DE69825939D1 - Anordnung mit Quanten-Schachteln - Google Patents
Anordnung mit Quanten-SchachtelnInfo
- Publication number
- DE69825939D1 DE69825939D1 DE69825939T DE69825939T DE69825939D1 DE 69825939 D1 DE69825939 D1 DE 69825939D1 DE 69825939 T DE69825939 T DE 69825939T DE 69825939 T DE69825939 T DE 69825939T DE 69825939 D1 DE69825939 D1 DE 69825939D1
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- quantum boxes
- quantum
- boxes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
- B05D1/20—Processes for applying liquids or other fluent materials performed by dipping substances to be applied floating on a fluid
- B05D1/202—Langmuir Blodgett films (LB films)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/402—Single electron transistors; Coulomb blockade transistors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/045—Manufacture or treatment of PN junction diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N99/00—Subject matter not provided for in other groups of this subclass
- H10N99/05—Devices based on quantum mechanical effects, e.g. quantum interference devices or metal single-electron transistors
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2216/00—Indexing scheme relating to G11C16/00 and subgroups, for features not directly covered by these groups
- G11C2216/02—Structural aspects of erasable programmable read-only memories
- G11C2216/08—Nonvolatile memory wherein data storage is accomplished by storing relatively few electrons in the storage layer, i.e. single electron memory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
- H10H20/818—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/939—Langmuir-blodgett film utilization
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/947—Subphotolithographic processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/962—Quantum dots and lines
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Composite Materials (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Weting (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15743697 | 1997-05-30 | ||
JP15743697 | 1997-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69825939D1 true DE69825939D1 (de) | 2004-10-07 |
DE69825939T2 DE69825939T2 (de) | 2005-09-15 |
Family
ID=15649615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69825939T Expired - Lifetime DE69825939T2 (de) | 1997-05-30 | 1998-05-29 | Anordnung mit Quanten-Schachteln |
Country Status (3)
Country | Link |
---|---|
US (5) | US6121075A (de) |
EP (2) | EP0881691B1 (de) |
DE (1) | DE69825939T2 (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0926260A3 (de) | 1997-12-12 | 2001-04-11 | Matsushita Electric Industrial Co., Ltd. | Verwendung der Antikörper - Antigen Wechselwirkung zur Herstellung eines Metallfilmmusters |
KR100268936B1 (ko) * | 1997-12-16 | 2000-10-16 | 김영환 | 반도체 소자의 양자점 형성 방법 |
EP2045334A1 (de) | 1998-06-24 | 2009-04-08 | Illumina, Inc. | Dekodierung von Arraysensoren mit Mikrosphären |
US6507042B1 (en) * | 1998-12-25 | 2003-01-14 | Fujitsu Limited | Semiconductor device and method of manufacturing the same |
US6544732B1 (en) * | 1999-05-20 | 2003-04-08 | Illumina, Inc. | Encoding and decoding of array sensors utilizing nanocrystals |
US6583916B2 (en) | 1999-11-03 | 2003-06-24 | Optodot Corporation | Optical shutter assembly |
US6724512B2 (en) | 1999-11-03 | 2004-04-20 | Optodot Corporation | Optical switch device |
US7019333B1 (en) | 1999-11-16 | 2006-03-28 | Kabushiki Kaisha Toshiba | Photon source |
GB2377550B (en) * | 1999-11-23 | 2003-11-12 | Toshiba Res Europ Ltd | A photon source |
US20030013096A1 (en) | 2000-03-16 | 2003-01-16 | Ichiro Yamashita | Nucleotide detector, process for producing the same and process for morming forming fine particle membrane |
CN1407947A (zh) | 2000-03-16 | 2003-04-02 | 松下电器产业株式会社 | 细微构造体的精密加工方法 |
US6694158B2 (en) | 2001-04-11 | 2004-02-17 | Motorola, Inc. | System using a portable detection device for detection of an analyte through body tissue |
US6379622B1 (en) * | 2001-04-11 | 2002-04-30 | Motorola, Inc. | Sensor incorporating a quantum dot as a reference |
US7521019B2 (en) * | 2001-04-11 | 2009-04-21 | Lifescan, Inc. | Sensor device and methods for manufacture |
US7033613B2 (en) | 2001-05-14 | 2006-04-25 | Matsushita Electric Industrial Co., Ltd. | Recombinant cage-like protein, method for producing the same, precious metal-recombinant cage-like protein complex, method for producing the same and recombinant DNA |
US6653653B2 (en) | 2001-07-13 | 2003-11-25 | Quantum Logic Devices, Inc. | Single-electron transistors and fabrication methods in which a projecting feature defines spacing between electrodes |
US6483125B1 (en) | 2001-07-13 | 2002-11-19 | North Carolina State University | Single electron transistors in which the thickness of an insulating layer defines spacing between electrodes |
US7816491B2 (en) | 2001-11-08 | 2010-10-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ordered biological nanostructures formed from chaperonin polypeptides |
US20040142578A1 (en) * | 2002-03-28 | 2004-07-22 | Ulrich Wiesner | Thin film nanostructures |
JP3683265B2 (ja) | 2002-05-28 | 2005-08-17 | 松下電器産業株式会社 | ナノ粒子の製造方法及び該製造方法によって製造されたナノ粒子 |
KR100568701B1 (ko) * | 2002-06-19 | 2006-04-07 | 니폰덴신뎅와 가부시키가이샤 | 반도체 발광 소자 |
US6673717B1 (en) | 2002-06-26 | 2004-01-06 | Quantum Logic Devices, Inc. | Methods for fabricating nanopores for single-electron devices |
JP3703479B2 (ja) * | 2002-09-20 | 2005-10-05 | 松下電器産業株式会社 | ナノ粒子の製造方法及び該製造方法によって製造されたナノ粒子 |
GB2393729A (en) * | 2002-10-04 | 2004-04-07 | Nanomagnetics Ltd | Semiconductor nanoparticles |
WO2004065000A1 (en) | 2003-01-21 | 2004-08-05 | Illumina Inc. | Chemical reaction monitor |
JPWO2004110930A1 (ja) * | 2003-06-12 | 2006-07-20 | 松下電器産業株式会社 | ナノ粒子含有複合多孔体およびその製造方法 |
US7041530B2 (en) * | 2003-06-12 | 2006-05-09 | Matsushita Electric Industrial Co., Ltd. | Method of production of nano particle dispersed composite material |
US7132677B2 (en) * | 2004-02-13 | 2006-11-07 | Dongguk University | Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same |
US8828792B2 (en) * | 2004-05-25 | 2014-09-09 | The Trustees Of The University Of Pennsylvania | Nanostructure assemblies, methods and devices thereof |
WO2005117126A1 (ja) | 2004-05-27 | 2005-12-08 | Matsushita Electric Industrial Co., Ltd. | 基板上への微粒子配列体の形成方法および半導体素子 |
KR100597280B1 (ko) * | 2004-07-01 | 2006-07-06 | 한국기계연구원 | 랭뮤어 블로제트을 이용한 나노 물질의 부착방법 |
