EP0025694B1 - Bright nickel plating bath and process and composition therefor - Google Patents
Bright nickel plating bath and process and composition therefor Download PDFInfo
- Publication number
- EP0025694B1 EP0025694B1 EP80303183A EP80303183A EP0025694B1 EP 0025694 B1 EP0025694 B1 EP 0025694B1 EP 80303183 A EP80303183 A EP 80303183A EP 80303183 A EP80303183 A EP 80303183A EP 0025694 B1 EP0025694 B1 EP 0025694B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sulfonated
- nickel
- acetylenic compound
- compound
- per liter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 24
- 238000007747 plating Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000008569 process Effects 0.000 title claims description 10
- 239000000203 mixture Substances 0.000 title abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229940081974 saccharin Drugs 0.000 claims abstract description 13
- 235000019204 saccharin Nutrition 0.000 claims abstract description 13
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims abstract description 13
- 150000003839 salts Chemical class 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000002378 acidificating effect Effects 0.000 claims abstract description 5
- 150000001721 carbon Chemical group 0.000 claims abstract description 4
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims description 19
- 239000002659 electrodeposit Substances 0.000 claims description 6
- 150000002816 nickel compounds Chemical group 0.000 claims description 4
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 3
- OKIRJGABGVSQPK-UHFFFAOYSA-N but-1-yne-1-sulfonic acid Chemical compound CCC#CS(O)(=O)=O OKIRJGABGVSQPK-UHFFFAOYSA-N 0.000 claims description 3
- SLLLYZXUBOVDDR-UHFFFAOYSA-N but-2-yne-1-sulfonic acid Chemical compound CC#CCS(O)(=O)=O SLLLYZXUBOVDDR-UHFFFAOYSA-N 0.000 claims description 3
- FOJYSNPZWXIZOG-UHFFFAOYSA-N pent-1-yne-1-sulfonic acid Chemical compound CCCC#CS(O)(=O)=O FOJYSNPZWXIZOG-UHFFFAOYSA-N 0.000 claims description 3
- FYHLDUXIKXBAAT-UHFFFAOYSA-N prop-1-yne-1-sulfonic acid Chemical compound CC#CS(O)(=O)=O FYHLDUXIKXBAAT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- PMCYAZIDOVWKAH-UHFFFAOYSA-N but-2-yne-1,4-disulfonic acid Chemical compound OS(=O)(=O)CC#CCS(O)(=O)=O PMCYAZIDOVWKAH-UHFFFAOYSA-N 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 5
- 238000004070 electrodeposition Methods 0.000 abstract description 3
- 150000002500 ions Chemical class 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 9
- 239000011701 zinc Substances 0.000 description 9
- 239000012535 impurity Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000013019 agitation Methods 0.000 description 5
- -1 aromatic sulfonates Chemical class 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 4
- 239000002932 luster Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004512 die casting Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229960003237 betaine Drugs 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical class OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- 150000003456 sulfonamides Chemical class 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- RFRQQNJDUQXAAS-UHFFFAOYSA-M 1-(2,3-dichloroprop-2-enyl)pyridin-1-ium;chloride Chemical compound [Cl-].ClC=C(Cl)C[N+]1=CC=CC=C1 RFRQQNJDUQXAAS-UHFFFAOYSA-M 0.000 description 1
- FPNVDCLFXCGXLH-UHFFFAOYSA-N 1-chloro-3-[4-(3-chloro-2-hydroxypropoxy)but-2-ynoxy]propan-2-ol Chemical compound ClCC(O)COCC#CCOCC(O)CCl FPNVDCLFXCGXLH-UHFFFAOYSA-N 0.000 description 1
- PBYMYAJONQZORL-UHFFFAOYSA-N 1-methylisoquinoline Chemical compound C1=CC=C2C(C)=NC=CC2=C1 PBYMYAJONQZORL-UHFFFAOYSA-N 0.000 description 1
- LDCXMYWPEGQFTM-UHFFFAOYSA-N 1-prop-1-ynoxyethanesulfonic acid Chemical class C(#CC)OC(C)S(=O)(=O)O LDCXMYWPEGQFTM-UHFFFAOYSA-N 0.000 description 1
- KLCKMAMMLDRAQP-UHFFFAOYSA-M 1-prop-2-enylpyridin-1-ium;bromide Chemical compound [Br-].C=CC[N+]1=CC=CC=C1 KLCKMAMMLDRAQP-UHFFFAOYSA-M 0.000 description 1
- GZCWLCBFPRFLKL-UHFFFAOYSA-N 1-prop-2-ynoxypropan-2-ol Chemical compound CC(O)COCC#C GZCWLCBFPRFLKL-UHFFFAOYSA-N 0.000 description 1
- SPKKUSPQPHBCEZ-UHFFFAOYSA-M 2,4,6-trimethyl-1-prop-2-ynylpyridin-1-ium;bromide Chemical compound [Br-].CC1=CC(C)=[N+](CC#C)C(C)=C1 SPKKUSPQPHBCEZ-UHFFFAOYSA-M 0.000 description 1
- IXAWTPMDMPUGLV-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)but-2-ynoxy]ethanol Chemical compound OCCOCC#CCOCCO IXAWTPMDMPUGLV-UHFFFAOYSA-N 0.000 description 1
- GLVJUCAUVKPSTL-UHFFFAOYSA-N 2-[4-(2-sulfoethoxy)but-2-ynoxy]ethanesulfonic acid Chemical compound OS(=O)(=O)CCOCC#CCOCCS(O)(=O)=O GLVJUCAUVKPSTL-UHFFFAOYSA-N 0.000 description 1
- GDMJHPRLSACEJC-UHFFFAOYSA-M 2-methyl-1-prop-2-enylquinolin-1-ium;bromide Chemical compound [Br-].C1=CC=CC2=[N+](CC=C)C(C)=CC=C21 GDMJHPRLSACEJC-UHFFFAOYSA-M 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- SDNRDXMWFHGVBN-UHFFFAOYSA-N 2-prop-2-ynoxyethanesulfonic acid Chemical compound OS(=O)(=O)CCOCC#C SDNRDXMWFHGVBN-UHFFFAOYSA-N 0.000 description 1
- GHGCQQRMJCSIBQ-UHFFFAOYSA-N 2-prop-2-ynoxyethanol Chemical compound OCCOCC#C GHGCQQRMJCSIBQ-UHFFFAOYSA-N 0.000 description 1
- JHUFGBSGINLPOW-UHFFFAOYSA-N 3-chloro-4-(trifluoromethoxy)benzoyl cyanide Chemical compound FC(F)(F)OC1=CC=C(C(=O)C#N)C=C1Cl JHUFGBSGINLPOW-UHFFFAOYSA-N 0.000 description 1
- AXDJCCTWPBKUKL-UHFFFAOYSA-N 4-[(4-aminophenyl)-(4-imino-3-methylcyclohexa-2,5-dien-1-ylidene)methyl]aniline;hydron;chloride Chemical compound Cl.C1=CC(=N)C(C)=CC1=C(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 AXDJCCTWPBKUKL-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- YDPWVAMKZSUTGO-UHFFFAOYSA-N benzenesulfonamide;sodium Chemical compound [Na].NS(=O)(=O)C1=CC=CC=C1 YDPWVAMKZSUTGO-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 1
- CICQKHNSTQLPCW-UHFFFAOYSA-N dimethyl sulfate;2-methylquinoline Chemical compound COS(=O)(=O)OC.C1=CC=CC2=NC(C)=CC=C21 CICQKHNSTQLPCW-UHFFFAOYSA-N 0.000 description 1
- SMVRDGHCVNAOIN-UHFFFAOYSA-L disodium;1-dodecoxydodecane;sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O.CCCCCCCCCCCCOCCCCCCCCCCCC SMVRDGHCVNAOIN-UHFFFAOYSA-L 0.000 description 1
- YGSZNSDQUQYJCY-UHFFFAOYSA-L disodium;naphthalene-1,5-disulfonate Chemical compound [Na+].[Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1S([O-])(=O)=O YGSZNSDQUQYJCY-UHFFFAOYSA-L 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-N ethanesulfonic acid Chemical class CCS(O)(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- JZJXKEWVUBVOEH-UHFFFAOYSA-N n,n-diethylprop-2-yn-1-amine Chemical compound CCN(CC)CC#C JZJXKEWVUBVOEH-UHFFFAOYSA-N 0.000 description 1
- UPPLSUDJSIYVTG-UHFFFAOYSA-N n,n-dimethylbut-2-yn-1-amine Chemical compound CC#CCN(C)C UPPLSUDJSIYVTG-UHFFFAOYSA-N 0.000 description 1
- XOJYPYPTLZUHAG-UHFFFAOYSA-N n,n-dimethylpent-2-yn-1-amine Chemical compound CCC#CCN(C)C XOJYPYPTLZUHAG-UHFFFAOYSA-N 0.000 description 1
- OVQABVAKPIYHIG-UHFFFAOYSA-N n-(benzenesulfonyl)benzenesulfonamide Chemical compound C=1C=CC=CC=1S(=O)(=O)NS(=O)(=O)C1=CC=CC=C1 OVQABVAKPIYHIG-UHFFFAOYSA-N 0.000 description 1
- UNYWISZSMFIKJI-UHFFFAOYSA-N prop-2-ene-1-sulfonamide Chemical compound NS(=O)(=O)CC=C UNYWISZSMFIKJI-UHFFFAOYSA-N 0.000 description 1
- JKANAVGODYYCQF-UHFFFAOYSA-N prop-2-yn-1-amine Chemical compound NCC#C JKANAVGODYYCQF-UHFFFAOYSA-N 0.000 description 1
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- SOUHUMACVWVDME-UHFFFAOYSA-N safranin O Chemical compound [Cl-].C12=CC(N)=CC=C2N=C2C=CC(N)=CC2=[N+]1C1=CC=CC=C1 SOUHUMACVWVDME-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- MNCGMVDMOKPCSQ-UHDJGPCESA-M sodium;(e)-2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)\C=C\C1=CC=CC=C1 MNCGMVDMOKPCSQ-UHDJGPCESA-M 0.000 description 1
- YSJZWXFVNXMVCR-UHFFFAOYSA-M sodium;3-chlorobut-2-ene-1-sulfonate Chemical compound [Na+].CC(Cl)=CCS([O-])(=O)=O YSJZWXFVNXMVCR-UHFFFAOYSA-M 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- NVBFHJWHLNUMCV-UHFFFAOYSA-N sulfamide Chemical compound NS(N)(=O)=O NVBFHJWHLNUMCV-UHFFFAOYSA-N 0.000 description 1
- 150000003455 sulfinic acids Chemical class 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- NJPKYOIXTSGVAN-UHFFFAOYSA-K trisodium;naphthalene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].[O-]S(=O)(=O)C1=CC(S([O-])(=O)=O)=CC2=CC(S(=O)(=O)[O-])=CC=C21 NJPKYOIXTSGVAN-UHFFFAOYSA-K 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/16—Acetylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- This invention relates to improved processes and compositions for the electrodeposition of nickel and alloys thereof.
- this invention relates to an improved process and composition for the preparation of nickel or nickel alloy electrodeposits which comprises passing current from an anode to a cathode through an aqueous acidic electroplating solution containing:
- concentrations of said compounds are with a preferred range of
- Class I brighteners as used herein, and as described in Modern Electroplating, Third Edition, F. Lowenheim, Editor, is meant to include aromatic sulfonates, sulfonamides, sulfonimides, etc., as well as aliphatic or aromatic-aliphatic olefinically unsaturated sulfonates, sulfonamides, sulfonimides, etc. Specific examples of such plating additives are:
- plating additive compounds which may be used singly or in suitable combinations, are desirably employed in amounts ranging from about 0.5 to 10 grams per liter and provide the advantages described in the above reference and which are well known to those skilled in the art of nickel electroplating.
- Class II brighteners as used herein, and as described in Modern Electroplating, Third Edition, F. Lowenheim, Editor, is meant to include plating additive compounds such as reaction products of epoxides with alpha-hydroxy acetylenic alcohols such as diethoxylated 2-butyne-1,4-diol N-heterocyclics, dye-stuffs, acetylenic amines, etc.
- a Class II brightener When used alone or in combination, desirably in amounts ranging from about 5 to 1000 milligrams per liter, a Class II brightener may produce no visual effect on the electrodeposit, or may produce semi-lustrous, fine-grained deposits. However, best results are obtained when Class II brighteners are used with one or more Class I brighteners in order to provide optimum deposit luster, rate of brightening, leveling, bright plate current density range, low current density coverage, etc.
- anti-pitting or wetting agents as used herein is meant to include a material which functions to prevent or minimize gas pitting.
- An anti-pitting agent when used alone or in combination, desirably in amounts ranging from about 0.05 to 1 gram per liter, may also function to make the baths more compatible with contaminants, such as oil, grease, etc. by their emulsifying, dispersing, solubilizing, etc. action on such contaminants and thereby promote attaining of sounder deposits.
- Preferred anti-pitting agents may include sodium lauryl sulfate, sodium lauryl ether-sulfate and sodium di- alkylsulfosucbinates.
- the nickel compounts employed for electrodepositing nickel are typically added as the sulfate, chloride, sulfamate, or fluoborate salts.
- the sulfate, chloride, sulfamate and fluoborate salts of nickel are employed in concentrations sufficient to provide nickel in the electroplating solutions of this invention in concentrations ranging from about 10 to 150 grams per liter.
- the nickel compounds employed for electrodepositing nickel are typically added as the sulfate, grams per liter, preferably about 45 grams per liter of boric acid or other buffering agents to control the pH (e.g.; from about 3.0-5.0, preferably 4.0) and to prevent high current density burning.
- solution agitation may be employed. Air agitation, mechanical stirring, pumping, cathode rod and other means of solution agitation are all satisfactory. Additionally, the solutions may be operated without agitation.
- the operating temperature of the electroplating baths of this invention may range from about 40°C to about 70°C, preferably from about 50°C to 62°C.
- the average cathode current density may range from about 0.5 .to 12 amperes per square decimeter, with 3 to 6 amperes per square decimeter providing an optimum range.
- Typical aqueous nickel-containing electroplating solutions include the following wherein all concentrations are in grams per liter (g/l) unless otherwise indicated.
- the pH may normally tend to rise and may be adjusted with acids such as hydrochloric acid, sulfuric acid, etc.
- Anodes used in the above baths may be electrolytic or sulfur containing nickel bars, strips or small chunks in titanium baskets. All anodes are usually suitably covered with cloth or plastic bags of desired porosity to minimize introduction into the bath of metal particles, anode slime, etc. which may migrate to the cathode either mechanically or electrophoretically to give roughness in cathode deposits.
- the substrates on which the nickel electrodeposits of this invention may be applied may be metal or metal alloys such as are commonly electrodeposited and used in the art of electroplating such as nickel, cobalt, nickel-cobalt, copper, tin, brass, etc.
- Other typical substrate basis metals from which articles to be plated are manufactured may include ferrous metals such as iron, steel, alloy steels, copper, tin and alloys thereof such as with lead, alloys of copper such as brass, bronze, etc., zinc, particularly in the form of zinc-base die castings; all of which may bear plates of other metals, such as copper, etc.
