DE69622295D1 - MIS-Anordnung und Verfahren zur Herstellung - Google Patents
MIS-Anordnung und Verfahren zur HerstellungInfo
- Publication number
- DE69622295D1 DE69622295D1 DE69622295T DE69622295T DE69622295D1 DE 69622295 D1 DE69622295 D1 DE 69622295D1 DE 69622295 T DE69622295 T DE 69622295T DE 69622295 T DE69622295 T DE 69622295T DE 69622295 D1 DE69622295 D1 DE 69622295D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- mis
- arrangement
- mis arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
- H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/152—Source regions of DMOS transistors
- H10D62/154—Dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/8303—Diamond
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H10D62/822—Heterojunctions comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7020417A JPH08213607A (ja) | 1995-02-08 | 1995-02-08 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69622295D1 true DE69622295D1 (de) | 2002-08-22 |
DE69622295T2 DE69622295T2 (de) | 2003-02-27 |
Family
ID=12026468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69622295T Expired - Fee Related DE69622295T2 (de) | 1995-02-08 | 1996-02-07 | MIS-Anordnung und Verfahren zur Herstellung |
Country Status (4)
Country | Link |
---|---|
US (2) | US6002143A (de) |
EP (1) | EP0726604B1 (de) |
JP (1) | JPH08213607A (de) |
DE (1) | DE69622295T2 (de) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5558313A (en) * | 1992-07-24 | 1996-09-24 | Siliconix Inorporated | Trench field effect transistor with reduced punch-through susceptibility and low RDSon |
DE19610135C1 (de) * | 1996-03-14 | 1997-06-19 | Siemens Ag | Elektronische Einrichtung, insbesondere zum Schalten elektrischer Ströme, für hohe Sperrspannungen und mit geringen Durchlaßverlusten |
EP0893830A1 (de) * | 1996-12-11 | 1999-01-27 | The Kansai Electric Power Co., Inc. | Halbleiteranordnung mit isoliertem gate |
DE19711165A1 (de) * | 1997-03-18 | 1998-09-24 | Smi Syst Microelect Innovat | Kontaktanordnung einer planaren, integrierbaren Halbleiteranordnung und Verfahren zur Herstellung dieser Kontaktanordnung |
KR20000068738A (ko) * | 1997-08-13 | 2000-11-25 | 모리시타 요이찌 | 반도체기판 및 반도체소자 |
US6426260B1 (en) * | 1997-12-02 | 2002-07-30 | Magepower Semiconductor Corp. | Switching speed improvement in DMO by implanting lightly doped region under gate |
JP3428459B2 (ja) * | 1998-09-01 | 2003-07-22 | 富士電機株式会社 | 炭化けい素nチャネルMOS半導体素子およびその製造方法 |
US6855983B1 (en) * | 1998-11-10 | 2005-02-15 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device having reduced on resistance |
JP4017826B2 (ja) * | 1998-12-18 | 2007-12-05 | インフィネオン テクノロジース アクチエンゲゼルシャフト | 溝形のゲート電極を有する電界効果型トランジスタセルデバイス |
US6211018B1 (en) * | 1999-08-14 | 2001-04-03 | Electronics And Telecommunications Research Institute | Method for fabricating high density trench gate type power device |
US6429041B1 (en) * | 2000-07-13 | 2002-08-06 | Cree, Inc. | Methods of fabricating silicon carbide inversion channel devices without the need to utilize P-type implantation |
US6501099B2 (en) * | 2001-03-05 | 2002-12-31 | The United States Of America As Represented By The Secretary Of The Army | Modified-anode gate turn-off thyristor |
US6770911B2 (en) * | 2001-09-12 | 2004-08-03 | Cree, Inc. | Large area silicon carbide devices |
US6734462B1 (en) | 2001-12-07 | 2004-05-11 | The United States Of America As Represented By The Secretary Of The Army | Silicon carbide power devices having increased voltage blocking capabilities |
US6900477B1 (en) | 2001-12-07 | 2005-05-31 | The United States Of America As Represented By The Secretary Of The Army | Processing technique to improve the turn-off gain of a silicon carbide gate turn-off thyristor and an article of manufacture |
CA2381128A1 (en) * | 2002-04-09 | 2003-10-09 | Quantiscript Inc. | Plasma polymerized electron beam resist |
US7217950B2 (en) * | 2002-10-11 | 2007-05-15 | Nissan Motor Co., Ltd. | Insulated gate tunnel-injection device having heterojunction and method for manufacturing the same |
US7221010B2 (en) * | 2002-12-20 | 2007-05-22 | Cree, Inc. | Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors |
US6979863B2 (en) * | 2003-04-24 | 2005-12-27 | Cree, Inc. | Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same |
US7074643B2 (en) * | 2003-04-24 | 2006-07-11 | Cree, Inc. | Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same |
FR2868209B1 (fr) * | 2004-03-25 | 2006-06-16 | Commissariat Energie Atomique | Transistor a effet de champ a canal en carbone diamant |
US20050269630A1 (en) * | 2004-06-04 | 2005-12-08 | Jianjun Cao | Trench type semiconductor device with reduced Qgd |
US7118970B2 (en) * | 2004-06-22 | 2006-10-10 | Cree, Inc. | Methods of fabricating silicon carbide devices with hybrid well regions |
JP4862254B2 (ja) * | 2004-09-28 | 2012-01-25 | 日産自動車株式会社 | 半導体装置の製造方法 |
EP1641030B1 (de) * | 2004-09-28 | 2012-01-11 | Nissan Motor Co., Ltd. | Verfahren zur Herstellung eines Halbleiterbauelements |
JP2006128506A (ja) * | 2004-10-29 | 2006-05-18 | Sharp Corp | トレンチ型mosfet及びその製造方法 |
JP2006245243A (ja) * | 2005-03-02 | 2006-09-14 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
US7588961B2 (en) | 2005-03-30 | 2009-09-15 | Nissan Motor Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP4956771B2 (ja) * | 2005-03-30 | 2012-06-20 | 日産自動車株式会社 | 半導体装置 |
JP4802542B2 (ja) * | 2005-04-19 | 2011-10-26 | 株式会社デンソー | 炭化珪素半導体装置 |
US7391057B2 (en) * | 2005-05-18 | 2008-06-24 | Cree, Inc. | High voltage silicon carbide devices having bi-directional blocking capabilities |
US7414268B2 (en) | 2005-05-18 | 2008-08-19 | Cree, Inc. | High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities |
US20060261346A1 (en) * | 2005-05-18 | 2006-11-23 | Sei-Hyung Ryu | High voltage silicon carbide devices having bi-directional blocking capabilities and methods of fabricating the same |
US7615801B2 (en) * | 2005-05-18 | 2009-11-10 | Cree, Inc. | High voltage silicon carbide devices having bi-directional blocking capabilities |
US7528040B2 (en) | 2005-05-24 | 2009-05-05 | Cree, Inc. | Methods of fabricating silicon carbide devices having smooth channels |
JP2006351924A (ja) * | 2005-06-17 | 2006-12-28 | Denso Corp | 半導体装置 |
JP4956776B2 (ja) * | 2005-09-08 | 2012-06-20 | 日産自動車株式会社 | 半導体装置の製造方法 |
EP1933386B1 (de) * | 2005-09-14 | 2012-11-07 | Central Research Institute of Electric Power Industry | Prozess zum herstellen einer siliziumcarbid-halbleiteranordnung |
JP5017850B2 (ja) * | 2005-11-30 | 2012-09-05 | 株式会社日立製作所 | 電力用半導体装置およびそれを用いた電力変換装置 |
US7531396B2 (en) * | 2006-03-14 | 2009-05-12 | Nissan Motor Co., Ltd. | Method of manufacturing semiconductor device |
JP4087416B2 (ja) * | 2006-04-06 | 2008-05-21 | シャープ株式会社 | パワーicデバイス及びその製造方法 |
EP1852895A1 (de) * | 2006-05-05 | 2007-11-07 | Kinik Company | Diamantsubstrat und Verfahren zu dessen Herstellung |
JP5228291B2 (ja) * | 2006-07-06 | 2013-07-03 | 日産自動車株式会社 | 半導体装置の製造方法 |
DE102006033505B4 (de) * | 2006-07-19 | 2010-09-16 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit reduziertem "Tail"-Widerstand und Herstellungsverfahren für eine solche |
US8432012B2 (en) | 2006-08-01 | 2013-04-30 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
US7728402B2 (en) * | 2006-08-01 | 2010-06-01 | Cree, Inc. | Semiconductor devices including schottky diodes with controlled breakdown |
JP5645404B2 (ja) | 2006-08-17 | 2014-12-24 | クリー インコーポレイテッドCree Inc. | 高電力絶縁ゲート・バイポーラ・トランジスタ |
US8835987B2 (en) | 2007-02-27 | 2014-09-16 | Cree, Inc. | Insulated gate bipolar transistors including current suppressing layers |
JP2009004499A (ja) * | 2007-06-20 | 2009-01-08 | Kansai Electric Power Co Inc:The | pnダイオード、電気回路装置、および電力変換装置 |
US8232558B2 (en) | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
US8124983B2 (en) * | 2008-08-28 | 2012-02-28 | Infineon Technologies Ag | Power transistor |
SG183740A1 (en) | 2009-02-20 | 2012-09-27 | Semiconductor Energy Lab | Semiconductor device and manufacturing method of the same |
US8288220B2 (en) * | 2009-03-27 | 2012-10-16 | Cree, Inc. | Methods of forming semiconductor devices including epitaxial layers and related structures |
US8294507B2 (en) | 2009-05-08 | 2012-10-23 | Cree, Inc. | Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits |
US8193848B2 (en) | 2009-06-02 | 2012-06-05 | Cree, Inc. | Power switching devices having controllable surge current capabilities |
US8629509B2 (en) * | 2009-06-02 | 2014-01-14 | Cree, Inc. | High voltage insulated gate bipolar transistors with minority carrier diverter |
US8541787B2 (en) * | 2009-07-15 | 2013-09-24 | Cree, Inc. | High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability |
US8354690B2 (en) | 2009-08-31 | 2013-01-15 | Cree, Inc. | Solid-state pinch off thyristor circuits |
US9117739B2 (en) | 2010-03-08 | 2015-08-25 | Cree, Inc. | Semiconductor devices with heterojunction barrier regions and methods of fabricating same |
US8415671B2 (en) | 2010-04-16 | 2013-04-09 | Cree, Inc. | Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices |
IT1401755B1 (it) | 2010-08-30 | 2013-08-02 | St Microelectronics Srl | Dispositivo elettronico integrato a conduzione verticale e relativo metodo di fabbricazione. |
IT1401754B1 (it) | 2010-08-30 | 2013-08-02 | St Microelectronics Srl | Dispositivo elettronico integrato e relativo metodo di fabbricazione. |
IT1401756B1 (it) | 2010-08-30 | 2013-08-02 | St Microelectronics Srl | Dispositivo elettronico integrato con struttura di terminazione di bordo e relativo metodo di fabbricazione. |
US9029945B2 (en) | 2011-05-06 | 2015-05-12 | Cree, Inc. | Field effect transistor devices with low source resistance |
US9142662B2 (en) | 2011-05-06 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with low source resistance |
JP5749580B2 (ja) * | 2011-06-16 | 2015-07-15 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
US9373617B2 (en) | 2011-09-11 | 2016-06-21 | Cree, Inc. | High current, low switching loss SiC power module |
US8680587B2 (en) | 2011-09-11 | 2014-03-25 | Cree, Inc. | Schottky diode |
US8618582B2 (en) | 2011-09-11 | 2013-12-31 | Cree, Inc. | Edge termination structure employing recesses for edge termination elements |
US8664665B2 (en) | 2011-09-11 | 2014-03-04 | Cree, Inc. | Schottky diode employing recesses for elements of junction barrier array |
US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
EP2754177A1 (de) | 2011-09-11 | 2014-07-16 | Cree, Inc. | Strommodul mit hoher stromdichte und transistoren mit verbesserter konzeption |
US20140055901A1 (en) * | 2012-08-25 | 2014-02-27 | North Carolina State University | Solid state fault isolation devices and methods |
CN103681818B (zh) * | 2012-09-12 | 2016-08-17 | 上海华虹宏力半导体制造有限公司 | 消除闩锁效应的沟槽型绝缘栅双极型晶体管器件结构及方法 |
JP6237408B2 (ja) * | 2014-03-28 | 2017-11-29 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
CN107086243A (zh) * | 2017-03-16 | 2017-08-22 | 西安电子科技大学 | 具有宽带隙材料与硅材料复合的u‑mosfet |
CN107425062A (zh) * | 2017-08-17 | 2017-12-01 | 电子科技大学 | 一种提高抗浪涌能力的栅控晶闸管器件 |
CN113436976B (zh) * | 2021-06-30 | 2022-06-14 | 泰科天润半导体科技(北京)有限公司 | 一种圆形栅功率器件的自对准p型制造方法 |
CN114361287B (zh) * | 2022-01-04 | 2024-02-23 | 中国工程物理研究院流体物理研究所 | 一种用于高温环境的硅基光触发多门极半导体开关芯片 |
CN114783873B (zh) * | 2022-06-22 | 2022-10-14 | 泰科天润半导体科技(北京)有限公司 | 具有两层外延的碳化硅凹槽mos栅控晶闸管的制造方法 |
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US4641164A (en) * | 1986-05-30 | 1987-02-03 | Rca Corporation | Bidirectional vertical power MOS device and fabrication method |
US5164325A (en) * | 1987-10-08 | 1992-11-17 | Siliconix Incorporated | Method of making a vertical current flow field effect transistor |
JP2576173B2 (ja) * | 1988-02-02 | 1997-01-29 | 日本電装株式会社 | 絶縁ゲート型半導体装置 |
JPH01196873A (ja) * | 1988-02-02 | 1989-08-08 | Sharp Corp | 炭化珪素半導体装置 |
US4994871A (en) * | 1988-12-02 | 1991-02-19 | General Electric Company | Insulated gate bipolar transistor with improved latch-up current level and safe operating area |
JPH02180077A (ja) * | 1989-01-04 | 1990-07-12 | Meidensha Corp | 電界効果トランジスタ |
US5151762A (en) * | 1990-04-12 | 1992-09-29 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device, fabricating method thereof and flash control device using the semiconductor device |
US5371378A (en) * | 1992-06-08 | 1994-12-06 | Kobe Steel Usa, Inc. | Diamond metal base/permeable base transistor and method of making same |
US5294814A (en) * | 1992-06-09 | 1994-03-15 | Kobe Steel Usa | Vertical diamond field effect transistor |
GB9216599D0 (en) * | 1992-08-05 | 1992-09-16 | Philips Electronics Uk Ltd | A semiconductor device comprising a vertical insulated gate field effect device and a method of manufacturing such a device |
US5506421A (en) * | 1992-11-24 | 1996-04-09 | Cree Research, Inc. | Power MOSFET in silicon carbide |
US5378912A (en) * | 1993-11-10 | 1995-01-03 | Philips Electronics North America Corporation | Lateral semiconductor-on-insulator (SOI) semiconductor device having a lateral drift region |
US5396085A (en) * | 1993-12-28 | 1995-03-07 | North Carolina State University | Silicon carbide switching device with rectifying-gate |
DE4430732C2 (de) * | 1994-08-30 | 1998-07-02 | Daimler Benz Ag | Vertikaler Feldeffekt-Transistor hoher Leistung und Verfahren zu dessen Herstellung |
US5877515A (en) * | 1995-10-10 | 1999-03-02 | International Rectifier Corporation | SiC semiconductor device |
-
1995
- 1995-02-08 JP JP7020417A patent/JPH08213607A/ja active Pending
-
1996
- 1996-02-07 EP EP96300813A patent/EP0726604B1/de not_active Expired - Lifetime
- 1996-02-07 DE DE69622295T patent/DE69622295T2/de not_active Expired - Fee Related
- 1996-02-08 US US08/598,396 patent/US6002143A/en not_active Expired - Fee Related
-
1999
- 1999-05-20 US US09/315,050 patent/US6025233A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6025233A (en) | 2000-02-15 |
DE69622295T2 (de) | 2003-02-27 |
EP0726604A3 (de) | 1997-09-24 |
EP0726604A2 (de) | 1996-08-14 |
EP0726604B1 (de) | 2002-07-17 |
US6002143A (en) | 1999-12-14 |
JPH08213607A (ja) | 1996-08-20 |
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