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DK200301576A - Flowfordelingsenhed og köleenhed med bypassflow - Google Patents

Flowfordelingsenhed og köleenhed med bypassflow Download PDF

Info

Publication number
DK200301576A
DK200301576A DK200301576A DKPA200301576A DK200301576A DK 200301576 A DK200301576 A DK 200301576A DK 200301576 A DK200301576 A DK 200301576A DK PA200301576 A DKPA200301576 A DK PA200301576A DK 200301576 A DK200301576 A DK 200301576A
Authority
DK
Denmark
Prior art keywords
flow
channel
flow channel
cell
unit
Prior art date
Application number
DK200301576A
Other languages
English (en)
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Priority to DK200301576A priority Critical patent/DK176137B1/da
Priority to EP04762954A priority patent/EP1683404B1/en
Priority to AT04762954T priority patent/ATE364988T1/de
Priority to PCT/DK2004/000736 priority patent/WO2005041627A2/en
Priority to DE602004007031T priority patent/DE602004007031T2/de
Priority to US10/577,027 priority patent/US7360582B2/en
Publication of DK200301576A publication Critical patent/DK200301576A/da
Application granted granted Critical
Publication of DK176137B1 publication Critical patent/DK176137B1/da

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Description

Patentkrav 1. En fordeler til fordeling af et væskeflow over en overflade, som skal køles, hvorved fordeleren omfatter: - en indløbsforgrening (8, 25); - en udløbsforgrening (9, 24); og - mindst en flowcelle (26-29) forbundet mellem forgreningerne, hvorved flowcellen omfatter: - et celleindløb (5) i væskeforbindelse med indløbsforgreningen; - et celleudløb (6) i væskeforbindelse med udløbsforgreningen; - en hovedflowkanal (50) i form af en mæanderformet sekvens af kanalsegmenter (64, 63, 62, 61) til at føre et hovedvæskeflow fra celleindløbet (5) langs overfladen til celleudløbet (6) med et stort antal retningsændringer (51, 52) i hovedflowet; og - en bypassflowkanal (71, 72, 73) der tillader et by-passflow af væske fra celleindløbet til celleudløbet; hvorved - bypassflowkanalen forbinder kanalsegmenterne på hovedf lowkanalen. 2. En fordeler som i krav 1, hvori hovedflowkanalen dannes af vægsegmenter (21) der udgår fra en basis (25) til den overflade, der skal køles, og hvori bypass-flowkanalen dannes af mellemrum mellem vægsegmenterne og den overflade, der skal køles. 3. En fordeler som i krav 1 eller 2, hvori et stort antal flowceller er forbundet mellem forgreningerne, og hvori hver af flowcellerne omfatter en bypassflowka-nal. 4. En enhed, som kan væskekøles, til bortledning af varme fra en varmekilde, hvorved enheden omfatter en plade, som opvarmes af varmekilden og en fordeler som i hvert af de foregående krav til fordeling af et flow af kølevæske over en overflade på pladen. 5. En elektronisk enhed, som kan væskekøles, hvorved enheden omfatter et elektronisk kredsløb indkapslet i et kredsløbsmodul med en ydre overflade, og en fordeler som i hvert af kravene 1 til 3 til fordeling af et flow af kølevæske over overfladen.
DK200301576A 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow DK176137B1 (da)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow
EP04762954A EP1683404B1 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit having bypass flow
AT04762954T ATE364988T1 (de) 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit mit bypass-strömung
PCT/DK2004/000736 WO2005041627A2 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit having bypass flow
DE602004007031T DE602004007031T2 (de) 2003-10-27 2004-10-26 Strömungsverteilungseinheit und kühleinheit mit bypass-strömung
US10/577,027 US7360582B2 (en) 2003-10-27 2004-10-26 Flow distributing unit and cooling unit having bypass flow

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow
DK200301576 2003-10-27

Publications (2)

Publication Number Publication Date
DK200301576A true DK200301576A (da) 2005-04-28
DK176137B1 DK176137B1 (da) 2006-09-25

Family

ID=34485963

Family Applications (1)

Application Number Title Priority Date Filing Date
DK200301576A DK176137B1 (da) 2003-10-27 2003-10-27 Flowfordelingsenhed og köleenhed med bypassflow

Country Status (6)

Country Link
US (1) US7360582B2 (da)
EP (1) EP1683404B1 (da)
AT (1) ATE364988T1 (da)
DE (1) DE602004007031T2 (da)
DK (1) DK176137B1 (da)
WO (1) WO2005041627A2 (da)

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Also Published As

Publication number Publication date
ATE364988T1 (de) 2007-07-15
EP1683404B1 (en) 2007-06-13
DK176137B1 (da) 2006-09-25
EP1683404A2 (en) 2006-07-26
US20070119574A1 (en) 2007-05-31
DE602004007031D1 (de) 2007-07-26
WO2005041627A3 (en) 2005-06-30
US7360582B2 (en) 2008-04-22
WO2005041627A2 (en) 2005-05-06
DE602004007031T2 (de) 2008-02-14

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PUP Patent expired

Expiry date: 20231027