KR100611491B1 (ko) * | 2004-08-26 | 2006-08-10 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
US7306963B2 (en) | 2004-11-30 | 2007-12-11 | Spire Corporation | Precision synthesis of quantum dot nanostructures for fluorescent and optoelectronic devices |
US7514725B2 (en) * | 2004-11-30 | 2009-04-07 | Spire Corporation | Nanophotovoltaic devices |
JP4585523B2 (ja) * | 2004-12-28 | 2010-11-24 | 独立行政法人科学技術振興機構 | 自己組織化材料または微粒子を基板上に固定化する方法、および当該方法を用いて作製した基板 |
US8039368B2 (en) * | 2005-03-21 | 2011-10-18 | The Trustees Of The University Of Pennsylvania | Nanogaps: methods and devices containing same |
JP4551811B2 (ja) * | 2005-04-27 | 2010-09-29 | 株式会社東芝 | 半導体装置の製造方法 |
US20080220982A1 (en) * | 2005-07-26 | 2008-09-11 | Vu Tania Q | Nanoparticle Probes for Capture, Sorting and Placement of Targets |
US20070118861A1 (en) * | 2005-11-21 | 2007-05-24 | General Instrument Corporation | System and method for delivering graphics received through a cable television system to a digital television |
US20070116833A1 (en) * | 2005-11-23 | 2007-05-24 | The Coca-Cola Company | High-Potency Sweetener Composition with Calcium and Compositions Sweetened Therewith |
WO2007143197A2 (en) | 2006-06-02 | 2007-12-13 | Qd Vision, Inc. | Light-emitting devices and displays with improved performance |
JP2010508620A (ja) * | 2006-09-12 | 2010-03-18 | キユーデイー・ビジヨン・インコーポレーテツド | 所定のパターンを表示するために有用なエレクトロルミネセントディスプレイ |
WO2008063653A1 (en) | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Semiconductor nanocrystals and compositions and devices including same |
WO2008063658A2 (en) | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Semiconductor nanocrystals and compositions and devices including same |
WO2008063652A1 (en) | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Blue emitting semiconductor nanocrystals and compositions and devices including same |
KR100928561B1 (ko) * | 2007-12-22 | 2009-11-25 | 서강대학교산학협력단 | 생체물질 기반 전자 디바이스 |
JP5382489B2 (ja) * | 2008-03-29 | 2014-01-08 | 国立大学法人 奈良先端科学技術大学院大学 | 円偏光発光性ナノ微粒子 |
CN102047098B (zh) | 2008-04-03 | 2016-05-04 | Qd视光有限公司 | 包括量子点的发光器件 |
US9525148B2 (en) | 2008-04-03 | 2016-12-20 | Qd Vision, Inc. | Device including quantum dots |
US8357960B1 (en) * | 2008-09-18 | 2013-01-22 | Banpil Photonics, Inc. | Multispectral imaging device and manufacturing thereof |
US8415759B2 (en) | 2010-11-23 | 2013-04-09 | Raytheon Company | Down-converting and detecting photons |
TWI408746B (zh) * | 2011-01-19 | 2013-09-11 | Lextar Electronics Corp | 圖形化基板之製造方法 |
WO2013019299A2 (en) * | 2011-05-11 | 2013-02-07 | Qd Vision, Inc. | Method for processing devices including quantum dots and devices |
US9091748B2 (en) | 2012-04-18 | 2015-07-28 | Raytheon Company | Methods and apparatus for 3D UV imaging |
CN106340573A (zh) * | 2016-08-15 | 2017-01-18 | Tcl集团股份有限公司 | 一种lb量子点薄膜、发光二极管及其制备方法 |
CN106784186B (zh) * | 2016-12-23 | 2020-07-21 | Tcl科技集团股份有限公司 | 一种lb量子点薄膜、发光二极管及制备方法 |
EP3736747A1 (de) * | 2019-05-09 | 2020-11-11 | Cadet, Xavier | Quantenspeicher und zugehörige anwendungen |
WO2021064909A1 (ja) * | 2019-10-02 | 2021-04-08 | シャープ株式会社 | 表示装置、および表示装置の製造方法 |
US12030081B2 (en) | 2019-10-07 | 2024-07-09 | The University Of Chicago | Large lateral scale two-dimensional materials and other thin films, and associated systems and methods |
