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DE69404789D1 - Zinn-wismut-lötverbindung mit verbesserten hochtemperatureigenschaften und verfahren zu deren bildung. - Google Patents

Zinn-wismut-lötverbindung mit verbesserten hochtemperatureigenschaften und verfahren zu deren bildung.

Info

Publication number
DE69404789D1
DE69404789D1 DE69404789T DE69404789T DE69404789D1 DE 69404789 D1 DE69404789 D1 DE 69404789D1 DE 69404789 T DE69404789 T DE 69404789T DE 69404789 T DE69404789 T DE 69404789T DE 69404789 D1 DE69404789 D1 DE 69404789D1
Authority
DE
Germany
Prior art keywords
bismut
tin
production
temperature properties
improved high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69404789T
Other languages
English (en)
Other versions
DE69404789T2 (de
Inventor
Cynthia Melton
Harry Fuerhaupter
George Demet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69404789D1 publication Critical patent/DE69404789D1/de
Application granted granted Critical
Publication of DE69404789T2 publication Critical patent/DE69404789T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69404789T 1993-04-02 1994-03-17 Zinn-wismut-lötverbindung mit verbesserten hochtemperatureigenschaften und verfahren zu deren bildung. Expired - Lifetime DE69404789T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/042,227 US5320272A (en) 1993-04-02 1993-04-02 Tin-bismuth solder connection having improved high temperature properties, and process for forming same
PCT/US1994/002777 WO1994023555A1 (en) 1993-04-02 1994-03-17 Tin-bismuth solder connection having improved high temperature properties, and process for forming same

Publications (2)

Publication Number Publication Date
DE69404789D1 true DE69404789D1 (de) 1997-09-11
DE69404789T2 DE69404789T2 (de) 1998-02-19

Family

ID=21920755

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404789T Expired - Lifetime DE69404789T2 (de) 1993-04-02 1994-03-17 Zinn-wismut-lötverbindung mit verbesserten hochtemperatureigenschaften und verfahren zu deren bildung.

Country Status (6)

Country Link
US (1) US5320272A (de)
EP (1) EP0643903B1 (de)
KR (2) KR0144805B1 (de)
CA (1) CA2135794C (de)
DE (1) DE69404789T2 (de)
WO (1) WO1994023555A1 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3008768B2 (ja) * 1994-01-11 2000-02-14 松下電器産業株式会社 バンプの形成方法
US5415944A (en) * 1994-05-02 1995-05-16 Motorola, Inc. Solder clad substrate
US5427865A (en) * 1994-05-02 1995-06-27 Motorola, Inc. Multiple alloy solder preform
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
US5569433A (en) * 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
JPH08195548A (ja) * 1995-01-17 1996-07-30 Matsushita Electric Ind Co Ltd 電子部品実装方法
FI970822L (fi) * 1997-02-27 1998-08-28 Nokia Mobile Phones Ltd Menetelmä ja järjestely komponentin liittämiseksi
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
IL132555A0 (en) 1997-04-22 2001-03-19 Ecosolder Internat Pty Ltd Lead-free solder
US5964395A (en) * 1997-06-09 1999-10-12 Ford Motor Company Predeposited transient phase electronic interconnect media
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
US6204490B1 (en) * 1998-06-04 2001-03-20 Hitachi, Ltd. Method and apparatus of manufacturing an electronic circuit board
US6264093B1 (en) * 1998-11-02 2001-07-24 Raymond W. Pilukaitis Lead-free solder process for printed wiring boards
US6197253B1 (en) 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
EP1176639B1 (de) * 2000-07-28 2007-06-20 Infineon Technologies AG Verfahren zur Kontaktierung eines Halbleiterbauelementes
JP2002217434A (ja) 2001-01-19 2002-08-02 Sharp Corp 太陽電池、太陽電池用インターコネクターおよびストリング
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
KR100705637B1 (ko) * 2002-07-03 2007-04-10 미츠이 긴조쿠 고교 가부시키가이샤 플렉시블 배선 기재 및 그 제조 방법
JP2004179618A (ja) * 2002-10-04 2004-06-24 Sharp Corp 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール
JP2004146464A (ja) * 2002-10-22 2004-05-20 Sharp Corp 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール
US7168608B2 (en) * 2002-12-24 2007-01-30 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for hermetic seal formation
DE10309677B4 (de) * 2003-02-27 2008-07-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikroelektromechanisches Bauteil und Verfahren zur Herstellung eines mikroelektromechanischen Bauteils
US7494041B2 (en) * 2004-06-23 2009-02-24 Intel Corporation In-situ alloyed solders, articles made thereby, and processes of making same
US7074627B2 (en) * 2004-06-29 2006-07-11 Freescale Semiconductor, Inc. Lead solder indicator and method
TW200730288A (en) * 2005-08-11 2007-08-16 Senju Metal Industry Co Lead free solder paste and application thereof
WO2009013210A1 (en) * 2007-07-23 2009-01-29 Henkel Limited Solder flux
US8542465B2 (en) 2010-03-17 2013-09-24 Western Digital Technologies, Inc. Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface
JP5478331B2 (ja) * 2010-03-31 2014-04-23 日本発條株式会社 電子機器と、ディスク装置用サスペンション
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
US8665567B2 (en) 2010-06-30 2014-03-04 Western Digital Technologies, Inc. Suspension assembly having a microactuator grounded to a flexure
US9001469B2 (en) 2012-03-16 2015-04-07 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (DSA) disk drive head suspension
WO2013142711A1 (en) 2012-03-22 2013-09-26 Hutchinson Technology Incorporated Ground feature for disk drive head suspension flexures
JP6251745B2 (ja) 2012-09-14 2017-12-20 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ２段始動構造部を有するジンバル形撓み部材及びサスペンション
US8896968B2 (en) 2012-10-10 2014-11-25 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with dampers
EP2908612B1 (de) * 2012-10-15 2018-05-09 Senju Metal Industry Co., Ltd. Lötverfahren für eine niedrigtemperaturlötpaste
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
US9978719B2 (en) * 2014-01-28 2018-05-22 Infineon Technologies Austria Ag Electronic component, arrangement and method
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
WO2017003782A1 (en) 2015-06-30 2017-01-05 Hutchinson Technology Incorporated Disk drive head suspension structures having improved gold-dielectric joint reliability
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
KR102626385B1 (ko) 2016-06-08 2024-01-19 삼성디스플레이 주식회사 표시장치 및 이의 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH80998A (fr) * 1918-08-09 1920-01-02 Gustave Ferriere Soudure pour l'aluminium
US4636073A (en) * 1984-10-31 1987-01-13 International Business Machines Corporation Universal calibration standard for surface inspection systems
US4761699A (en) * 1986-10-28 1988-08-02 International Business Machines Corporation Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
US5156997A (en) * 1991-02-11 1992-10-20 Microelectronics And Computer Technology Corporation Method of making semiconductor bonding bumps using metal cluster ion deposition
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature

Also Published As

Publication number Publication date
EP0643903A1 (de) 1995-03-22
CA2135794A1 (en) 1994-10-13
CA2135794C (en) 1998-12-29
WO1994023555A1 (en) 1994-10-13
EP0643903A4 (de) 1995-09-20
EP0643903B1 (de) 1997-08-06
DE69404789T2 (de) 1998-02-19
KR950702089A (ko) 1995-05-17
US5320272A (en) 1994-06-14
KR0144805B1 (ko) 1998-10-01

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Legal Events

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8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: FREESCALE SEMICONDUCTOR, INC., AUSTIN, TEX., US