DE69832845D1 - Elektroplattierungsverfahren - Google Patents

Elektroplattierungsverfahren

Info

Publication number: DE69832845D1
Authority: DE; Germany
Prior art keywords: electroplating
Prior art date: 1997-06-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69832845T

Other languages

English (en)

Other versions

DE69832845T2 (de

Inventor

Edward C Couble

Mark J Kapeckas

Steven M Florio

David L Jacques

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shipley Co Inc

Rohm and Haas Electronic Materials LLC

Original Assignee

Shipley Co Inc

Shipley Co LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-06-03

Filing date

1998-05-25

Publication date

2006-01-26

1998-05-25 Application filed by Shipley Co Inc, Shipley Co LLC filed Critical Shipley Co Inc

2006-01-26 Application granted granted Critical

2006-01-26 Publication of DE69832845D1 publication Critical patent/DE69832845D1/de

2006-08-10 Publication of DE69832845T2 publication Critical patent/DE69832845T2/de

2018-05-26 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electroplating Methods And Accessories (AREA)
Manufacturing Of Printed Wiring (AREA)
Chemically Coating (AREA)

DE69832845T 1997-06-03 1998-05-25 Elektroplattierungsverfahren Expired - Lifetime DE69832845T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US08/868,092 US6565731B1 (en)	1997-06-03	1997-06-03	Electroplating process
US868092		1997-06-03

Publications (2)

Publication Number	Publication Date
DE69832845D1 true DE69832845D1 (de)	2006-01-26
DE69832845T2 DE69832845T2 (de)	2006-08-10

Family

ID=25351058

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69832845T Expired - Lifetime DE69832845T2 (de)	1997-06-03	1998-05-25	Elektroplattierungsverfahren

Country Status (5)

Country	Link
US (1)	US6565731B1 (de)
EP (1)	EP0883331B1 (de)
JP (1)	JP4249291B2 (de)
KR (1)	KR100674116B1 (de)
DE (1)	DE69832845T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6565729B2 (en)	1998-03-20	2003-05-20	Semitool, Inc.	Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) *	1998-03-20	2004-06-21	Semitool Inc	Apparatus for applying a metal structure to a workpiece
JP4055319B2 (ja) *	2000-02-18	2008-03-05	ソニー株式会社	半導体装置の製造方法
EP1202384A1 (de) *	2000-10-31	2002-05-02	Molekulare Energietechnik AG	Funkantenne als Sendeantenne oder Empfangsantenne und Mobilfunksystem
EP1598449B1 (de) *	2004-04-26	2010-08-04	Rohm and Haas Electronic Materials, L.L.C.	Verbessertes Plattierungsverfahren
JP4783954B2 (ja) *	2004-06-21	2011-09-28	Ｄｏｗａメタルテック株式会社	複合めっき材およびその製造方法
US7214304B2 (en) *	2004-10-13	2007-05-08	Hyunjung Lee	Process for preparing a non-conductive substrate for electroplating
JP4806808B2 (ja) *	2005-07-05	2011-11-02	Ｄｏｗａメタルテック株式会社	複合めっき材およびその製造方法
US20100151224A1 (en) *	2006-03-30	2010-06-17	Metafoam Technologies Inc.	Method for partially coating open cell porous materials
JP4692363B2 (ja) *	2006-04-10	2011-06-01	日立電線株式会社	配線基板のめっき形成方法、及びめっき装置
JP5715748B2 (ja) *	2008-10-31	2015-05-13	ロームアンドハースエレクトロニックマテリアルズエルエルシーＲｏｈｍａｎｄＨａａｓＥｌｅｃｔｒｏｎｉｃＭａｔｅｒｉａｌｓＬＬＣ	無電解めっき用コンディショナー
US8161637B2 (en)	2009-07-24	2012-04-24	Ibiden Co., Ltd.	Manufacturing method for printed wiring board
KR101537638B1 (ko) *	2010-05-18	2015-07-17	삼성전자 주식회사	그라펜 박막을 이용한 수지의 도금 방법
US10986738B2 (en) *	2018-05-08	2021-04-20	Macdermid Enthone Inc.	Carbon-based direct plating process

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3674711A (en) *	1969-12-10	1972-07-04	Varian Associates	Electrically conductive transparent plastic material
CA956850A (en)	1970-03-16	1974-10-29	Frederick W. Schneble (Jr.)	Direct bonding of electroless metals to substrates
US3962497A (en) *	1975-03-11	1976-06-08	Oxy Metal Industries Corporation	Method for treating polymeric substrates prior to plating
US4309247A (en) *	1976-03-15	1982-01-05	Amf Incorporated	Filter and method of making same
US4701350B2 (en)	1980-11-06	1997-08-05	Surface Technology Corp	Process for electroless metal deposition
US4515829A (en)	1983-10-14	1985-05-07	Shipley Company Inc.	Through-hole plating
US4619741A (en)	1985-04-11	1986-10-28	Olin Hunt Specialty Products Inc.	Process for preparing a non-conductive substrate for electroplating
US5015339A (en) *	1990-03-26	1991-05-14	Olin Hunt Sub Iii Corp.	Process for preparing nonconductive substrates
US5110355A (en) *	1990-03-26	1992-05-05	Olin Hunt Sub Iii Corp.	Process for preparing nonconductive substrates
US5143592A (en) *	1990-06-01	1992-09-01	Olin Corporation	Process for preparing nonconductive substrates
US5683565A (en) *	1995-06-09	1997-11-04	Shipley Company, L.L.C.	Electroplating process
US5611905A (en)	1995-06-09	1997-03-18	Shipley Company, L.L.C.	Electroplating process

1997
- 1997-06-03 US US08/868,092 patent/US6565731B1/en not_active Expired - Fee Related
1998
- 1998-05-25 DE DE69832845T patent/DE69832845T2/de not_active Expired - Lifetime
- 1998-05-25 EP EP98109457A patent/EP0883331B1/de not_active Expired - Lifetime
- 1998-06-03 JP JP19227098A patent/JP4249291B2/ja not_active Expired - Fee Related
- 1998-06-03 KR KR1019980021186A patent/KR100674116B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
KR19990006763A (ko)	1999-01-25
JPH11177214A (ja)	1999-07-02
KR100674116B1 (ko)	2007-06-04
EP0883331B1 (de)	2005-12-21
DE69832845T2 (de)	2006-08-10
EP0883331A2 (de)	1998-12-09
US6565731B1 (en)	2003-05-20
JP4249291B2 (ja)	2009-04-02
EP0883331A3 (de)	2001-08-01

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DE19810476B4 (de)	2005-10-20	Laryngomaske
ATA93198A (de)	2001-01-15	Fluoxetinpellets
DE69802367D1 (de)	2001-12-13	Plattierungsverfahren
DE69832845D1 (de)	2006-01-26	Elektroplattierungsverfahren
ATA111897A (de)	1999-06-15	Kimme
DE59710388D1 (de)	2003-08-07	Mikropolarimeter
BR9801805A (pt)	1999-05-25	Dioxacicloalcan-8-ona
DK0915189T3 (da)	2004-01-26	Elektropletteringsapparat
ATE236897T1 (de)	2003-04-15	3-benzylpiperidine
ATA112597A (de)	1999-03-15	Snowboard - bindung
EP0949331A4 (de)	2001-05-02	Etablierte Mikrogliazellen
DE69713849D1 (de)	2002-08-14	Elektroplattierungsverfahren
FI972138A0 (fi)	1997-05-20	Returtraog i bestrykningsanordning
ATA86797A (de)	2002-02-15	Verschleissschuh
ATA46498A (de)	2002-02-15	Kunststoffgleitbahn
BR9701194A (pt)	1998-12-15	Hidrociclo
FI974373A0 (fi)	1997-12-01	Avgasutlopp i utombordsmotorer
FI974635A0 (fi)	1997-12-29	I vaermebatteri integrerbar ventilkonstruktion
BR9701099A (pt)	1998-12-15	Acertrol i
FI974354A0 (fi)	1997-11-27	Kvaevereducering i avloppsvatten
FI972997A0 (fi)	1997-07-15	Anordning i en sugsamlarvagn
FI972891A0 (fi)	1997-07-08	I en vaeggkonstruktion infaellbart faerdigt elkanalnaet
FI972640A0 (fi)	1997-06-19	Gapformare i en pappersmaskin/kartongmaskin
FI971123A0 (fi)	1997-03-18	Foervarings- och transportredskap i synnerhet foer pappersprodukter
FI971651A0 (fi)	1997-04-18	Spaormaskin i en elmaskin

Legal Events

Date	Code	Title	Description
2007-01-18	8364	No opposition during term of opposition