires at the overlapping portion at a desired angle.
  • the pair of the resin chips are melt-fixed to each other to seal the connection portions with their conductive connecting state and at the same time, the case body is connected with the lid body.
  • the connection portions and the neighboring portions are covered with protective cases. That is, by melt-fixing the pair of the resin chips to each other, the connection portions of two covered wires are sealed and at the same time, the case body is connected with the lid body in the protective case.
  • the protective case protection of the connection portions and the neighboring portions can be achieved.
  • the two covered wires can be maintained at a desired crossing angle because they are caught at the time of ultrasonic excitation.
  • the connection portions are kept to be conductively contacted with each other while crossing at the desired crossing angle.
  • a stabilized electrical performance can be exerted.
  • the protruding portions may be formed so as to have both side walls, the two covered wires may be in contact with and curved by the walls so as to cross each other at the desired crossing angle, and the protruding potions may be arranged so as to oppose each other adjacent to the resin chips.
  • connection portions of the two covered wires are arranged so as to cross each other at the desired angle on the resin chip between the protruding portions disposed so as to oppose each other. Because the protruding portions are disposed adjacent to the resin chips, the width of the protruding portion (width between both the side walls) necessary for obtaining a desired crossing angle can be set to a small value so that the protruding portions can be designed in compact fashion. Further, a distance between the opposing protruding portions is reduced, so that the crossing state of the connection portions can be maintained stably.
  • At least one of the case body and the lid body may contain wire introducing portions for introducing the two covered wires from the protective case in parallel.
  • the two covered wires in which the connection portions are crossed at the desired crossing angle can be introduced in parallel through the wire introducing portions from the protective case.
  • a covered wire connection structure which can be realized preferably as a wire harness.
  • the case body and the lid body may be formed integrally with each other through a hinge portion.
  • the lid body by turning the lid body through the hinge portion, the lid body can be set to the opening portion of the case body easily. Further, by this setting, the pair of the resin chips formed on the case body and the lid body each are arranged such that their melting surfaces oppose each other. That is, because the case body and the lid body are molded integrally through the hinge portion, management of parts is facilitated. Further, by only turning the lid body through the hinge portion, the lid body can be set to the opening portion of the case body Thus, positioning of respective parts is not necessary thus simplifying assembly work.
  • Fig. 1 is a perspective view showing a covered wire connection structure according to the instant embodiment.
  • Fig. 2 is an enlarged plan view of the connection portion of Fig. 1.
  • Figs. 3-5 are side sectional views showing schematically a state of a resin chip currently under pressing and excitation.
  • Figs. 3A and 3B show a state just after the connection is started,
  • Fig. 4A and 4B show a state during connection and
  • Figs. 5A and 5B show a state after the connection is completed.
  • Fig. 5A of the respective Figures indicates a state enlarged about nine times and Fig. 5B thereof indicates a state enlarged about thirty times.
  • Figs. 6A, 6B and 7 are side sectional views showing schematically a state of resin chip for reference.
  • Figs. 6A, 6B and 7 are side sectional views showing schematically a state of resin chip for reference.
  • Figs. 6A, 6B and 7 are side sectional views showing schematically
  • FIG. 6A and 6B show a state just after the connection is started and Fig. 7 indicates a state after the connection is completed.
  • Fig. 6A indicates a state enlarged about nine times and Fig. 6B indicates a state enlarged about thirty times.
  • Fig. 8 is a diagram showing a relation between crossing angle and contacting resistance.
  • two covered wires W1, W2 each of which comprises a conductive wire portion 1 and a cover portion 3 which is formed of resin and coated around the outer periphery of the conductive wire portion, are conductively connected to each other at connection portions (overlapping portion) S thereof as shown in Fig. 1.
  • the respective conductive wire portions 1 of the covered wires W1, W2 are each composed of seven core wires (see Fig. 2).
  • a pair of resin chips 13, 15 which are resin materials 11, a horn for producing ultrasonic vibration (not shown) and an anvil (not shown) for supporting the covered wires W1, W2 and the resin chips 13, 15 at the time of the connection are utilized.
  • the anvil has a bore portion which is open upward and has a circular cross section and two pairs of groove portions which confront each other with respect to substantially the center of the bore portion for containing the covered wires W1, W2. These four groove portions are open on the same side as the bore portion and the mutually facing groove portions intercommunicates with each other through the bore portion.
  • a crossing angle of lines connecting the mutually facing groove portions is the crossing angle ⁇ in which the covered wires W1, W2 are conductively connected with each other. That angle is set to not less than 45° to not greater than 135° (90° in the instant embodiment). Meanwhile, because the structures of the horn and the anvil are substantially the same as conventional, a detailed description thereof is omitted.
  • the pair of the resin chips 13, 15 are formed in a circular shape having a slightly smaller than the bore of the anvil and contains no soldering material unlike conventional case.
  • the resin chips 13, 15 are made of acrylic resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, PC (polycarbonate) resin, PVC (polyvinyl chloride) resin, PE (polyethylene) resin, PEI (polyetherimide), PBT (polybuthylene terephtalate) or the like. Generally, the material is harder than vinyl chloride for use in the cover portion 3.
  • the applicability can be recognized in all the resins in term of the conductivity and conductivity stability and if judging from appearance and insulation performance as well, particularly PEI resins and PBT resins are suitable.
  • the respective resin chips 13, 15 have melting surfaces 13a, 15a (see Figs. 3-5) which are contacted with each other when the resin chips 13, 15 are overlapped with each other vertically in the bore portion of the anvil and the connection portions S in which two covered wires W1, W2 cross each other are located in the center of the melting surfaces 13a, 15a.
  • the covered wires W1, W2 are overlapped with each other at the connection portions S and the overlapped connection portions S are pinched vertically by a pair of the resin chips 13, 15.
  • one resin chip 15 is inserted into the bore portion of the anvil so that its melting surface 15a is directed upward and one covered wire W1 is inserted into confronting groove portions of one pair such that it is located over the resin chip 15.
  • the other covered wire W2 is inserted into the other confronting groove portion.
  • the other (upper) resin chip 13 is inserted with its melting surface 13a directed downward. Both the covered wires W1, W2 are arranged such that the respective connection portions S cross each other in the center of the bore portion.
  • connection portions S are pinched in the center of the melting surfaces 13a, 15a of the upper and lower resin chips 13, 15 vertically in the overlapping direction.
  • the crossing angle ⁇ between the cored wires W1 and W2 is limited to substantially 90° which is a crossing angle of the confronting groove portions.
  • the cover portions 3 at the connection portions S of the covered wires are melted so as to be dispersed by ultrasonic vibration. Furthermore, the conductive wire portions (core) of the covered wires W1, W2 are conductively contacted with each other at the connection portion S by pressing the covered wires from the outside of the resin chips 13, 15. Thereafter, the pair of the resin chips 13, 15 are mutually melted at the melting surfaces 13a, 15a to seal the connection portion S (see Figs. 3-5).
  • connection portion S is performed by pressing the horn toward the anvil, and the press direction is coincident with the overlapping direction of the covered wires.
  • the excitation is preferably performed in a direction which substantially perpendicularly intersects to the connection surface of the resin materials 11 because it provides the most excellent melt-fixing state. Therefore, the direction of the excitation of the connection portion S is set to a direction which crosses the confronting surfaces 13a, 15a of the resin chips 13, 15, that is, it is set to be coincident with the overlapping direction of the covered wires W1, W2. With this arrangement, longitudinal vibration is produced from the horn.