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DE3603449A1 (de) * | 1986-02-05 | 1987-08-06 | Basf Ag | Dehnungsmessstreifen mit einer duennen diskontinuierlichen metallschicht |
US4728591A (en) * | 1986-03-07 | 1988-03-01 | Trustees Of Boston University | Self-assembled nanometer lithographic masks and templates and method for parallel fabrication of nanometer scale multi-device structures |
US4802951A (en) * | 1986-03-07 | 1989-02-07 | Trustees Of Boston University | Method for parallel fabrication of nanometer scale multi-device structures |
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JP3181070B2 (ja) * | 1991-05-23 | 2001-07-03 | キヤノン株式会社 | 量子箱半導体素子 |
US5412499A (en) * | 1993-03-29 | 1995-05-02 | At&T Corp. | Spatial light modulator using quantum well material |
JP3435791B2 (ja) * | 1994-03-22 | 2003-08-11 | ソニー株式会社 | 量子素子 |
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ATE194727T1 (de) * | 1993-12-17 | 2000-07-15 | Canon Kk | Herstellungsverfahren einer elektronen emittierenden vorrichtung, einer elektronenquelle und eine bilderzeugungsvorrichtung |
JPH07202164A (ja) * | 1993-12-28 | 1995-08-04 | Furukawa Electric Co Ltd:The | 半導体微細構造の製作方法 |
JPH07211913A (ja) * | 1994-01-27 | 1995-08-11 | Hitachi Ltd | 半導体装置及びその製造方法 |
US5710436A (en) | 1994-09-27 | 1998-01-20 | Kabushiki Kaisha Toshiba | Quantum effect device |
JP3174999B2 (ja) * | 1995-08-03 | 2001-06-11 | キヤノン株式会社 | 電子放出素子、電子源、それを用いた画像形成装置、及びそれらの製造方法 |
JPH09135017A (ja) * | 1995-09-08 | 1997-05-20 | Sony Corp | 量子デバイスの製造方法 |
EP0788149A1 (de) | 1996-02-05 | 1997-08-06 | Hitachi Europe Limited | Verfahren zum Ablegen von nanometrischen Partikeln |
DE19621994C1 (de) | 1996-05-31 | 1997-06-12 | Siemens Ag | Einzelelektron-Speicherzellenanordnung |
US6159620A (en) * | 1997-03-31 | 2000-12-12 | The Regents Of The University Of California | Single-electron solid state electronic device |
CN1407947A (zh) * | 2000-03-16 | 2003-04-02 | 松下电器产业株式会社 | 细微构造体的精密加工方法 |
-
1998
- 1998-05-29 EP EP98109886A patent/EP0881691B1/de not_active Expired - Lifetime
- 1998-05-29 EP EP01118939A patent/EP1154493A3/de not_active Withdrawn
- 1998-05-29 DE DE69825939T patent/DE69825939T2/de not_active Expired - Lifetime
-
1999
- 1999-01-11 US US09/228,276 patent/US6121075A/en not_active Expired - Lifetime
-
2000
- 2000-05-24 US US09/577,138 patent/US6319738B1/en not_active Expired - Fee Related
- 2000-07-17 US US09/617,799 patent/US6287928B1/en not_active Expired - Fee Related
-
2001
- 2001-09-21 US US09/956,823 patent/US6635494B2/en not_active Expired - Fee Related
-
2003
- 2003-06-09 US US10/456,496 patent/US7015139B2/en not_active Expired - Fee Related
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US20020013037A1 (en) | 2002-01-31 |
EP0881691A2 (de) | 1998-12-02 |
US6287928B1 (en) | 2001-09-11 |
US6319738B1 (en) | 2001-11-20 |
EP1154493A3 (de) | 2003-10-15 |
EP0881691A3 (de) | 1999-09-01 |
US20030209703A1 (en) | 2003-11-13 |
DE69825939T2 (de) | 2005-09-15 |
EP1154493A2 (de) | 2001-11-14 |
US7015139B2 (en) | 2006-03-21 |
US6635494B2 (en) | 2003-10-21 |
US6121075A (en) | 2000-09-19 |
EP0881691B1 (de) | 2004-09-01 |
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Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |