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DE69934841D1 - Druckwandler und Herstellungsverfahren - Google Patents

Druckwandler und Herstellungsverfahren

Info

Publication number
DE69934841D1
DE69934841D1 DE69934841T DE69934841T DE69934841D1 DE 69934841 D1 DE69934841 D1 DE 69934841D1 DE 69934841 T DE69934841 T DE 69934841T DE 69934841 T DE69934841 T DE 69934841T DE 69934841 D1 DE69934841 D1 DE 69934841D1
Authority
DE
Germany
Prior art keywords
manufacturing process
pressure transducer
transducer
pressure
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934841T
Other languages
English (en)
Other versions
DE69934841T2 (de
Inventor
Masaharu Ikeda
Masayoshi Esashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69934841D1 publication Critical patent/DE69934841D1/de
Application granted granted Critical
Publication of DE69934841T2 publication Critical patent/DE69934841T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
DE69934841T 1998-06-30 1999-06-30 Druckwandler und Herstellungsverfahren Expired - Lifetime DE69934841T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19807898 1998-06-30
JP10198078A JP2000022172A (ja) 1998-06-30 1998-06-30 変換装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE69934841D1 true DE69934841D1 (de) 2007-03-08
DE69934841T2 DE69934841T2 (de) 2007-10-11

Family

ID=16385160

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934841T Expired - Lifetime DE69934841T2 (de) 1998-06-30 1999-06-30 Druckwandler und Herstellungsverfahren

Country Status (7)

Country Link
US (2) US6441451B1 (de)
EP (1) EP0969694B1 (de)
JP (1) JP2000022172A (de)
CN (1) CN1145219C (de)
DE (1) DE69934841T2 (de)
DK (1) DK0969694T3 (de)
NO (1) NO322331B1 (de)

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US7008812B1 (en) * 2000-05-30 2006-03-07 Ic Mechanics, Inc. Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
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JP2002257616A (ja) * 2001-03-06 2002-09-11 Seiko Epson Corp センサおよびセンサの製造方法
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US20040232503A1 (en) * 2001-06-12 2004-11-25 Shinya Sato Semiconductor device and method of producing the same
JP4296728B2 (ja) * 2001-07-06 2009-07-15 株式会社デンソー 静電容量型圧力センサおよびその製造方法並びに静電容量型圧力センサに用いるセンサ用構造体
JP4296731B2 (ja) 2001-07-18 2009-07-15 株式会社デンソー 静電容量型圧力センサの製造方法
US7298856B2 (en) 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US6677176B2 (en) * 2002-01-18 2004-01-13 The Hong Kong University Of Science And Technology Method of manufacturing an integrated electronic microphone having a floating gate electrode
US6952042B2 (en) * 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
WO2004016168A1 (en) * 2002-08-19 2004-02-26 Czarnek & Orkin Laboratories, Inc. Capacitive uterine contraction sensor
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US6983653B2 (en) * 2002-12-13 2006-01-10 Denso Corporation Flow sensor having thin film portion and method for manufacturing the same
CN100486359C (zh) * 2003-08-12 2009-05-06 中国科学院声学研究所 一种传声器芯片制备方法
CN1330952C (zh) * 2003-11-14 2007-08-08 中国科学院电子学研究所 聚合材料气压传感器芯片
JP4529431B2 (ja) * 2003-12-05 2010-08-25 株式会社豊田中央研究所 マイクロ構造体の製造方法
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JP4036866B2 (ja) * 2004-07-30 2008-01-23 三洋電機株式会社 音響センサ
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US6923069B1 (en) 2004-10-18 2005-08-02 Honeywell International Inc. Top side reference cavity for absolute pressure sensor
DE102005004878B4 (de) * 2005-02-03 2015-01-08 Robert Bosch Gmbh Mikromechanischer kapazitiver Drucksensor und entsprechendes Herstellungsverfahren
DE102005004877A1 (de) * 2005-02-03 2006-08-10 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
JP2006226756A (ja) * 2005-02-16 2006-08-31 Denso Corp 圧力センサ
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7334484B2 (en) * 2005-05-27 2008-02-26 Rosemount Inc. Line pressure measurement using differential pressure sensor
US7562429B2 (en) * 2005-06-20 2009-07-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Suspended device and method of making
US7961897B2 (en) * 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
US7395719B2 (en) * 2006-01-13 2008-07-08 Custom Sensors & Technologies, Inc. Preformed sensor housings and methods to produce thin metal diaphragms
US20070163355A1 (en) * 2006-01-13 2007-07-19 Kavlico Corporation Preformed sensor housing and methods to produce thin metal diaphragms
DE102006002106B4 (de) * 2006-01-17 2016-03-03 Robert Bosch Gmbh Mikromechanischer Sensor mit perforationsoptimierter Membran sowie ein geeignetes Hestellungsverfahren
FR2897937B1 (fr) * 2006-02-24 2008-05-23 Commissariat Energie Atomique Capteur de pression a jauges resistives
DE102006022378A1 (de) * 2006-05-12 2007-11-22 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement
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JP4244232B2 (ja) * 2006-07-19 2009-03-25 ヤマハ株式会社 コンデンサマイクロホン及びその製造方法
US7448277B2 (en) * 2006-08-31 2008-11-11 Evigia Systems, Inc. Capacitive pressure sensor and method therefor
JP2008101918A (ja) * 2006-10-17 2008-05-01 Alps Electric Co Ltd 圧力センサのパッケージ
JP2008132583A (ja) * 2006-10-24 2008-06-12 Seiko Epson Corp Ｍｅｍｓデバイス
DE102006055147B4 (de) 2006-11-03 2011-01-27 Infineon Technologies Ag Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur
EP1931173B1 (de) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Kondensatormikrofon mit Membran mit Biegescharnier und Herstellungsverfahren dafür
DE102008000128B4 (de) * 2007-01-30 2013-01-03 Denso Corporation Halbleitersensorvorrichtung und deren Herstellungsverfahren
US7412892B1 (en) 2007-06-06 2008-08-19 Measurement Specialties, Inc. Method of making pressure transducer and apparatus
US8240217B2 (en) * 2007-10-15 2012-08-14 Kavlico Corporation Diaphragm isolation forming through subtractive etching
US7677109B2 (en) 2008-02-27 2010-03-16 Honeywell International Inc. Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die
EP2452349A1 (de) * 2009-07-06 2012-05-16 Imec Verfahren zur herstellung variabler mems-kondensatoren
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
JP5400708B2 (ja) * 2010-05-27 2014-01-29 オムロン株式会社 音響センサ、音響トランスデューサ、該音響トランスデューサを利用したマイクロフォン、および音響トランスデューサの製造方法
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
JP5875243B2 (ja) 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875244B2 (ja) 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
US9409763B2 (en) * 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
DE102012205921A1 (de) * 2012-04-12 2013-10-17 Robert Bosch Gmbh Membrananordnung für einen mikro-elektromechanischen Messumformer und Verfahren zum Herstellen einer Membrananordnung
CN103011052A (zh) * 2012-12-21 2013-04-03 上海宏力半导体制造有限公司 Mems器件的牺牲层、mems器件及其制作方法
JP6127625B2 (ja) * 2013-03-19 2017-05-17 オムロン株式会社 静電容量型圧力センサ及び入力装置
CN104427456B (zh) * 2013-08-20 2017-12-05 无锡华润上华科技有限公司 一种减少微机电系统麦克风制作过程中产生的粘黏的方法
CN105492128B (zh) * 2013-08-26 2018-08-10 皇家飞利浦有限公司 超声换能器组件和用于制造超声换能器组件的方法
EP2871455B1 (de) 2013-11-06 2020-03-04 Invensense, Inc. Drucksensor
EP3367082A1 (de) 2013-11-06 2018-08-29 Invensense, Inc. Drucksensor
JP6399803B2 (ja) * 2014-05-14 2018-10-03 キヤノン株式会社 力覚センサおよび把持装置
EP3614115B1 (de) 2015-04-02 2024-09-11 InvenSense, Inc. Drucksensor
KR101776725B1 (ko) * 2015-12-11 2017-09-08 현대자동차 주식회사 멤스 마이크로폰 및 그 제조방법
WO2017136719A1 (en) 2016-02-03 2017-08-10 Hutchinson Technology Incorporated Miniature pressure/force sensor with integrated leads
US10602252B2 (en) * 2016-03-22 2020-03-24 Sound Solutions International Co., Ltd. Electrodynamic loudspeaker membrane with internally molded electrical connection
US9813831B1 (en) 2016-11-29 2017-11-07 Cirrus Logic, Inc. Microelectromechanical systems microphone with electrostatic force feedback to measure sound pressure
US9900707B1 (en) 2016-11-29 2018-02-20 Cirrus Logic, Inc. Biasing of electromechanical systems microphone with alternating-current voltage waveform
CA3049635A1 (en) 2016-12-09 2018-06-14 The Research Foundation For The State University Of New York Fiber microphone
CN107337174B (zh) * 2017-06-27 2019-04-02 杭州电子科技大学 一种多晶硅振膜结构的制作方法
KR101995817B1 (ko) * 2017-07-18 2019-07-03 주식회사 하이딥 터치 입력 장치 제조 방법 및 터치 입력 장치
CN110366083B (zh) * 2018-04-11 2021-02-12 中芯国际集成电路制造(上海)有限公司 Mems器件及其制备方法
US12253391B2 (en) 2018-05-24 2025-03-18 The Research Foundation For The State University Of New York Multielectrode capacitive sensor without pull-in risk
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
CN113785178B (zh) 2019-05-17 2024-12-17 应美盛股份有限公司 气密性改进的压力传感器
JP7497800B2 (ja) 2020-07-08 2024-06-11 オー・エイチ・ティー株式会社 容量センサ及び容量センサの製造方法
WO2024103263A1 (zh) * 2022-11-15 2024-05-23 京东方科技集团股份有限公司 压力传感器及其制备方法、电子装置

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Also Published As

Publication number Publication date
JP2000022172A (ja) 2000-01-21
EP0969694A3 (de) 2005-06-01
CN1247386A (zh) 2000-03-15
NO993213L (no) 2000-01-04
NO993213D0 (no) 1999-06-28
CN1145219C (zh) 2004-04-07
NO322331B1 (no) 2006-09-18
DK0969694T3 (da) 2007-05-14
US6756248B2 (en) 2004-06-29
US20020093038A1 (en) 2002-07-18
US6441451B1 (en) 2002-08-27
DE69934841T2 (de) 2007-10-11
EP0969694B1 (de) 2007-01-17
EP0969694A2 (de) 2000-01-05

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Legal Events

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8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP