DE69400463D1 - Verbesserung der Haftung von Metallschichten auf Kunstharz-Teilen - Google Patents
Verbesserung der Haftung von Metallschichten auf Kunstharz-TeilenInfo
- Publication number
- DE69400463D1 DE69400463D1 DE69400463T DE69400463T DE69400463D1 DE 69400463 D1 DE69400463 D1 DE 69400463D1 DE 69400463 T DE69400463 T DE 69400463T DE 69400463 T DE69400463 T DE 69400463T DE 69400463 D1 DE69400463 D1 DE 69400463D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesion
- improvement
- synthetic resin
- metal layers
- resin parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
- Y10S205/928—ABS copolymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/062,264 US5316867A (en) | 1993-05-17 | 1993-05-17 | Method for adhering metal coatings to thermoplastic addition polymers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69400463D1 true DE69400463D1 (de) | 1996-10-10 |
DE69400463T2 DE69400463T2 (de) | 1997-03-27 |
Family
ID=22041324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69400463T Expired - Fee Related DE69400463T2 (de) | 1993-05-17 | 1994-05-11 | Verbesserung der Haftung von Metallschichten auf Kunstharz-Teilen |
Country Status (5)
Country | Link |
---|---|
US (1) | US5316867A (de) |
EP (1) | EP0625590B1 (de) |
JP (1) | JPH0741956A (de) |
DE (1) | DE69400463T2 (de) |
ES (1) | ES2091668T3 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5413817A (en) * | 1993-11-05 | 1995-05-09 | General Electric Company | Method for adhering metal coatings to polyphenylene ether-polystyrene articles |
US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
US6723349B1 (en) * | 1999-10-12 | 2004-04-20 | Emory University | Polyoxometalate materials, metal-containing materials, and methods of use thereof |
US6468672B1 (en) | 2000-06-29 | 2002-10-22 | Lacks Enterprises, Inc. | Decorative chrome electroplate on plastics |
DE10302416A1 (de) * | 2003-01-21 | 2004-07-29 | Röhm GmbH & Co. KG | Matter Polymerisationsklebstoff |
DE10304668B4 (de) * | 2003-02-05 | 2006-10-19 | König, Klaus-Peter | Verfahren zur haftfesten, eine metallische Schicht umfassenden Beschichtung eines Substrats und seine Verwendung |
JP2006028484A (ja) * | 2004-06-18 | 2006-02-02 | Mec Kk | 樹脂表面処理剤および樹脂表面処理法 |
EP1793013B1 (de) * | 2005-12-05 | 2017-07-19 | Rohm and Haas Electronic Materials LLC | Metallisierung von Dielektrika |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3847648A (en) * | 1972-11-29 | 1974-11-12 | Gen Motors Corp | Plating pre-treatment in acrylonitrile butadiene styrene |
US5160600A (en) * | 1990-03-05 | 1992-11-03 | Patel Gordhanbai N | Chromic acid free etching of polymers for electroless plating |
US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5318803A (en) * | 1990-11-13 | 1994-06-07 | International Business Machines Corporation | Conditioning of a substrate for electroless plating thereon |
-
1993
- 1993-05-17 US US08/062,264 patent/US5316867A/en not_active Expired - Fee Related
-
1994
- 1994-05-11 EP EP94303400A patent/EP0625590B1/de not_active Expired - Lifetime
- 1994-05-11 DE DE69400463T patent/DE69400463T2/de not_active Expired - Fee Related
- 1994-05-11 ES ES94303400T patent/ES2091668T3/es not_active Expired - Lifetime
- 1994-05-17 JP JP10298194A patent/JPH0741956A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ES2091668T3 (es) | 1996-11-01 |
EP0625590B1 (de) | 1996-09-04 |
US5316867A (en) | 1994-05-31 |
JPH0741956A (ja) | 1995-02-10 |
DE69400463T2 (de) | 1997-03-27 |
EP0625590A1 (de) | 1994-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |