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DE69936725D1 - Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat - Google Patents

Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat

Info

Publication number
DE69936725D1
DE69936725D1 DE69936725T DE69936725T DE69936725D1 DE 69936725 D1 DE69936725 D1 DE 69936725D1 DE 69936725 T DE69936725 T DE 69936725T DE 69936725 T DE69936725 T DE 69936725T DE 69936725 D1 DE69936725 D1 DE 69936725D1
Authority
DE
Germany
Prior art keywords
foil
applying
gasket
viscosem
pastive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69936725T
Other languages
English (en)
Other versions
DE69936725T2 (de
Inventor
David Godfrey Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Assembly Systems Switzerland GmbH
Original Assignee
DEK International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9819625.6A external-priority patent/GB9819625D0/en
Priority claimed from GBGB9827763.5A external-priority patent/GB9827763D0/en
Application filed by DEK International GmbH filed Critical DEK International GmbH
Publication of DE69936725D1 publication Critical patent/DE69936725D1/de
Application granted granted Critical
Publication of DE69936725T2 publication Critical patent/DE69936725T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Die Bonding (AREA)
  • Liquid Crystal (AREA)
DE69936725T 1998-09-10 1999-09-06 Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat Expired - Lifetime DE69936725T2 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
GBGB9819625.6A GB9819625D0 (en) 1998-09-10 1998-09-10 Method and apparatus for applying a viscous or paste material onto a substrate
GB9819625 1998-09-10
GBGB9825158.0A GB9825158D0 (en) 1998-09-10 1998-11-18 Method and apparatus for supplying a viscous or paste material onto a substrate
GB9825158 1998-11-18
GB9827763 1998-12-18
GBGB9827763.5A GB9827763D0 (en) 1998-09-10 1998-12-18 Method and apparatus for applying a viscous or past material onto a substrate
GBGB9903146.0A GB9903146D0 (en) 1998-09-10 1999-02-12 Method and apparatus for applying a viscous or paste material onto a substrate
GB9903146 1999-02-12
PCT/GB1999/002953 WO2000015436A1 (en) 1998-09-10 1999-09-06 Method and apparatus for applying a viscous or paste material onto a substrate

Publications (2)

Publication Number Publication Date
DE69936725D1 true DE69936725D1 (de) 2007-09-13
DE69936725T2 DE69936725T2 (de) 2008-04-30

Family

ID=27451830

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69936725T Expired - Lifetime DE69936725T2 (de) 1998-09-10 1999-09-06 Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat

Country Status (8)

Country Link
US (1) US6725769B1 (de)
EP (1) EP1113931B1 (de)
JP (1) JP2002524325A (de)
AT (1) ATE368568T1 (de)
AU (1) AU5641999A (de)
DE (1) DE69936725T2 (de)
GB (2) GB9903146D0 (de)
WO (1) WO2000015436A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395087B1 (en) * 1994-12-27 2002-05-28 Visteon Global Technologies, Inc. Method and apparatus for dispensing viscous material
WO2000061489A1 (en) * 1999-04-08 2000-10-19 Crossflow International Limited Method and apparatus for dispensing viscous material
GB9913496D0 (en) * 1999-06-10 1999-08-11 Williams David G Improved squeegee or sealing means/wiper
US7040523B2 (en) 2000-04-04 2006-05-09 Dek International Gmbh Method and apparatus for applying viscous or paste material onto a substrate
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
DE10196262T1 (de) 2000-05-31 2003-05-15 Honeywell Int Inc Füllsystem
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
DE10196259T1 (de) 2000-05-31 2003-05-15 Honeywell Int Inc Füllverfahren
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
JP3685053B2 (ja) * 2000-12-05 2005-08-17 松下電器産業株式会社 スクリーン印刷装置
KR100782227B1 (ko) * 2006-02-23 2007-12-05 엘에스전선 주식회사 스크린 프린터의 스퀴즈
US7410092B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Fill head for injection molding of solder
US7416104B2 (en) * 2006-04-21 2008-08-26 International Business Machines Corporation Rotational fill techniques for injection molding of solder
US7694869B2 (en) * 2006-04-21 2010-04-13 International Business Machines Corporation Universal mold for injection molding of solder
US9314864B2 (en) * 2007-07-09 2016-04-19 International Business Machines Corporation C4NP compliant solder fill head seals
US7980445B2 (en) * 2008-01-23 2011-07-19 International Business Machines Corporation Fill head for full-field solder coverage with a rotatable member
JP4643719B2 (ja) * 2009-02-09 2011-03-02 ヤマハ発動機株式会社 はんだ供給装置、印刷装置および印刷方法
JP5251579B2 (ja) * 2009-02-12 2013-07-31 株式会社デンソー ペースト状物質を有底孔に充填する方法及び装置
US8122847B2 (en) 2009-06-29 2012-02-28 Ttm Technologies, Inc. System for filling holes in a printed circuit board with a fluid fill material
US8444770B2 (en) * 2009-06-29 2013-05-21 Ttm Technologies, Inc. System for cleaning components for filling holes in a printed circuit board with a fluid fill material
JP5947098B2 (ja) * 2011-05-13 2016-07-06 株式会社半導体エネルギー研究所 ガラス封止体の作製方法および発光装置の作製方法
US8632171B2 (en) 2011-12-28 2014-01-21 Hewlett-Packard Indigo B.V. Ink cartridges and outputting ink from ink cartridges
US8511805B2 (en) 2011-12-28 2013-08-20 Hewlett-Packard Indigo B.V. Extracting liquid from a cartridge
WO2014088936A1 (en) 2012-12-06 2014-06-12 3M Innovative Properties Company Precision coating of viscous liquids and use in forming laminates
US9817257B2 (en) 2012-12-06 2017-11-14 3M Innovative Properties Company Discrete coating of liquid on a liquid-coated substrate and use in forming laminates
US20150321463A1 (en) * 2014-05-09 2015-11-12 GroupeSTAHL Flexible platen cover and a heat press having a flexible platen cover
ITUB20150485A1 (it) * 2015-03-13 2016-09-13 Sacmi Sistema di tenuta per plastica fusa

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1433957A (en) * 1974-01-29 1976-04-28 Mitter & Co Apparatus for applying fluid or pasty printing media for screen printing machines
US4043683A (en) * 1974-06-20 1977-08-23 Loctite Corporation Dispensing and wiping device
US4023486A (en) * 1974-08-01 1977-05-17 E.T. Barwick Industries Screen printing squeegee apparatus
DE2653912A1 (de) * 1976-11-27 1978-06-01 Mathias Mitter Vorrichtung zum bemustern und faerben von druckgut, insbesondere textilgut, das entweder in bahnen oder flaechigen einzelstuecken vorliegt mittels einer flachdrucksiebschablone
US4541395A (en) * 1984-01-23 1985-09-17 Leroy Geiger Pressure regulation in pumping a liquid
US4622239A (en) * 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
US4961955A (en) * 1988-12-20 1990-10-09 Itt Corporation Solder paste applicator for circuit boards
US5284189A (en) * 1992-03-16 1994-02-08 Printron, Inc. Conductive ink packaging for printed circuit board screen printing operations
NL9301820A (nl) * 1993-10-20 1995-05-16 Stork Screens Bv Rakelsamenstel.
US6286422B1 (en) * 1994-12-27 2001-09-11 Visteon Global Tech., Inc. Method and apparatus for dispensing viscous material
WO1996020088A1 (en) * 1994-12-27 1996-07-04 Ford Motor Company Method and apparatus for dispensing viscous material
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
US6158338A (en) * 1998-12-22 2000-12-12 Dek Printing Machines Limited Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate

Also Published As

Publication number Publication date
GB2341347A (en) 2000-03-15
JP2002524325A (ja) 2002-08-06
ATE368568T1 (de) 2007-08-15
EP1113931A1 (de) 2001-07-11
GB9903146D0 (en) 1999-04-07
WO2000015436A1 (en) 2000-03-23
AU5641999A (en) 2000-04-03
GB2341347B (en) 2001-04-18
DE69936725T2 (de) 2008-04-30
GB9920805D0 (en) 1999-11-10
US6725769B1 (en) 2004-04-27
EP1113931B1 (de) 2007-08-01

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