- Basis metal substrates may have a variety of surface finishes depending on the final appearance desired, which in turn depends on such factors as luster, brilliance, leveling, thickness, etc. of the nickel electroplate applied on such substrates.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Paints Or Removers (AREA)
- Electrolytic Production Of Metals (AREA)
- Materials For Photolithography (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT80303183T ATE6873T1 (de) | 1979-09-13 | 1980-09-10 | Bad zum glanzvernickeln und verfahren und zusammensetzung hierfuer. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7495379A | 1979-09-13 | 1979-09-13 | |
| US74953 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0025694A1 EP0025694A1 (en) | 1981-03-25 |
| EP0025694B1 true EP0025694B1 (en) | 1984-03-28 |
Family
ID=22122633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP80303183A Expired EP0025694B1 (en) | 1979-09-13 | 1980-09-10 | Bright nickel plating bath and process and composition therefor |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP0025694B1 (pt) |
| JP (1) | JPS5647583A (pt) |
| AT (1) | ATE6873T1 (pt) |
| AU (1) | AU532948B2 (pt) |
| BR (1) | BR8005852A (pt) |
| DE (1) | DE3067275D1 (pt) |
| ES (1) | ES495007A0 (pt) |
| HK (1) | HK80384A (pt) |
| MX (1) | MX153967A (pt) |
| NZ (1) | NZ194923A (pt) |
| ZA (1) | ZA805658B (pt) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699696A (en) * | 1986-04-15 | 1987-10-13 | Omi International Corporation | Zinc-nickel alloy electrolyte and process |
| DE3632514A1 (de) * | 1986-09-22 | 1988-03-24 | Schering Ag | (alpha)-hydroxi propinsulfonsaeure und deren salze, saure nickelbaeder enthaltend diese verbindungen sowie verfahren zu ihrer herstellung |
| US20190226107A1 (en) | 2016-07-18 | 2019-07-25 | Basf Se | Composition for cobalt plating comprising additive for void-free submicron feature filling |
| CN110651069B (zh) | 2017-09-06 | 2023-04-18 | 关东电化工业株式会社 | 电极及其制造方法以及再生电极的制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3719568A (en) * | 1970-12-11 | 1973-03-06 | Oxy Metal Finishing Corp | Nickel electroplating composition and process |
| US3825478A (en) * | 1972-10-30 | 1974-07-23 | Oxy Metal Finishing Corp | Electrolyte and method for electrodepositing microporous chromium-nickel composite coatings |
| US3884773A (en) * | 1973-08-17 | 1975-05-20 | Metalux Corp | Electrodeposition of nickel |
| BR7410536D0 (pt) * | 1973-12-27 | 1975-09-02 | Du Pont | Aditivo abrilhantador banho e processo de eletrodeposicao bem como processo para fabricar o referido aditivo |
| US4016051A (en) * | 1975-05-02 | 1977-04-05 | Starlite Chemicals, Inc. | Additives for bright plating nickel, cobalt and nickel-cobalt alloys |
| CA1069850A (en) * | 1975-12-04 | 1980-01-15 | Mcgean Chemical Company | Low temperature bright nickel and bright nickel alloy plating |
-
1980
- 1980-09-10 EP EP80303183A patent/EP0025694B1/en not_active Expired
- 1980-09-10 AT AT80303183T patent/ATE6873T1/de not_active IP Right Cessation
- 1980-09-10 DE DE8080303183T patent/DE3067275D1/de not_active Expired
- 1980-09-11 NZ NZ194923A patent/NZ194923A/xx unknown
- 1980-09-11 JP JP12661080A patent/JPS5647583A/ja active Granted
- 1980-09-12 BR BR8005852A patent/BR8005852A/pt unknown
- 1980-09-12 AU AU62365/80A patent/AU532948B2/en not_active Ceased
- 1980-09-12 MX MX183921A patent/MX153967A/es unknown
- 1980-09-12 ZA ZA00805658A patent/ZA805658B/xx unknown
- 1980-09-12 ES ES495007A patent/ES495007A0/es active Granted
-
1984
- 1984-10-25 HK HK803/84A patent/HK80384A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU532948B2 (en) | 1983-10-20 |
| MX153967A (es) | 1987-03-03 |
| JPS5647583A (en) | 1981-04-30 |
| NZ194923A (en) | 1982-05-25 |
| HK80384A (en) | 1984-11-02 |
| DE3067275D1 (en) | 1984-05-03 |
| JPS6252035B2 (pt) | 1987-11-02 |
| BR8005852A (pt) | 1981-03-24 |
| ZA805658B (en) | 1982-03-31 |
| ATE6873T1 (de) | 1984-04-15 |
| AU6236580A (en) | 1981-03-19 |
| EP0025694A1 (en) | 1981-03-25 |
| ES8205437A1 (es) | 1982-06-01 |
| ES495007A0 (es) | 1982-06-01 |
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