DE69514976D1 - Polyamicsäurenlösung - Google Patents
PolyamicsäurenlösungInfo
- Publication number
- DE69514976D1 DE69514976D1 DE69514976T DE69514976T DE69514976D1 DE 69514976 D1 DE69514976 D1 DE 69514976D1 DE 69514976 T DE69514976 T DE 69514976T DE 69514976 T DE69514976 T DE 69514976T DE 69514976 D1 DE69514976 D1 DE 69514976D1
- Authority
- DE
- Germany
- Prior art keywords
- acid solution
- polyamic acid
- polyamic
- solution
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24371994 | 1994-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69514976D1 true DE69514976D1 (de) | 2000-03-16 |
DE69514976T2 DE69514976T2 (de) | 2000-06-29 |
Family
ID=17107976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69514976T Expired - Fee Related DE69514976T2 (de) | 1994-10-07 | 1995-10-06 | Polyamicsäurenlösung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5719253A (de) |
EP (1) | EP0705862B1 (de) |
DE (1) | DE69514976T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3534151B2 (ja) * | 1996-10-29 | 2004-06-07 | 宇部興産株式会社 | ポリイミド前駆体組成物及びポリイミド膜 |
WO1998028395A1 (en) * | 1996-12-24 | 1998-07-02 | Advanced Chemical Systems International, Inc. | Formulations including a 1,3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates |
US6497747B1 (en) | 1999-09-24 | 2002-12-24 | Praxair Technology, Inc. | Production and use of improved polyimide separation membranes |
JPWO2003074587A1 (ja) * | 2002-03-05 | 2005-06-30 | 鈴鹿富士ゼロックス株式会社 | ポリイミド前駆体溶液、転写・定着部材およびポリイミドシームレスベルトの製造方法 |
KR100455191B1 (ko) * | 2002-04-16 | 2004-11-06 | 엘지전자 주식회사 | 압축기의 베인 구조 |
US7037637B2 (en) * | 2002-07-17 | 2006-05-02 | Nitto Denko Corporation | Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide |
US9576698B2 (en) | 2011-09-23 | 2017-02-21 | Nanyang Technological University | Methods for forming polyimide-carbon nanotube composite film, and polyimide-carbon nanotube composite films formed thereof |
JP5846136B2 (ja) * | 2013-01-31 | 2016-01-20 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、及びポリイミド前駆体組成物の製造方法 |
WO2014189002A1 (ja) * | 2013-05-20 | 2014-11-27 | ユニチカ株式会社 | ポリイミド前駆体溶液 |
JP5708778B1 (ja) | 2013-12-16 | 2015-04-30 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物の製造方法 |
US9650543B2 (en) | 2014-03-18 | 2017-05-16 | Fuji Xerox Co., Ltd. | Polyimide precursor composition, method for manufacturing polyimide molded body, and polyimide molded body |
JP6413434B2 (ja) | 2014-07-25 | 2018-10-31 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法 |
JP6496993B2 (ja) | 2014-07-25 | 2019-04-10 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法 |
US10266653B2 (en) | 2014-12-31 | 2019-04-23 | Sabic Global Technologies B.V. | Polyimide-forming compositions, methods of manufacture, and articles prepared therefrom |
KR102380686B1 (ko) | 2015-02-20 | 2022-04-01 | 에스에이치피피 글로벌 테크놀러지스 비.브이. | 폴리(암산) 합성 및 고분자량 폴리이미드로의 전환 |
JP6672667B2 (ja) | 2015-09-24 | 2020-03-25 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、ポリイミド前駆体組成物の製造方法、及びポリイミド成形体の製造方法。 |
JP6988094B2 (ja) | 2017-01-27 | 2022-01-05 | 富士フイルムビジネスイノベーション株式会社 | ポリイミド前駆体組成物、及びポリイミド成形体の製造方法 |
WO2019134359A1 (zh) * | 2018-01-03 | 2019-07-11 | 浙江大学 | 具有取向孔结构的多孔纤维及制备方法、应用和装置 |
KR102621031B1 (ko) * | 2021-06-29 | 2024-01-05 | 한국화학연구원 | 폴리아믹산 수용액 조성물 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4837299A (en) * | 1986-12-31 | 1989-06-06 | General Electric Company | Process for making polyimides |
JP2573595B2 (ja) * | 1987-03-09 | 1997-01-22 | 鐘淵化学工業株式会社 | ポリイミド膜 |
JP2926509B2 (ja) * | 1990-05-21 | 1999-07-28 | 鐘淵化学工業株式会社 | 樹脂フィルム及びその製造方法 |
JP3021979B2 (ja) * | 1991-08-28 | 2000-03-15 | ユニチカ株式会社 | ポリイミド前駆体溶液、その製造方法、それから得られる成形体及び被覆物 |
US5241041A (en) * | 1991-12-16 | 1993-08-31 | Occidental Chemical Corporation | Photocrosslinkable polyimide ammonium salts |
CA2115334A1 (en) * | 1993-02-10 | 1994-08-11 | Isao Tomioka | Film forming solution, porous film obtained therefrom and coated material with the porous film |
-
1995
- 1995-10-05 US US08/539,740 patent/US5719253A/en not_active Expired - Fee Related
- 1995-10-06 EP EP95115808A patent/EP0705862B1/de not_active Expired - Lifetime
- 1995-10-06 DE DE69514976T patent/DE69514976T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5719253A (en) | 1998-02-17 |
EP0705862A1 (de) | 1996-04-10 |
DE69514976T2 (de) | 2000-06-29 |
EP0705862B1 (de) | 2000-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |