DE69602794D1 - In Kunststoff verkapselte SAW-Anordnung und -Verfahren - Google Patents

In Kunststoff verkapselte SAW-Anordnung und -Verfahren

Info

Publication number: DE69602794D1
Authority: DE; Germany
Prior art keywords: plastic; saw arrangement; process encapsulated; encapsulated; saw
Prior art date: 1995-04-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69602794T

Other languages

English (en)

Other versions

DE69602794T2 (de

Inventor

Michael John Anderson

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Motorola Solutions Inc

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-04-03

Filing date

1996-03-25

Publication date

1999-07-15

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23648658&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69602794(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1996-03-25 Application filed by Motorola Inc filed Critical Motorola Inc

1999-07-15 Publication of DE69602794D1 publication Critical patent/DE69602794D1/de

2000-03-09 Application granted granted Critical

2000-03-09 Publication of DE69602794T2 publication Critical patent/DE69602794T2/de

2016-03-26 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
- H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps

Landscapes

Physics & Mathematics (AREA)
Acoustics & Sound (AREA)
Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

DE69602794T 1995-04-03 1996-03-25 In Kunststoff verkapselte SAW-Anordnung und -Verfahren Expired - Fee Related DE69602794T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US08/416,126 US5760526A (en)	1995-04-03	1995-04-03	Plastic encapsulated SAW device

Publications (2)

Publication Number	Publication Date
DE69602794D1 true DE69602794D1 (de)	1999-07-15
DE69602794T2 DE69602794T2 (de)	2000-03-09

Family

ID=23648658

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69602794T Expired - Fee Related DE69602794T2 (de)	1995-04-03	1996-03-25	In Kunststoff verkapselte SAW-Anordnung und -Verfahren

Country Status (6)

Country	Link
US (1)	US5760526A (de)
EP (1)	EP0736972B1 (de)
JP (1)	JPH08288776A (de)
DE (1)	DE69602794T2 (de)
DK (1)	DK0736972T3 (de)
FI (1)	FI961375A (de)

Families Citing this family (23)

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US6388203B1 (en)	1995-04-04	2002-05-14	Unitive International Limited	Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
CN1179412C (zh)	1995-04-05	2004-12-08	统一国际有限公司	具有伸长部分和展宽部分的焊料结构及其形成方法
JP3580082B2 (ja) *	1997-04-22	2004-10-20	株式会社村田製作所	チップ状部品の実装構造および実装方法
EP0899787A3 (de) *	1997-07-25	2001-05-16	Mcnc	Knotrolliert geformte Lötreservoirszur Volumenerhöhung von Löthöckern und damit hergestellten Strukturen
JP3196693B2 (ja) *	1997-08-05	2001-08-06	日本電気株式会社	表面弾性波装置およびその製造方法
US6036872A (en)	1998-03-31	2000-03-14	Honeywell Inc.	Method for making a wafer-pair having sealed chambers
US6359333B1 (en)	1998-03-31	2002-03-19	Honeywell International Inc.	Wafer-pair having deposited layer sealed chambers
NO322272B1 (no) *	1999-03-26	2006-09-04	Kongsberg Maritime As	Sensor og system for overvaking av temperatur inne i vanskelig tilgjengelige, bevegelige deler
US6182342B1 (en) *	1999-04-02	2001-02-06	Andersen Laboratories, Inc.	Method of encapsulating a saw device
JP2002076831A (ja) *	2000-08-28	2002-03-15	Nec Corp	リードフレームおよびそれを使用するｓａｗフィルタ
JP3418373B2 (ja) *	2000-10-24	2003-06-23	エヌ・アール・エス・テクノロジー株式会社	弾性表面波装置及びその製造方法
US7547623B2 (en)	2002-06-25	2009-06-16	Unitive International Limited	Methods of forming lead free solder bumps
WO2004001837A2 (en)	2002-06-25	2003-12-31	Unitive International Limited	Methods of forming electronic structures including conductive shunt layers and related structures
US7049216B2 (en)	2003-10-14	2006-05-23	Unitive International Limited	Methods of providing solder structures for out plane connections
US7259499B2 (en) *	2004-12-23	2007-08-21	Askew Andy R	Piezoelectric bimorph actuator and method of manufacturing thereof
DE102006005994A1 (de) *	2006-02-08	2007-08-16	Infineon Technologies Ag	Halbleiterbauteil mit einem Halbleiterchip und Verfahren zur Herstellung derartiger Halbleiterbauteile
US7932615B2 (en)	2006-02-08	2011-04-26	Amkor Technology, Inc.	Electronic devices including solder bumps on compliant dielectric layers
US7674701B2 (en)	2006-02-08	2010-03-09	Amkor Technology, Inc.	Methods of forming metal layers using multi-layer lift-off patterns
US7576470B2 (en) *	2007-04-30	2009-08-18	Honeywell International Inc.	Mechanical packaging of surface acoustic wave device for sensing applications
US8325047B2 (en) *	2009-04-08	2012-12-04	Sabic Innovative Plastics Ip B.V.	Encapsulated RFID tags and methods of making same
JP2013051512A (ja) *	2011-08-30	2013-03-14	Nippon Dempa Kogyo Co Ltd	水晶振動子
GB2516079A (en) *	2013-07-10	2015-01-14	Melexis Technologies Nv	Method for hermetically sealing with reduced stress
US10241500B2 (en) *	2015-08-10	2019-03-26	Buerkert Werke Gmbh	Film transducer and actuator strip for a film transducer

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Publication number	Priority date	Publication date	Assignee	Title
US4028646A (en) *	1974-12-30	1977-06-07	Matsushita Electric Industrial Co., Ltd.	Elastic surface wave devices and method for making the same
GB1512593A (en) *	1975-03-13	1978-06-01	Murata Manufacturing Co	Elastic surface wave filter
US4037176A (en) *	1975-03-18	1977-07-19	Matsushita Electric Industrial Co., Ltd.	Multi-layered substrate for a surface-acoustic-wave device
US4096455A (en) *	1977-02-23	1978-06-20	Tektronix, Inc.	Surface wave termination for saw device
JPS53109458A (en) *	1977-03-07	1978-09-25	Hitachi Ltd	Element for elastic surface wave
US4191905A (en) *	1977-06-17	1980-03-04	Citizen Watch Company Limited	Sealed housings for a subminiature piezoelectric vibrator
JPS5925486B2 (ja) *	1977-11-15	1984-06-18	シチズン時計株式会社	圧電振動子の容器
US4270105A (en) *	1979-05-14	1981-05-26	Raytheon Company	Stabilized surface wave device
US4405875A (en) *	1980-07-24	1983-09-20	Kiyoshi Nagai	Hermetically sealed flat-type piezo-electric oscillator assembly
US4586382A (en) *	1982-09-29	1986-05-06	Schlumberger Technology Corporation	Surface acoustic wave sensors
US4512198A (en) *	1982-09-29	1985-04-23	Schlumberger Technology Corporation	Surface acoustic wave sensors
US5594979A (en) *	1984-09-13	1997-01-21	Raytheon Company	Method for packaging a surface acoustic wave device
JPS61152112A (ja) *	1984-12-26	1986-07-10	Hitachi Ltd	弾性表面波装置
JPS6297418A (ja) *	1985-10-23	1987-05-06	Clarion Co Ltd	弾性表面波装置のパツケ−ジ方法
US5010270A (en) *	1986-12-22	1991-04-23	Raytheon Company	Saw device
US5091051A (en) *	1986-12-22	1992-02-25	Raytheon Company	Saw device method
JPS6437132U (de) *	1987-08-31	1989-03-06
JPH02170611A (ja) *	1988-12-22	1990-07-02	Clarion Co Ltd	弾性表面波装置
US5095240A (en) *	1989-11-13	1992-03-10	X-Cyte, Inc.	Inductively coupled saw device and method for making the same
US5051645A (en) *	1990-01-30	1991-09-24	Johnson Service Company	Acoustic wave H2 O phase-change sensor capable of self-cleaning and distinguishing air, water, dew, frost and ice
JPH0456510A (ja) *	1990-06-26	1992-02-24	Clarion Co Ltd	弾性表面波装置
JP2673993B2 (ja) *	1990-07-02	1997-11-05	日本無線株式会社	表面弾性波装置
US5215546A (en) *	1990-09-04	1993-06-01	Motorola, Inc.	Method and apparatus for SAW device passivation
JPH04170811A (ja) *	1990-11-05	1992-06-18	Fujitsu Ltd	弾性表面波デバイス
US5208504A (en) *	1990-12-28	1993-05-04	Raytheon Company	Saw device and method of manufacture
JPH05291864A (ja) *	1992-04-10	1993-11-05	Matsushita Electric Ind Co Ltd	弾性表面波素子実装回路とその製造方法
JP3222220B2 (ja) *	1992-10-19	2001-10-22	株式会社村田製作所	チップ型圧電共振子の製造方法