  • connection portions S When the connection portions S are pressed and excited in the above state, the cover portions 3 are first melted and the conductive wire portions 1 of the covered wires W1, W2 are exposed at the connection portion S between the resin chips 13 and 15. At this time, the melted cover portions 3 are extruded from the center side of the resin chips 13, 15 toward the outside thereof because the connection portions S are pressed from the upper and lower sides, so that the conductive wire portions 1 are more excellently exposed and surely conductively contacted with each other.
  • the direction of the excitation of the connection portions S is set to be coincident with the overlapping direction of the covered wires W1, W2, so that the action of extruding the melted cover portions 3 from the center side of the resin chips 13, 14 to the outside thereof is promoted.
  • connection portions S are continued after the cover portions 3 are melted, the resin chips 13, 15 are melted such that the melting surfaces 13a, 15a of both the resin chips 13, 15 are melt-fixed to each other.
  • Outer peripheral faces of the cover portions 3 adjacent to the conductive wire portions 1 which are conductively contacted with each other are melt-fixed to the resin chips 13, 15. Consequently, the outer peripheral faces of the conductive wire portions 1 conductively contacted are covered with the melted resin chips 13, 15 (see Fig. 1).
  • the crossing angle ⁇ between the covered wires W1 and W2 is set to 90°, a force from the resin chips 13, 15 is applied to the covered wires W1, W2 (core wires of the conductive wire portion 1) substantially equally with keeping a balance when the connection portions S are pressed and excited.
  • the core wires are loosened and the loosened core wires are spread gradually so that they become flat (see Figs. 3-5). Consequently, the conductive wire portions 1 of both the covered wires W1, W2 are contacted with each other at plural positions (see Fig. 2).
  • the crossing angle ⁇ is changed in a range between 90° and 30°, it is 0% in a range between 90° and 60° and it is as low as 11% when the crossing angle is 45°. However, it is recognized that the percentage is as high as 89% when the crossing angle is 30°.
  • the crossing angle ⁇ is small (about 30°), as shown in Figs. 6, 7, the core wires of the upper covered wire W2 enter in between the core wires of the lower covered wire W1 easily so that a force applied from the resin chips 13, 15 acts with lost balance.
  • the crossing angle ⁇ is large (90°), as shown in Figs. 3-5, the core wires of the upper covered wires W2 are unlikely to enter in between the core wires of the lower covered wires W1. This is because a force applied from the resin chips 13, 15 act equally with keeping balance.
  • the contact resistance is less than 5m ⁇ , when the crossing angle ⁇ is 90°-45°. If the crossing angle becomes smaller than 45°, the contact resistance rises largely and when 30°, the contact resistance exceeds 5m ⁇ .
  • a range of the crossing angle ⁇ in which stable conductive contacting can be obtained with a low contact resistance is preferably 90° ⁇ 45° (45° - 134°). Particularly 90° is the most appropriate.
  • connection method of the instant embodiment by pressing the resin chips 13, 15 from outside so as to melt and disperse the cover portion 3 with the covered wires W1, W2 overlapped at the connection portions S and the connection portions S pinched by a pair of the resin chips 13, 15, the covered wires W1, W2 can be conductively connected with each other at the connection portions S.
  • the covered wires W1, W2 it is not necessary to remove the cover portion 3 and obtain conductive connection by a simple operation.
  • connection method and the connection structure obtained thereby after the covered wires W1, W2 are conductively connected with each other at the connection portions S, the upper and lower resin chips 13, 15 are melt-fixed to each other to seal the connection portions S.
  • the melted and hardened resin chips 13, 15 a high mechanical strength can be obtained at the connection portions S.
  • connection portions S have only to have a dimension capable of pinching the connection portions S to be conductively contacted from up and down, area necessary for the connection can be restricted to a small area. Further, because the connection portions S are sealed by the resin chips 13, 15, it is possible to ensure a sufficient insulation.
  • connection portions S can be stabilized.
  • the covered wires W1, W2 are pinched by the pair of the resin chips 13, 15 in the overlapping direction thereof and the connection portions S are pressed and excited between the horn and the anvil from the outside of the resin chips 13, 15 and the direction of the pressing is set to the same as the direction in which the covered wires W1,W2 are overlapped with each other.
  • the connection portion S is pressed, the melted cover portions 3 are extruded out from the center portion of the resin chips 13, 15 toward outside so that the conductive wire portions 1 are exposed excellently thereby obtaining a secure conductive contacting state.
  • connection portion S is set to the same as the direction in which the covered wires W1, W2 are overlapped with each other like the pressing direction, it is possible to obtain excellent melting condition of the resin chips 13, 15 and enhance an action of pushing out the cover portions 3.
  • the crossing angle ⁇ between the covered wires W1 and W2 is set to be not less than 45° to not greater than 135° in which a pressure applied from the resin chips 13, 15 acts substantially equally on the core wires without losing balance so that they are excellently loosened, the conductive wire portions 1 of the covered wires W1, W2 are contacted with each other at plural positions. Consequently, a stable connecting state with an excellent electric characteristic can be obtained.
  • the crossing angle ⁇ is set to 90° in which the core wires can be loosened most excellently. Thus, it is possible to achieve improvement of electric characteristic and stabilization thereof.
  • connection portions S it is not necessary to make special treatment for the pair of the resin chips 13, 15 such as embedding of solder unlike conventional case. Thus, they can be structured in a cheap construction. Further, different from a case in which solder is provided, no flux is produced at the connection portions S, so that reliability of electric connection performance is not reduced.
  • the resin chips 13, 15 by making at least one of the resin chips 13, 15 with a transparent material, it is possible to visually check the spreading of the core wires on the connection portions S. Thus, the conductive connecting state between the covered wires W1 and W2 can be visually recognized thereby simplifying quality inspection.
  • the resin chips 13, 15 having a relatively low viscosity at the time of melting. Then, when melting the resin chips 13, 15 so as to surround the connection portion S, the melted resin chips 13, 15 may be filled in gaps between plural core wires composing the conductive wire portion 1 in the neighboring conductive wire portions 1 excluding the connection portion S to fill gaps formed between the cover portions of the covered wires W1,W2 and the core wires or gaps formed between the core wires with resin material 11 thereby obtaining an effect of sealing against water inside of the covered wires W1, W2.
  • Fig. 9 is a perspective view showing a covered wire connection structure according to the instant embodiment.
  • Fig. 10 is a sectional view taken along the lines X-X.
  • the same components as the aforementioned first embodiment are provided with the same reference numerals and a description thereof is omitted.
  • the lower resin chip 45 is provided with wire containing grooves 53 which are wire supporting members for restricting the crossing angle ⁇ at the connection portions S between the two covered wires W1 and W2 to a desired angle.
  • the lower resin chip 45 comprises a chip body 47 which is of substantially cylindrical shape and in which a top surface thereof is a melting surface 47a, a circumferential portion 51 formed around the chip body 47 in a doughnut shape and a groove portion 49 formed between the chip body 47 and the circumferential portion 51 which is open upward and in a donut configuration.
  • the circumferential portion 51 has two pairs of wire containing grooves 53 (four positions) which confront with each other with respect to the center of the melting surface 47a and are open upward.
  • the crossing angle of a line connecting the mutually facing wire containing grooves 53 is the crossing angle ⁇ used when conductively connecting the covered wires W1 and W2.
  • That angle is set to be not less than 45° to not greater than 135° (90° in the instant embodiment) like the first embodiment.
  • the melting surface 47a of the chip body 47 is formed at a position (height) deviated upward or downward from a bottom of the wire containing groove 53. If the covered wires W1, W2 are set in the mutually confronting wire containing grooves 53 and pressed, the covered wires W1, W2 are bent at peripheral portions of the chip body 47 and the groove portion 49 and then contained in the wire containing grooves 53 such that they are temporarily held. Both the covered wires W1, W2 cross each other at a desired crossing angle ⁇ substantially in the center of the lower melting surface 47a.
  • the upper resin chip 43 is formed in a circular shape so that a bottom face thereof is a melting surface 43a like the first embodiment.
  • the upper and lower melting surfaces 43a, 47a are of substantially the same shape and dimension.
  • only the lower resin chip 45 is provided with the wire containing grooves 53, it is possible to provide both the upper and lower resin chips 43, 45 with such wire containing grooves 53 or provide only the upper resin chip 43 with the wire containing grooves.
  • the crossing angle ⁇ at any desired angle by means of the wire containing grooves 53 provided in the lower resin chip 45 without providing additional groove portions for restricting the crossing angle ⁇ in the anvil like the first embodiment.
  • the resin chips 43, 45 by making at least one of the resin chips 43, 45 with a transparent material, it is possible to visually check the conductive connecting state between the covered wires W1 and W2 to some extent, and it is possible to ensure waterproofing effect within the covered wires W1, W2 by filling gaps between neighboring core wires excluding the connection portions S with melted resin chips 43, 45 when the resin chips 43, 45 are melt-fixed to each other with the connection portions S set therebetween.
  • Fig. 11A is a perspective view of a free state of a protective case for use in the instant embodiment.
  • Fig. 11B is a perspective view of an appearance of major parts after two covered wires are connected according to the instant embodiment.
  • Fig. 12 is a plan view showing a conductive contacting state of the core wires of two covered wires according to the instant embodiment.
  • the instant embodiment of the present invention is constructed mainly of a pair of the resin chips 13, 15 and a protective case 60 having a protruding portion 64 for restricting the crossing angle of two covered wires W1, W2 to a desired angle.
  • the protective case 60 comprises a case body 61 in which a wire containing portion 61a for two covered wires W1, W2 is formed so as to open to one side and a lid body 62 formed in a plate shape having a thick portion 62a for closing an opening portion of the wire containing portion 61a.
  • one resin chip 13 is formed so as to protrude substantially in the center of an inside surface (side located inside of the case 60 when closed) of a thick portion 62a of the lid body 62 integrally with the lid body 62.
  • the other resin chip 15 is formed so as to protrude substantially in the center of a bottom of the wire containing portion 61 integrally with the wire containing portion 61.
  • the resin chips 13, 15 have melting surfaces 13a, 15a respectively which are protruded therefrom.
  • the resin chips 13, 15 are constructed so that the respective melting surfaces 13a, 15a face each other when the lid body 62 is closed.
  • the protruding portions 64 are formed in the wire containing portion 61a of the case body 61 in one pair. That is, the pair of the protruding portions 64, 64 are formed to have both side walls 64a, 64a with which two covered wires W1, W2 are in contact so as to be bent at a desired crossing angle, and allocated adjacent to the resin chip 15 so as to oppose each other. At this protruding portion 64, the crossing angle may be controlled by a distance between the side walls 64a and 64a, that is, a width of the protruding portion 64. This protruding portion 64 is formed with such a width to obtain a desired crossing angle.
  • the protruding portion 64 is protruded over the melting surface 15a of the resin chip 15 and lower than a depth of the wire containing portion 61. Both the side walls 64a, 64a of this protruding portion have the aforementioned function.
  • wire introducing portions 65 for introducing two covered wires W1, W2 from the protective case 60 in parallel are formed.
  • the wire introducing portions 65 are formed by cutting in a U-shaped groove form both ends of the wire containing portion 61a in which the pair of the protruding portions 64, 64 are located, such that they are opened in the same direction as that of the wire containing portion 61a and go through those ends.
  • Two wire introducing portions 65 are provided on each of both the ends of the wire containing portion 61a.
  • square pillar pressing portions 66 which enter into the wire introducing portions 65 for pressing the covered wire W1(W2) when the lid body 62 is closed are formed on both sides of the thick portion 62a of the lid body 62.
  • the case body 61 and the lid body 62 are formed integrally with a hinge portion 63.
  • two covered wires W1, W2 are set in the case body 61. That is, the respective covered wires W1, W2 are placed such that their connection portions S cross each other substantially in the center of the melting surface 15a of the resin chip 15 and both sides of the connection portion S are curved along both the side walls 64a of the protruding portions 64 and engaged in the corresponding wire introducing portions 65.
  • the respective connection portions S of two covered wires W1 and W2 are caught by the pair of the protruding portions 64, 64 such that they intersect each other at a desired crossing angle.
  • the lid body 62 is turned via the hinge portion 63 and the pressing portions 66 are engaged into the wire introducing portions 65. Then, the wire containing portion 61a of the case body 61 is closed with the lid body 62. In this closing state, the connection portions S are pinched by the melting surfaces 13a, 15a of the resin chips 13, 15 in the center thereof vertically in a direction of overlapping the resin chips 13, 15.
  • the same covered wire connection structure as in the first embodiment can be obtained by ultrasonic excitation using the horn as in the first embodiment.
  • this connection structure as shown in Fig. 11B, the two covered wires W1, W2 are introduced in parallel from both ends of the protective case 60 in such a state in which both sections of the covered wires adjacent to the connection portions S are pressed by the pressing portions 66 and engaged in the wire introducing portions 65.
  • connection portions S are sealed in a state in which they are conductively connected and the case body 61 is connected with the lid body. Consequently, the connection portions S and the neighboring portions are covered with the protective case 60 and protected against any external force.
  • connection portion S is in conductive connecting state so that the core wires 1 cross each other at a crossing angle ⁇ (substantially 90° in the instant embodiment) thereby exerting a stabilized electric performance.
  • a width of the protruding portion 64 necessary for obtaining a desired crossing angle at the connection portion S may be designed to be small. Consequently, it is possible to design the protective case 60 in a compact size. Further, a distance between the opposing protruding portions 64 and 64 is reduced such that the connection portion S located therebetween can be maintained stably at a desired crossing angle.
  • the two covered wires W1, W2 in which the connection portions S are intersected at a desired crossing angle are introduced in parallel through the wire introducing portions from the protective case 60.
  • this may be preferably applicable as wire harness.
  • the case body 61 and the lid body 62 are formed integrally with each other through the hinge portion 63.
  • management of the parts is facilitated and only by turning the lid body 62 via the hinge portion 63, it can be set to the open portion of the case body 61.
  • positioning of the parts is not necessary and the assembly work may be simplified.
  • the protruding portions 64 and the wire introducing portions 65 may be provided on the lid body 62. Further, the hinge portion 63 may be cut off after the lid body 62 is connected to the case body 61.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Cable Accessories (AREA)

Claims (7)

  1. Verfahren zum Verbinden ummantelter Leitungen mit folgenden Schritten:
    Überlagern zweier ummantelter Leitungen (W1, W2), die jeweils einen leitenden Leitungsabschnitt (1) aufweisen, der aus mehreren Kernleitungen besteht, und einen Mantelabschnitt (3), der einen Außenumfang des leitenden Leitungsabschnitts (1) abdeckt, Einklemmen eines Überlappungsabschnitts (S) der ummantelten Leitungen (W1, W2) zwischen zwei Harzstücken (43, 45), Druckbeaufschlagen und Erregen des durch die Harzstücke (43, 45) eingeklemmten Überlappungsabschnitts (S) unter Verwendung einer Ultraschallschwingungsschweißeinrichtung, um den Mantelabschnitt (3) zu schmelzen und zu entfernen, um so den leitfähigen Leitungsabschnitt (1) frei zu legen, und elektrisch leitend die leitenden Leitungsabschnitte (1) der ummantelten Leitungen (W1, W2) an dem Überlappungsabschnitt (S) zu verbinden, und die beiden Harzstücke (43, 45) durch Schmelzen zu befestigen, um den verbundenen Überlappungsabschnitt (S) der ummantelten Leitungen (W1, W2) durch die geschmolzenen Harzstücke (43, 45) abzudichten;
    dadurch gekennzeichnet, dass
    zumindest eines der Harzstücke (43, 45) mit Leitungshalterungsabschnitten (53) versehen ist, um den Kreuzungswinkel () der beiden ummantelten Leitungen (W1, W2) an dem Überlappungsabschnitt (S) auf einen gewünschten Winkel in dem Bereich von 45 ° bis 135 ° einzuschränken.
  2. Verbindungsanordnung für eine ummantelte Leitung, welche zwei sich überlappende ummantelte Leitungen (W1, W2) aufweist, die jeweils einen leitenden Leitungsabschnitt (1), der aus mehreren Kernleitungen besteht, und einen Matelabschnitt (3) aufweisen, der einen Außenumfang des leitenden Leitungsabschnitts (1) abdeckt, wobei ein Überlappungsabschnitt (S) der ummantelten Leitungen (W1, W2) zwischen zwei Harzstücken (43, 45) eingeklemmt ist, die leitenden Leitungsabschnitte (1) der ummantelten Leitungen (W1, W2) elektrisch an dem Überlappungsabschnitt (S) verbunden sind; die beiden Harzstücke (43, 45) den verbundenen Überlappungsabschnitt (S) der ummantelten Leitungen, nachdem sie durch Ultraschallschwingungsschweißen durch Schmelzen befestigt wurden, abdichten;
    dadurch gekennzeichnet, dass
    zumindest eines der Harzstücke (43, 45) Leitungshalterungsabschnitte (53) aufweist, um den Kreuzungswinkel () der beiden ummantelten Leitungen (W1, W2) an dem Überlappungsabschnitt (S) auf einen gewünschten Winkel in dem Bereich von 45 ° bis 135 ° einzuschränken.
  3. Verbindungsanordnung für eine ummantelte Leitung nach Anspruch 2, dadurch gekennzeichnet, dass
    zumindest eines der Harzstücke (43, 45) aus einem transparenten Material besteht.
  4. Verbindungsanordnung für eine ummantelte Leitung nach Anspruch 2, dadurch gekennzeichnet, dass
    die Verbindungsanordnung für eine ummantelte Leitung ein Schutzgehäuse (60) zum Abdecken des Überlappungsabschnitts der beiden Leitungen (W1, W2) und dessen benachbarter Abschnitte aufweist,
    das Schutzgehäuse (60) einen Gehäusekörper (61) und einen Deckelkörper (62) aufweist,
    eine Seite des Gehäusekörpers (61) offen ist,
    der Deckelkörper (62) dazu dient, einen Öffnungsabschnitt des Gehäusekörpers (61) zu schließen,
    die Harzstücke (13, 15) in dem Gehäusekörper (61) und dem Deckelkörper (62) so ausgebildet sind, dass sie jeweils einstückig damit ausgebildet sind, und
    zumindest entweder der Gehäusekörper (61) oder der Deckelkörper (62) vorspringende Abschnitte (64) aufweist, um den Kreuzungswinkel () der beiden Leitungen (W1, W2) an dem Überlappungsabschnitt (S) auf den gewünschten Winkel einzuschränken.
  5. Verbindungsanordnung für eine ummantelte Leitung nach Anspruch 4, dadurch gekennzeichnet, dass
    die vorspringenden Abschnitte (64) so ausgebildet sind, dass sie zwei Seitenwände (64a) aufweisen,
    die beiden ummantelten Leitungen (W2, W2) in Berührung mit den Seitenwänden (64a) stehen und durch diese gekrümmt werden, so dass sie sich in dem gewünschten Kreuzungswinkel kreuzen,
    und die vorspringenden Abschnitte (64) so angeordnet sind, dass sie neben den Harzstücken einander gegenüberliegen.
