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DK119069B - Konstruktion til køling af et antal halvlederelementer på to sider. - Google Patents

Konstruktion til køling af et antal halvlederelementer på to sider.

Info

Publication number
DK119069B
DK119069B DK187968AA DK187968A DK119069B DK 119069 B DK119069 B DK 119069B DK 187968A A DK187968A A DK 187968AA DK 187968 A DK187968 A DK 187968A DK 119069 B DK119069 B DK 119069B
Authority
DK
Denmark
Prior art keywords
cooling
construction
sides
semiconductor elements
semiconductor
Prior art date
Application number
DK187968AA
Other languages
Danish (da)
English (en)
Inventor
H Mattsson
G Mellgren
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Publication of DK119069B publication Critical patent/DK119069B/da

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
DK187968AA 1967-05-08 1968-04-25 Konstruktion til køling af et antal halvlederelementer på to sider. DK119069B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE06373/67A SE334947B (fi) 1967-05-08 1967-05-08

Publications (1)

Publication Number Publication Date
DK119069B true DK119069B (da) 1970-11-09

Family

ID=20268507

Family Applications (1)

Application Number Title Priority Date Filing Date
DK187968AA DK119069B (da) 1967-05-08 1968-04-25 Konstruktion til køling af et antal halvlederelementer på to sider.

Country Status (7)

Country Link
US (1) US3536133A (fi)
BE (1) BE714821A (fi)
DK (1) DK119069B (fi)
FI (1) FI44819C (fi)
GB (1) GB1216422A (fi)
NO (1) NO121731B (fi)
SE (1) SE334947B (fi)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2103982C3 (de) * 1971-01-28 1980-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Mit isolierender Flüssigkeit gekühlter Stromrichter
US3710193A (en) * 1971-03-04 1973-01-09 Lambda Electronics Corp Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
JPS5295982A (en) * 1976-02-09 1977-08-12 Hitachi Ltd Semiconductor commutation stack
JPS583304Y2 (ja) * 1981-10-28 1983-01-20 株式会社日立製作所 半導体整流スタツク
US4902969A (en) * 1987-06-01 1990-02-20 Reliability Incorporated Automated burn-in system
US5093982A (en) * 1987-06-01 1992-03-10 Reliability Incorporated Automated burn-in system
CN114650716B (zh) * 2022-05-20 2022-07-29 江苏海鋆自动化技术有限公司 一种数据中心配套用模块化水冷散热装置

Also Published As

Publication number Publication date
FI44819B (fi) 1971-09-30
GB1216422A (en) 1970-12-23
NO121731B (fi) 1971-04-05
US3536133A (en) 1970-10-27
BE714821A (fi) 1968-09-30
SE334947B (fi) 1971-05-10
FI44819C (fi) 1972-01-10

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