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DE69535090D1 - Optically coupled device - Google Patents

Optically coupled device

Info

Publication number
DE69535090D1
DE69535090D1 DE69535090T DE69535090T DE69535090D1 DE 69535090 D1 DE69535090 D1 DE 69535090D1 DE 69535090 T DE69535090 T DE 69535090T DE 69535090 T DE69535090 T DE 69535090T DE 69535090 D1 DE69535090 D1 DE 69535090D1
Authority
DE
Germany
Prior art keywords
coupled device
optically coupled
optically
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69535090T
Other languages
German (de)
Other versions
DE69535090T2 (en
Inventor
Atsushi Murayama
Masatosi Kotake
Kazuya Uekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69535090D1 publication Critical patent/DE69535090D1/en
Publication of DE69535090T2 publication Critical patent/DE69535090T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
DE69535090T 1994-12-28 1995-12-19 Optically coupled device Expired - Fee Related DE69535090T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32877194 1994-12-28
JP32877194A JP2986698B2 (en) 1994-12-28 1994-12-28 Optical coupling device

Publications (2)

Publication Number Publication Date
DE69535090D1 true DE69535090D1 (en) 2006-08-10
DE69535090T2 DE69535090T2 (en) 2007-01-04

Family

ID=18213961

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69535567T Expired - Fee Related DE69535567T2 (en) 1994-12-28 1995-12-19 Optically coupled device
DE69535090T Expired - Fee Related DE69535090T2 (en) 1994-12-28 1995-12-19 Optically coupled device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69535567T Expired - Fee Related DE69535567T2 (en) 1994-12-28 1995-12-19 Optically coupled device

Country Status (5)

Country Link
US (1) US5708277A (en)
EP (2) EP0720239B1 (en)
JP (1) JP2986698B2 (en)
KR (1) KR100218586B1 (en)
DE (2) DE69535567T2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3565322B2 (en) 1999-10-15 2004-09-15 シャープ株式会社 Optical coupling device
US7129653B2 (en) * 2004-09-30 2006-10-31 Hubbell Incorporated Self-contained, self-snubbed, HID dimming module that exhibits non-zero crossing detection switching
JP2006196598A (en) * 2005-01-12 2006-07-27 Sharp Corp Solid-state relay, electronic apparatus and method of manufacturing solid-state relay
US7679223B2 (en) * 2005-05-13 2010-03-16 Cree, Inc. Optically triggered wide bandgap bipolar power switching devices and circuits
US20110042554A1 (en) * 2006-01-09 2011-02-24 Koninklijke Philips Electonics N.V. Light Sensor with Integrated Temperature Sensor Functionality
KR100763863B1 (en) * 2006-11-06 2007-10-05 한국 고덴시 주식회사 Phototriac's structure
DE102008057347A1 (en) * 2008-11-14 2010-05-20 Osram Opto Semiconductors Gmbh Optoelectronic device
US20100327194A1 (en) * 2009-06-26 2010-12-30 Jian Xu Multi-bit use of a standard optocoupler
JP7374948B2 (en) 2021-03-23 2023-11-07 株式会社東芝 semiconductor relay device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3996475A (en) * 1975-07-28 1976-12-07 Rodriguez Edward T Photoelectric controlling
US4121122A (en) * 1976-12-22 1978-10-17 Kurt Pokrandt Current sensing circuitry
US4143287A (en) * 1977-09-19 1979-03-06 Bell Telephone Laboratories, Incorporated Photo coupling line isolation circuit
JPS54125912A (en) * 1978-03-24 1979-09-29 Toshiba Corp Photo thyristor coupler circuit
US4361798A (en) * 1980-10-27 1982-11-30 Pitney Bowes Inc. System for extending the voltage range of a phase-fired triac controller
GB2099978A (en) * 1981-05-11 1982-12-15 Rolls Royce Gas turbine engine combustor
JPS58101477A (en) * 1981-12-11 1983-06-16 Sanyo Electric Co Ltd Self-holding optical coupler
US4535251A (en) * 1982-12-21 1985-08-13 International Rectifier Corporation A.C. Solid state relay circuit and structure
FR2569915B3 (en) * 1984-08-28 1986-09-05 Baudry Jean IMPROVEMENT IN ELECTRONIC DRIVERS OPERATING BY PHASE CONTROL
JPS622717A (en) * 1985-06-28 1987-01-08 Hayashibara Takeshi Rush current limiting circuit
US5216303A (en) * 1991-08-06 1993-06-01 Lu Chao Cheng Double solid state relay
JP2807388B2 (en) * 1993-03-19 1998-10-08 株式会社東芝 Photo coupler device
JP2812874B2 (en) * 1994-04-25 1998-10-22 シャープ株式会社 Optical coupling device

Also Published As

Publication number Publication date
KR960026991A (en) 1996-07-22
EP1406312A3 (en) 2005-06-15
EP0720239A3 (en) 1997-11-26
DE69535567T2 (en) 2008-05-08
JP2986698B2 (en) 1999-12-06
EP1406312A2 (en) 2004-04-07
DE69535090T2 (en) 2007-01-04
EP0720239A2 (en) 1996-07-03
EP0720239B1 (en) 2006-06-28
DE69535567D1 (en) 2007-09-27
JPH08186285A (en) 1996-07-16
EP1406312B1 (en) 2007-08-15
US5708277A (en) 1998-01-13
KR100218586B1 (en) 1999-09-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee