[go: up one dir, main page]

DK455489D0 - Fremgangsmaade til fremstilling af fleksible elektroniske kredsloeb - Google Patents

Fremgangsmaade til fremstilling af fleksible elektroniske kredsloeb

Info

Publication number
DK455489D0
DK455489D0 DK455489A DK455489A DK455489D0 DK 455489 D0 DK455489 D0 DK 455489D0 DK 455489 A DK455489 A DK 455489A DK 455489 A DK455489 A DK 455489A DK 455489 D0 DK455489 D0 DK 455489D0
Authority
DK
Denmark
Prior art keywords
procedure
electronic circuits
flexible electronic
manufacturing flexible
manufacturing
Prior art date
Application number
DK455489A
Other languages
English (en)
Other versions
DK455489A (da
Inventor
Yan-Yau Harrison Chao
Reginald T Smart
Albert Steven Will
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of DK455489D0 publication Critical patent/DK455489D0/da
Publication of DK455489A publication Critical patent/DK455489A/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Graft Or Block Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DK455489A 1988-09-16 1989-09-15 Fremgangsmaade til fremstilling af fleksible elektroniske kredsloeb DK455489A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24543088A 1988-09-16 1988-09-16

Publications (2)

Publication Number Publication Date
DK455489D0 true DK455489D0 (da) 1989-09-15
DK455489A DK455489A (da) 1990-03-17

Family

ID=22926622

Family Applications (1)

Application Number Title Priority Date Filing Date
DK455489A DK455489A (da) 1988-09-16 1989-09-15 Fremgangsmaade til fremstilling af fleksible elektroniske kredsloeb

Country Status (16)

Country Link
EP (1) EP0359562A3 (da)
JP (1) JPH02169679A (da)
KR (1) KR900004767A (da)
CN (1) CN1043331A (da)
AU (1) AU4128289A (da)
BR (1) BR8904662A (da)
CA (1) CA1331442C (da)
DK (1) DK455489A (da)
FI (1) FI894373A (da)
IE (1) IE892901L (da)
IL (1) IL91621A0 (da)
MX (1) MX174443B (da)
NO (1) NO893673L (da)
NZ (1) NZ230635A (da)
PH (1) PH27583A (da)
ZA (1) ZA897012B (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4213964A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersionen
DE4213967A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213965A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213969A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213968A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4307683A1 (de) * 1993-03-11 1994-09-15 Basf Ag Verfahren zur Herstellung einer wäßrigen Polymerisatdispersion
ES2170418T3 (es) 1996-09-09 2002-08-01 Basf Ag Procedimiento para la obtencion de dispersiones polimeras acuosas.
US7179531B2 (en) * 2002-09-12 2007-02-20 Rohm And Haas Company Polymer particles having select pendant groups and composition prepared therefrom
CN101589125B (zh) * 2007-01-22 2012-08-22 信越化学工业株式会社 粘合剂组合物以及带粘合剂的光学膜
CN102286127B (zh) 2010-06-18 2014-12-10 罗门哈斯公司 含微区域的乳液聚合物
AR119758A1 (es) * 2019-09-03 2022-01-12 Rohm & Haas Composición adhesiva

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616195A (en) * 1968-12-26 1971-10-26 Richardson Co Printed circuit board having metal layer bonded to hydrocarbon base and method of making it
JPS6092372A (ja) * 1983-10-25 1985-05-23 Nitto Electric Ind Co Ltd エマルジヨン型感圧性接着剤の製造方法
CA1284695C (en) * 1984-12-20 1991-06-04 Rohm And Haas Company Modified latex polymer compositions

Also Published As

Publication number Publication date
EP0359562A2 (en) 1990-03-21
PH27583A (en) 1993-08-18
IE892901L (en) 1990-03-16
CA1331442C (en) 1994-08-16
NO893673D0 (no) 1989-09-14
FI894373A0 (fi) 1989-09-15
FI894373A (fi) 1990-03-17
ZA897012B (en) 1991-12-24
MX174443B (es) 1994-05-17
EP0359562A3 (en) 1991-09-11
KR900004767A (ko) 1990-04-13
JPH02169679A (ja) 1990-06-29
NO893673L (no) 1990-03-19
IL91621A0 (en) 1990-04-29
NZ230635A (en) 1992-04-28
BR8904662A (pt) 1990-05-01
AU4128289A (en) 1990-03-22
DK455489A (da) 1990-03-17
CN1043331A (zh) 1990-06-27

Similar Documents

Publication Publication Date Title
DK201690A (da) Fremgangsmaade til fremstilling af trykte kredsloeb
NO176079C (no) Integrert kretskort
DE69008963D1 (de) Elektronisches Schaltungssubstrat.
DE69034198D1 (de) Elektronische Standbildkamera
DE69031452D1 (de) Elektronische Stehbildkamera
BR8906652A (pt) Circuito de conexao eletronica
DK599287A (da) Fremgangsmaade til fremstilling af en flerlagskredsloebsplade samt en ifoelge fremgangsmaaden fremstillet kredsloebsplade
DE68927689D1 (de) Überlaufkorrekturschaltung
DE69124146D1 (de) Elektronische Kamera
DE69122065D1 (de) Programmierbare integrierte Schaltung
KR890015413A (ko) 반도체 집적회로
DE69124896D1 (de) Elektronischer Schaltkreis
BR9006653A (pt) Complexo central de circuitos eletronicos
DK455489A (da) Fremgangsmaade til fremstilling af fleksible elektroniske kredsloeb
DE69119953D1 (de) Halbleiterschaltung-Leiterbahn
DE68925868D1 (de) Elektronische Standbildkamera
DE68929104D1 (de) Integrierte Halbleiterschaltung
DE69124965D1 (de) Schaltung zur taktrückgewinnung
KR920010834U (ko) 회로기판의 유지구조
DK44089D0 (da) Kredsloeb til telefonapparater
DE69117801D1 (de) Elektronische Bauteile-Bestückungsvorrichtung
FR2661269B1 (fr) Cartes a circuits integres.
DE68929148D1 (de) Integrierte Halbleiterschaltung
KR890022216U (ko) 전자식 안정기 회로
KR920006803U (ko) 클럭 분주회로

Legal Events

Date Code Title Description
AHB Application shelved due to non-payment