EP0833578A4 - Verbindungsklammer für kühlkörperventilator - Google Patents

Verbindungsklammer für kühlkörperventilator

Info

Publication number: EP0833578A4
Authority: EP; European Patent Office
Prior art keywords: heat sink; attachment clip; fan attachment; fan; clip
Prior art date: 1995-06-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP96917257A

Other languages

English (en)

French (fr)

Other versions

EP0833578A1 (de

EP0833578B1 (de

Inventor

Donald Clemens

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Thermalloy Inc

Original Assignee

Thermalloy Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-06-07

Filing date

1996-06-06

Publication date

1998-09-16

1996-06-06 Application filed by Thermalloy Inc filed Critical Thermalloy Inc

1998-04-08 Publication of EP0833578A1 publication Critical patent/EP0833578A1/de

1998-09-16 Publication of EP0833578A4 publication Critical patent/EP0833578A4/de

2002-08-21 Application granted granted Critical

2002-08-21 Publication of EP0833578B1 publication Critical patent/EP0833578B1/de

2016-06-06 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
- A44B99/00—Subject matter not provided for in other groups of this subclass
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
- Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

EP96917257A 1995-06-07 1996-06-06 Verbindungsklammer für kühlkörperventilator Expired - Lifetime EP0833578B1 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US482011		1995-06-07
US08/482,011 US5590025A (en)	1995-06-07	1995-06-07	Fan attachment clip for heat sink
PCT/US1996/009433 WO1996039889A1 (en)	1995-06-07	1996-06-06	Fan attachment clip for heat sink

Publications (3)

Publication Number	Publication Date
EP0833578A1 EP0833578A1 (de)	1998-04-08
EP0833578A4 true EP0833578A4 (de)	1998-09-16
EP0833578B1 EP0833578B1 (de)	2002-08-21

Family

ID=23914279

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP96917257A Expired - Lifetime EP0833578B1 (de)	1995-06-07	1996-06-06	Verbindungsklammer für kühlkörperventilator

Country Status (9)