  6. Verbindungsanordnung für eine ummantelte Leitung nach Anspruch 4, dadurch gekennzeichnet, dass
    zumindest entweder der Gehäusekörper (61) oder der Deckelkörper (62) Leitungseinführungsabschnitte (65) aufweist, um die beiden ummantelten Leitungen (W1, W2) von dem Schutzgehäuse (60) parallel zueinander einzuführen.
  7. Verbindungsanordnung für eine ummantelte Leitung nach Anspruch 4, dadurch gekennzeichnet, dass
    der Gehäusekörper (61) und der Deckelkörper (62) einstückig miteinander über einen Scharnierabschnitt (63) verbunden ausgebildet sind.
EP19970117001 1996-10-01 1997-09-30 Verfahren und Stuktur zur Kontaktierung umhüllter Drähte Expired - Lifetime EP0834956B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP260928/96 1996-10-01
JP26092896A JP3311604B2 (ja) 1996-06-04 1996-10-01 被覆電線の接合構造
JP26092896 1996-10-01

Publications (3)

Publication Number Publication Date
EP0834956A2 EP0834956A2 (de) 1998-04-08
EP0834956A3 EP0834956A3 (de) 1998-10-07
EP0834956B1 true EP0834956B1 (de) 2001-12-19

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KR (1) KR19980032460A (de)
CN (1) CN1067492C (de)
AU (1) AU702342B2 (de)
CA (1) CA2217146C (de)

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Publication number Priority date Publication date Assignee Title
JP3435051B2 (ja) * 1998-03-03 2003-08-11 矢崎総業株式会社 被覆電線の接続構造
JP3435050B2 (ja) * 1998-03-03 2003-08-11 矢崎総業株式会社 被覆電線の接続構造
JPH11273757A (ja) 1998-03-25 1999-10-08 Yazaki Corp 被覆電線の接続構造及び接続方法
JP3472699B2 (ja) 1998-03-25 2003-12-02 矢崎総業株式会社 被覆電線の接続方法
JP3683746B2 (ja) * 1999-06-23 2005-08-17 矢崎総業株式会社 被覆電線の接合方法、凹部付き樹脂チップ
JP4504529B2 (ja) * 2000-08-07 2010-07-14 矢崎総業株式会社 電線同士の接続方法
JP3971723B2 (ja) * 2003-07-10 2007-09-05 矢崎総業株式会社 シールド電線のシールド処理構造
DE102008050000A1 (de) * 2008-09-30 2010-04-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum gleichzeitigen mechanischen und elektrischen Verbinden von zwei Teilen
JP6839688B2 (ja) * 2018-09-18 2021-03-10 矢崎総業株式会社 端子付き接合電線

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Publication number Priority date Publication date Assignee Title
US2250156A (en) * 1939-06-02 1941-07-22 Bell Telephone Labor Inc Electrical connection
DE3537167C1 (de) * 1985-10-18 1990-05-10 Janisch Erich Kunststoffe Verfahren zur elektrisch isolierenden Umhuellung der Verbindungsstelle zwischen elektrisch leitenden Elementen,Vorrichtung zur Durchfuehrung dieses Verfahrens sowie Umhuellungsmaterial zur Verwendung bei diesem Verfahren
JP3110954B2 (ja) * 1994-04-01 2000-11-20 矢崎総業株式会社 被覆電線の接合方法及び被覆電線の接合構造
JP3323335B2 (ja) * 1994-04-01 2002-09-09 矢崎総業株式会社 被覆電線の防水方法及び被覆電線の防水構造

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Publication number Publication date
CA2217146C (en) 2000-05-23
KR19980032460A (ko) 1998-07-25
AU702342B2 (en) 1999-02-18
CA2217146A1 (en) 1998-04-01
CN1067492C (zh) 2001-06-20
EP0834956A3 (de) 1998-10-07
EP0834956A2 (de) 1998-04-08
AU3987297A (en) 1998-04-09
CN1182293A (zh) 1998-05-20

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