DE69727809D1 - Mehrschichtenfilmkondensatoranordnungen und verfahren zur herstellung - Google Patents
Mehrschichtenfilmkondensatoranordnungen und verfahren zur herstellungInfo
- Publication number
- DE69727809D1 DE69727809D1 DE69727809T DE69727809T DE69727809D1 DE 69727809 D1 DE69727809 D1 DE 69727809D1 DE 69727809 T DE69727809 T DE 69727809T DE 69727809 T DE69727809 T DE 69727809T DE 69727809 D1 DE69727809 D1 DE 69727809D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- same
- multilayer film
- film capacitor
- capacitor arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US671057 | 1991-03-18 | ||
US08/671,057 US5745335A (en) | 1996-06-27 | 1996-06-27 | Multi-layer film capacitor structures and method |
PCT/CA1997/000456 WO1998000871A1 (en) | 1996-06-27 | 1997-06-26 | Multi-layer film capacitor structures and method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69727809D1 true DE69727809D1 (de) | 2004-04-01 |
DE69727809T2 DE69727809T2 (de) | 2005-01-13 |
Family
ID=24692974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997627809 Expired - Fee Related DE69727809T2 (de) | 1996-06-27 | 1997-06-26 | Mehrschichtenfilmkondensatoranordnungen und verfahren zur herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5745335A (de) |
EP (2) | EP1408537A3 (de) |
JP (3) | JP2000514243A (de) |
AU (1) | AU3250097A (de) |
DE (1) | DE69727809T2 (de) |
DK (1) | DK0913001T3 (de) |
WO (1) | WO1998000871A1 (de) |
Families Citing this family (100)
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EP1043740B1 (de) * | 1999-04-09 | 2006-08-23 | STMicroelectronics N.V. | Schichtförmige Kondensatorvorrichtung |
SE513809C2 (sv) * | 1999-04-13 | 2000-11-06 | Ericsson Telefon Ab L M | Avstämbara mikrovågsanordningar |
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US6801422B2 (en) * | 1999-12-28 | 2004-10-05 | Intel Corporation | High performance capacitor |
US6724611B1 (en) * | 2000-03-29 | 2004-04-20 | Intel Corporation | Multi-layer chip capacitor |
US6411494B1 (en) * | 2000-04-06 | 2002-06-25 | Gennum Corporation | Distributed capacitor |
US6970362B1 (en) * | 2000-07-31 | 2005-11-29 | Intel Corporation | Electronic assemblies and systems comprising interposer with embedded capacitors |
US6611419B1 (en) | 2000-07-31 | 2003-08-26 | Intel Corporation | Electronic assembly comprising substrate with embedded capacitors |
US6775150B1 (en) | 2000-08-30 | 2004-08-10 | Intel Corporation | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
US7327582B2 (en) * | 2000-09-21 | 2008-02-05 | Ultrasource, Inc. | Integrated thin film capacitor/inductor/interconnect system and method |
US6890629B2 (en) | 2001-09-21 | 2005-05-10 | Michael D. Casper | Integrated thin film capacitor/inductor/interconnect system and method |
US6761963B2 (en) | 2000-09-21 | 2004-07-13 | Michael D. Casper | Integrated thin film capacitor/inductor/interconnect system and method |
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JP2003060054A (ja) | 2001-08-10 | 2003-02-28 | Rohm Co Ltd | 強誘電体キャパシタを有する半導体装置 |
US7425877B2 (en) * | 2001-09-21 | 2008-09-16 | Ultrasource, Inc. | Lange coupler system and method |
US6998696B2 (en) | 2001-09-21 | 2006-02-14 | Casper Michael D | Integrated thin film capacitor/inductor/interconnect system and method |
JP2004095638A (ja) * | 2002-08-29 | 2004-03-25 | Fujitsu Ltd | 薄膜デカップリングキャパシタとその製造方法 |
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US8569142B2 (en) * | 2003-11-28 | 2013-10-29 | Blackberry Limited | Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
JP4937495B2 (ja) * | 2003-12-25 | 2012-05-23 | 新光電気工業株式会社 | キャパシタ装置、電子部品実装構造及びキャパシタ装置の製造方法 |
DE102004026232B4 (de) * | 2004-05-28 | 2006-05-04 | Infineon Technologies Ag | Verfahren zum Ausbilden einer integrierten Halbleiterschaltungsanordnung |
JP2006108291A (ja) * | 2004-10-04 | 2006-04-20 | Seiko Epson Corp | 強誘電体キャパシタ及びその製造方法、並びに強誘電体メモリ装置 |
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JP2008277546A (ja) * | 2007-04-27 | 2008-11-13 | Rohm Co Ltd | 半導体装置 |
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WO2009078225A1 (ja) | 2007-12-14 | 2009-06-25 | Murata Manufacturing Co., Ltd. | 薄膜積層キャパシタの製造方法 |
JP5282194B2 (ja) * | 2008-02-01 | 2013-09-04 | セイコーNpc株式会社 | 可変容量装置 |
JP4660566B2 (ja) * | 2008-03-17 | 2011-03-30 | 株式会社東芝 | 不揮発性半導体記憶装置 |
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JP2013207123A (ja) | 2012-03-29 | 2013-10-07 | Toshiba Corp | 半導体装置 |
JP6104370B2 (ja) * | 2012-06-09 | 2017-03-29 | ジョンソン コントロールズ オートモーティブ エレクトロニクス ゲーエムベーハー | 容量センサー配列および容量センサー配列を備えるタッチセンサー式スクリーン |
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JP2018063989A (ja) | 2016-10-11 | 2018-04-19 | Tdk株式会社 | 薄膜キャパシタ |
JP2018073888A (ja) * | 2016-10-25 | 2018-05-10 | 大日本印刷株式会社 | 電子部品およびその製造方法 |
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US10923286B2 (en) | 2018-02-21 | 2021-02-16 | Nxp Usa, Inc. | Method and apparatus for compensating for high thermal expansion coefficient mismatch of a stacked device |
JP6988688B2 (ja) * | 2018-05-21 | 2022-01-05 | 株式会社デンソー | 半導体装置 |
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KR20210102911A (ko) | 2018-12-03 | 2021-08-20 | 안타그 테라퓨틱스 에이피에스 | 변형된 gip 펩티드 유사체 |
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KR102668436B1 (ko) * | 2021-11-08 | 2024-05-24 | (주)위드멤스 | 트렌치 커패시터 및 이의 제조 방법 |
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-
1996
- 1996-06-27 US US08/671,057 patent/US5745335A/en not_active Expired - Lifetime
-
1997
- 1997-06-26 AU AU32500/97A patent/AU3250097A/en not_active Abandoned
- 1997-06-26 WO PCT/CA1997/000456 patent/WO1998000871A1/en active IP Right Grant
- 1997-06-26 EP EP03078542A patent/EP1408537A3/de not_active Withdrawn
- 1997-06-26 DK DK97928073T patent/DK0913001T3/da active
- 1997-06-26 EP EP97928073A patent/EP0913001B1/de not_active Expired - Lifetime
- 1997-06-26 JP JP10503681A patent/JP2000514243A/ja not_active Ceased
- 1997-06-26 DE DE1997627809 patent/DE69727809T2/de not_active Expired - Fee Related
-
2009
- 2009-02-04 JP JP2009023545A patent/JP5225879B2/ja not_active Expired - Lifetime
-
2012
- 2012-10-29 JP JP2012237968A patent/JP5695628B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0913001B1 (de) | 2004-02-25 |
JP5225879B2 (ja) | 2013-07-03 |
JP2009152621A (ja) | 2009-07-09 |
AU3250097A (en) | 1998-01-21 |
JP2000514243A (ja) | 2000-10-24 |
EP0913001A1 (de) | 1999-05-06 |
WO1998000871A1 (en) | 1998-01-08 |
JP5695628B2 (ja) | 2015-04-08 |
DK0913001T3 (da) | 2004-06-28 |
EP1408537A3 (de) | 2004-07-07 |
EP1408537A2 (de) | 2004-04-14 |
DE69727809T2 (de) | 2005-01-13 |
US5745335A (en) | 1998-04-28 |
JP2013055344A (ja) | 2013-03-21 |
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