1995
- 1995-04-03 US US08/416,126 patent/US5760526A/en not_active Expired - Fee Related
1996
- 1996-03-25 DK DK96104676T patent/DK0736972T3/da active
- 1996-03-25 EP EP96104676A patent/EP0736972B1/de not_active Revoked
- 1996-03-25 DE DE69602794T patent/DE69602794T2/de not_active Expired - Fee Related
- 1996-03-26 FI FI961375A patent/FI961375A/fi unknown
- 1996-03-27 JP JP8097488A patent/JPH08288776A/ja active Pending

Also Published As

Publication number	Publication date
DK0736972T3 (da)	1999-11-15
JPH08288776A (ja)	1996-11-01
EP0736972B1 (de)	1999-06-09
EP0736972A1 (de)	1996-10-09
US5760526A (en)	1998-06-02
FI961375A (fi)	1996-10-04
DE69602794T2 (de)	2000-03-09
FI961375A0 (fi)	1996-03-26

Publication	Publication Date	Title
DE69602794D1 (de)	1999-07-15	In Kunststoff verkapselte SAW-Anordnung und -Verfahren
DE69526214D1 (de)	2002-05-08	Kunststoff folien
BR9508009A (pt)	1997-08-05	Composições de resina termoplástica e processo de produção das mesmas
DE59501908D1 (de)	1998-05-20	Befestigungselement aus Kunststoff
DE69623104D1 (de)	2002-09-26	Foliendekorierende Spritzgussmaschine und foliendekorierendes Spritzgussverfahren
BR9509031A (pt)	1998-06-23	Microestruturas em disposiçao cruzada
DE69633916D1 (de)	2004-12-30	Verbundmaterial und daraus hergestellte formteile
DE69715795D1 (de)	2002-10-31	Spritzgussverfahren und Werkstück
DE69633270D1 (de)	2004-10-07	Vorschmelzverfahren beim spritzgiessen
DE69606200D1 (de)	2000-02-17	Ionenpolymere in tablettenform
KR970001448A (ko)	1997-01-24	아크릴계 성형재료 및 그의 제조방법
DE59601818D1 (de)	1999-06-10	Befestigungselement aus Kunststoff
DE69820240D1 (de)	2004-01-15	Kunststoffolien und daraus hergestellte verpackungen
DE69620838D1 (de)	2002-05-29	Formmaschine und Formverfahren
DE19882043T1 (de)	2000-01-05	Spritzgießmaschine und Spritzgießverfahren
DE59603621D1 (de)	1999-12-16	Leukoindigo-präparationen in granulatform
DE69413196D1 (de)	1998-10-15	Spritzgiessverfahren und Spritzgiessmaschine
BR9602202A (pt)	1998-04-07	Material plástico e artigo moldado
KR970001403A (ko)	1997-01-24	에폭시 수지 및 그의 제조 방법
DE69604359D1 (de)	1999-10-28	Cyclopentylidene-cyclopentanol in Parfümerie
IT1296276B1 (it)	1999-06-21	Pallet in materiale plastico
PT872570E (pt)	2002-12-31	Moldagens em resina sintetica e seu processo de producao
KR970011854U (ko)	1997-04-25	속치마가 일체로 된 한복
KR970013552U (ko)	1997-04-25	합성수지 용기의 스틱커
SE9402249D0 (sv)	1994-06-27	Masks in special purpose plastic

Legal Events

Date	Code	Title	Description
2000-06-08	8363	Opposition against the patent
2003-01-16	8339	Ceased/non-payment of the annual fee