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EP0000244A1 - Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten - Google Patents

Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten Download PDF

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Publication number
EP0000244A1
EP0000244A1 EP78300020A EP78300020A EP0000244A1 EP 0000244 A1 EP0000244 A1 EP 0000244A1 EP 78300020 A EP78300020 A EP 78300020A EP 78300020 A EP78300020 A EP 78300020A EP 0000244 A1 EP0000244 A1 EP 0000244A1
Authority
EP
European Patent Office
Prior art keywords
adapter
heat
pattern
electrical apparatus
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP78300020A
Other languages
English (en)
French (fr)
Other versions
EP0000244B1 (de
Inventor
Robert Edward Simons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0000244A1 publication Critical patent/EP0000244A1/de
Application granted granted Critical
Publication of EP0000244B1 publication Critical patent/EP0000244B1/de
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP78300020A 1977-06-16 1978-06-06 Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten Expired EP0000244B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/807,096 US4167771A (en) 1977-06-16 1977-06-16 Thermal interface adapter for a conduction cooling module
US807096 1977-06-16

Publications (2)

Publication Number Publication Date
EP0000244A1 true EP0000244A1 (de) 1979-01-10
EP0000244B1 EP0000244B1 (de) 1980-07-23

Family

ID=25195564

Family Applications (1)

Application Number Title Priority Date Filing Date
EP78300020A Expired EP0000244B1 (de) 1977-06-16 1978-06-06 Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten

Country Status (4)

Country Link
US (1) US4167771A (de)
EP (1) EP0000244B1 (de)
JP (1) JPS546774A (de)
DE (1) DE2860051D1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006445A1 (de) * 1978-06-29 1980-01-09 International Business Machines Corporation Verfahren zur Herstellung eines elektrischen Geräts, welches eine oder mehrere wärmeerzeugende elektrische Bauteile enthält
GB2120860A (en) * 1981-01-12 1983-12-07 Owens Illinois Inc Environmentally protected electronic control for a glassware forming machine
EP0103068A2 (de) * 1982-09-09 1984-03-21 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
EP0103067A2 (de) * 1982-09-09 1984-03-21 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
EP0316129A1 (de) * 1987-11-09 1989-05-17 Nec Corporation Kühlungssystem für eine dreidimensionale integrierte Schaltungspackung

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4327398A (en) * 1979-09-04 1982-04-27 Product Technologies, Inc. Cooling system for automatic bowling pin spotter
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules
US7410484B2 (en) * 2003-01-15 2008-08-12 Cryodynamics, Llc Cryotherapy probe
US7273479B2 (en) * 2003-01-15 2007-09-25 Cryodynamics, Llc Methods and systems for cryogenic cooling
US7083612B2 (en) * 2003-01-15 2006-08-01 Cryodynamics, Llc Cryotherapy system
JP5083088B2 (ja) * 2008-07-23 2012-11-28 富士通株式会社 電子部品ユニットおよび連結機構
JP6127429B2 (ja) * 2012-09-28 2017-05-17 富士通株式会社 冷却装置及び電子装置
CN109846543B (zh) 2013-09-24 2021-09-21 艾达吉欧医疗公司 基于血管内近临界流体的冷冻消融导管及相关方法
WO2015160574A1 (en) 2014-04-17 2015-10-22 Adagio Medical, Inc. Endovascular near critical fluid based cryoablation catheter having plurality of preformed treatment shapes
JP6607938B2 (ja) 2014-11-13 2019-11-20 アダージョ メディカル インコーポレイテッド 圧力調整型冷凍アブレーションシステム及び関連方法
WO2017048965A1 (en) 2015-09-18 2017-03-23 Adagio Medical Inc. Tissue contact verification system
US10864031B2 (en) 2015-11-30 2020-12-15 Adagio Medical, Inc. Ablation method for creating elongate continuous lesions enclosing multiple vessel entries
EP3211668B1 (de) 2016-02-23 2019-04-17 ABB Schweiz AG Anordnung für unterwasserkühlung von halbleitermodulen
KR102736370B1 (ko) 2017-09-05 2024-11-29 아다지오 메디컬, 인크. 형상 기억 스타일렛을 갖는 절제 카테터
AU2019206388B2 (en) 2018-01-10 2021-10-14 Adagio Medical, Inc. Cryoablation element with conductive liner
US11776876B2 (en) * 2021-01-25 2023-10-03 International Business Machines Corporation Distributing heatsink load across a processor module with separable input/output (I/O) connectors

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062507A (en) * 1957-11-18 1962-11-06 Smith Corp A O Multi-layer vessel having a heat transfer material disposed between layers
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3264534A (en) * 1964-04-21 1966-08-02 Vitramon Inc Electrical component and thermal construction
US3399332A (en) * 1965-12-29 1968-08-27 Texas Instruments Inc Heat-dissipating support for semiconductor device
US3629549A (en) * 1969-12-29 1971-12-21 Minnesota Mining & Mfg Heating device
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 18, october 1975, New York, S.P. ANTIPPAS "Cooling cap for powder or liquid filled modules", pages 1387-1388. *
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 19, january 1977, New York, A.H. BAUMAN et al. "Multimodule heat sink", pages 2976-2977. *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0006445A1 (de) * 1978-06-29 1980-01-09 International Business Machines Corporation Verfahren zur Herstellung eines elektrischen Geräts, welches eine oder mehrere wärmeerzeugende elektrische Bauteile enthält
GB2120860A (en) * 1981-01-12 1983-12-07 Owens Illinois Inc Environmentally protected electronic control for a glassware forming machine
EP0103068A2 (de) * 1982-09-09 1984-03-21 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
EP0103067A2 (de) * 1982-09-09 1984-03-21 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
EP0103067A3 (en) * 1982-09-09 1986-03-12 Siemens Aktiengesellschaft Cooling device for a plurality of integrated components assembled as a flat structure
EP0103068A3 (en) * 1982-09-09 1986-03-12 Siemens Aktiengesellschaft Cooling device for a plurality of integrated components assembled as a flat structure
EP0316129A1 (de) * 1987-11-09 1989-05-17 Nec Corporation Kühlungssystem für eine dreidimensionale integrierte Schaltungspackung

Also Published As

Publication number Publication date
JPS546774A (en) 1979-01-19
EP0000244B1 (de) 1980-07-23
US4167771A (en) 1979-09-11
JPS5631895B2 (de) 1981-07-24
DE2860051D1 (en) 1980-11-13

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