Country	Link
US (1)	US5590025A (de)
EP (1)	EP0833578B1 (de)
JP (1)	JPH11507764A (de)
KR (1)	KR19990022518A (de)
CN (1)	CN1154420C (de)
DE (1)	DE69623121T2 (de)
HK (1)	HK1016038A1 (de)
MY (1)	MY112056A (de)
WO (1)	WO1996039889A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5677829A (en) *	1995-06-07	1997-10-14	Thermalloy, Inc.	Fan attachment clip for heat sink
US5709361A (en) *	1996-02-02	1998-01-20	Racal-Datacom, Inc.	Fan support member
US5664624A (en) *	1996-11-04	1997-09-09	Chin-Fu Tsai	Sloped wall type heat radiating member for chip
DE29822121U1 (de)	1997-12-24	1999-02-18	Papst-Motoren GmbH & Co. KG, 78112 St Georgen	Abdeckung für einen Lüfter
US6118659A (en) *	1998-03-09	2000-09-12	International Business Machines Corporation	Heat sink clamping spring additionally holding a ZIF socket locked
US6017185A (en) *	1998-08-13	2000-01-25	Chaun-Choung Industrial Corp.	Fan fixing structure of a radiator
DE19856955A1 (de) *	1998-12-10	2000-06-15	Ameur Raouf Ben	Gehäuse für einen Kühlkörper
US6160704A (en) *	1998-12-17	2000-12-12	Intelligent Motion Systems	Integral heat-sink and motor assembly for printed circuit boards
US6172871B1 (en) *	1999-03-31	2001-01-09	International Business Machines Corporation	Method and system in a data processing system for efficiently cooling a portable computer system
JP3791584B2 (ja) *	1999-12-28	2006-06-28	セイコーエプソン株式会社	面発光型半導体レーザおよび面発光型半導体レーザアレイ
TW505375U (en) *	2000-10-06	2002-10-01	Foxconn Prec Components Co Ltd	Heat dissipating device assembly
TW486043U (en) *	2000-11-16	2002-05-01	Delta Electronics Inc	Fast removable fan shield and mounting plate
TW491376U (en) *	2000-12-30	2002-06-11	Hon Hai Prec Ind Co Ltd	Heat sink
US6496371B2 (en)	2001-03-30	2002-12-17	Intel Corporation	Heat sink mounting method and apparatus
US6943986B2 (en) *	2002-05-17	2005-09-13	Hitachi Global Storage Technologies Netherlands B.V.	Clamp retention apparatus for rotational disk drive components
TW578946U (en) *	2002-06-06	2004-03-01	Hon Hai Prec Ind Co Ltd	A heat dissipation device
US6768641B2 (en) *	2002-06-28	2004-07-27	Hon Hai Precision Ind. Co., Ltd.	Heat dissipation assembly
TW564971U (en) *	2003-01-10	2003-12-01	Hon Hai Prec Ind Co Ltd	A heat dissipating assembly
TWI282392B (en) *	2005-08-04	2007-06-11	Delta Electronics Inc	Passive fan assembly
US20070274050A1 (en) *	2006-05-26	2007-11-29	Han-Ming Lee	Composite anti-disturbed flow heat sink
US7385825B2 (en) *	2006-10-09	2008-06-10	Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.	Heat dissipation device
US7826229B2 (en) *	2006-10-27	2010-11-02	Hewlett-Packard Development Company, L.P.	Component retention with distributed compression
US7672126B2 (en) *	2007-11-30	2010-03-02	Hong Fu Jin Precision Indsutry (Shenzhen) Co., Ltd.	Mounting apparatus for fan
US7639501B2 (en) *	2008-03-20	2009-12-29	Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.	Heat sink assembly having a clip
US8191613B2 (en) *	2009-02-16	2012-06-05	Asia Vital Components Co., Ltd.	Thermal module with quick assembling structure
CN101504689B (zh) *	2009-03-26	2010-04-21	北京航空航天大学	散热器优化参数确定方法
US7895843B1 (en)	2009-11-30	2011-03-01	Whirlpool Corporation	Refrigerator with one piece fan motor mount
CN102802378A (zh) *	2011-05-27	2012-11-28	鸿富锦精密工业（深圳）有限公司	散热装置及使用该散热装置的电子装置
CN202231000U (zh) *	2011-10-19	2012-05-23	中磊电子股份有限公司	以扣具固定的电子装置
CN102494551A (zh) *	2011-12-30	2012-06-13	三花丹佛斯（杭州）微通道换热器有限公司	用于换热器的支架和换热器组件
CN103365365A (zh) *	2012-03-28	2013-10-23	鸿富锦精密工业（深圳）有限公司	风扇固定装置
TW201422916A (zh) *	2012-12-14	2014-06-16	Hon Hai Prec Ind Co Ltd	導風罩及散熱裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5299632A (en) *	1993-02-19	1994-04-05	Lee Lien Jung	Fin device for an integrated circuit
US5309983A (en) *	1992-06-23	1994-05-10	Pcubid Computer Technology Inc.	Low profile integrated heat sink and fan assembly
US5522700A (en) *	1995-03-03	1996-06-04	Hong; Chen Fu-In	Fan device for integrated circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2204181B (en) *	1987-04-27	1990-03-21	Thermalloy Inc	Heat sink apparatus and method of manufacture
US5287249A (en) *	1993-07-07	1994-02-15	Global Win Technology Co., Ltd.	Fin assembly for an integrated circuit
US5386338A (en) *	1993-12-20	1995-01-31	Thermalloy, Inc.	Heat sink attachment assembly
US5421402A (en) *	1994-11-22	1995-06-06	Lin; Chuen-Sheng	Heat sink apparatus

1995
- 1995-06-07 US US08/482,011 patent/US5590025A/en not_active Expired - Lifetime
1996
- 1996-06-06 CN CNB961946466A patent/CN1154420C/zh not_active Expired - Fee Related
- 1996-06-06 EP EP96917257A patent/EP0833578B1/de not_active Expired - Lifetime
- 1996-06-06 DE DE69623121T patent/DE69623121T2/de not_active Expired - Fee Related
- 1996-06-06 KR KR1019970708999A patent/KR19990022518A/ko active IP Right Grant
- 1996-06-06 WO PCT/US1996/009433 patent/WO1996039889A1/en active IP Right Grant
- 1996-06-06 JP JP9501753A patent/JPH11507764A/ja active Pending
- 1996-06-07 MY MYPI96002299A patent/MY112056A/en unknown
1998
- 1998-11-24 HK HK98112258A patent/HK1016038A1/xx not_active IP Right Cessation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5309983A (en) *	1992-06-23	1994-05-10	Pcubid Computer Technology Inc.	Low profile integrated heat sink and fan assembly
US5309983B1 (en) *	1992-06-23	1997-02-04	Pcubid Computer Tech	Low profile integrated heat sink and fan assembly
US5299632A (en) *	1993-02-19	1994-04-05	Lee Lien Jung	Fin device for an integrated circuit
US5522700A (en) *	1995-03-03	1996-06-04	Hong; Chen Fu-In	Fan device for integrated circuit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9639889A1 *

Also Published As

Publication number	Publication date
EP0833578A1 (de)	1998-04-08
KR19990022518A (ko)	1999-03-25
CN1154420C (zh)	2004-06-23
DE69623121T2 (de)	2003-04-24
CN1187109A (zh)	1998-07-08
MY112056A (en)	2001-03-31
HK1016038A1 (en)	1999-10-29
JPH11507764A (ja)	1999-07-06
EP0833578B1 (de)	2002-08-21
DE69623121D1 (de)	2002-09-26
WO1996039889A1 (en)	1996-12-19
US5590025A (en)	1996-12-31

Publication	Publication Date	Title
EP0833578A4 (de)	1998-09-16	Verbindungsklammer für kühlkörperventilator
HK1019688A1 (en)	2000-02-18	Fan attachment clip for heat sink
GB9505069D0 (en)	1995-05-03	Heat sink
GB2325781B (en)	2001-03-07	Heat sink
GB2284937B (en)	1997-05-28	Heat sink attachment assembly
GB2309775B (en)	2000-08-23	Fan assisted heat sink device
EP0809779A4 (de)	1998-11-11	Wärmesenkeanordnungen
IL108860A0 (en)	1994-06-24	Heat sink
TW314223U (en)	1997-08-21	Cooling radiator
GB9918815D0 (en)	1999-10-13	Heat sink
GB2330901B (en)	2001-05-09	Heat dissipation device
GB2294286A8 (en)	1997-03-17	Heat sink mounting structure
PL336232A1 (en)	2000-06-19	Heat radiator
GB2323434B (en)	2000-09-20	Heat sink
SG72716A1 (en)	2000-05-23	Tape-on heat sink
AU3330695A (en)	1996-03-14	Heat sink
TW329948U (en)	1998-04-11	Heat dissipating device
GB2314920B (en)	2000-12-27	Heat dissipation device
GB9611381D0 (en)	1996-08-07	Heat sink with deformable hangers for mounting
TW390460U (en)	2000-05-11	Heat radiator
GB2286663B (en)	1997-09-10	Heat sink block
GB9722655D0 (en)	1997-12-24	Heat sink
GB9418245D0 (en)	1994-10-26	Heat sink
TW433718U (en)	2001-05-01	Sheet-assembled heat dissipation device
TW335189U (en)	1998-06-21	Fan for dissipating heat

Legal Events

Date	Code	Title	Description
1998-02-20	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1998-04-08	17P	Request for examination filed	Effective date: 19971215
1998-04-08	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): DE FR GB IT
1998-09-16	A4	Supplementary search report drawn up and despatched	Effective date: 19980728
1998-09-16	AK	Designated contracting states	Kind code of ref document: A4 Designated state(s): DE FR GB IT
2000-10-18	17Q	First examination report despatched	Effective date: 20000901
2001-07-18	GRAG	Despatch of communication of intention to grant	Free format text: ORIGINAL CODE: EPIDOS AGRA
2001-12-05	GRAG	Despatch of communication of intention to grant	Free format text: ORIGINAL CODE: EPIDOS AGRA
2001-12-05	GRAH	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOS IGRA
2002-03-21	GRAH	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOS IGRA
2002-07-05	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2002-08-21	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): DE FR GB IT
2002-08-21	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D
2002-09-26	REF	Corresponds to:	Ref document number: 69623121 Country of ref document: DE Date of ref document: 20020926
2003-02-28	ET	Fr: translation filed
2003-06-28	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2003-06-28	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2003-08-13	26N	No opposition filed	Effective date: 20030522
2006-05-30	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: FR Payment date: 20060530 Year of fee payment: 11
2006-06-30	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: IT Payment date: 20060630 Year of fee payment: 11
2008-04-25	REG	Reference to a national code	Ref country code: FR Ref legal event code: ST Effective date: 20080229
2008-09-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070702
2008-10-31	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20080522 Year of fee payment: 13
2008-12-31	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: GB Payment date: 20080523 Year of fee payment: 13
2009-09-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070606
2010-02-24	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20090606
2010-05-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20090606
2010-06-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20100101