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DE69233063D1 - Packung für elektronische Schaltung - Google Patents

Packung für elektronische Schaltung

Info

Publication number
DE69233063D1
DE69233063D1 DE69233063T DE69233063T DE69233063D1 DE 69233063 D1 DE69233063 D1 DE 69233063D1 DE 69233063 T DE69233063 T DE 69233063T DE 69233063 T DE69233063 T DE 69233063T DE 69233063 D1 DE69233063 D1 DE 69233063D1
Authority
DE
Germany
Prior art keywords
electronic circuit
circuit pack
pack
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69233063T
Other languages
English (en)
Other versions
DE69233063T2 (de
Inventor
Nobuyasu Kanekawa
Hirokazu Ihara
Masatsugu Akiyama
Hisayoshi Yamanaka
Tetsuya Okishima
Kiyoshi Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rising Silicon Inc
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69233063D1 publication Critical patent/DE69233063D1/de
Publication of DE69233063T2 publication Critical patent/DE69233063T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01007—Nitrogen [N]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Microcomputers (AREA)
  • Detection And Correction Of Errors (AREA)
  • Semiconductor Memories (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE69233063T 1991-02-28 1992-02-27 Packung für elektronische Schaltung Expired - Lifetime DE69233063T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3034038A JP2960560B2 (ja) 1991-02-28 1991-02-28 超小型電子機器
JP3403891 1991-02-28

Publications (2)

Publication Number Publication Date
DE69233063D1 true DE69233063D1 (de) 2003-06-26
DE69233063T2 DE69233063T2 (de) 2004-09-16

Family

ID=12403153

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1992633297 Expired - Lifetime DE69233297T2 (de) 1991-02-28 1992-02-27 Packung für elektronische Schaltung
DE69233063T Expired - Lifetime DE69233063T2 (de) 1991-02-28 1992-02-27 Packung für elektronische Schaltung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1992633297 Expired - Lifetime DE69233297T2 (de) 1991-02-28 1992-02-27 Packung für elektronische Schaltung

Country Status (5)

Country Link
US (11) US5468992A (de)
EP (3) EP0786809B1 (de)
JP (1) JP2960560B2 (de)
CA (1) CA2061949C (de)
DE (2) DE69233297T2 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960560B2 (ja) 1991-02-28 1999-10-06 株式会社日立製作所 超小型電子機器
US5721452A (en) * 1995-08-16 1998-02-24 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US5982185A (en) * 1996-07-01 1999-11-09 Micron Technology, Inc. Direct connect carrier for testing semiconductor dice and method of fabrication
US5929647A (en) * 1996-07-02 1999-07-27 Micron Technology, Inc. Method and apparatus for testing semiconductor dice
US6639416B1 (en) 1996-07-02 2003-10-28 Micron Technology, Inc. Method and apparatus for testing semiconductor dice
US6255833B1 (en) 1997-03-04 2001-07-03 Micron Technology, Inc. Method for testing semiconductor dice and chip scale packages
SE509570C2 (sv) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperaturkompenserande organ och förfarande vid montering av elektronik på ett mönsterkort
WO1998025213A1 (fr) * 1996-12-04 1998-06-11 Hitachi, Ltd. Dispositif de circuit semi-conducteur integre
DE19724053A1 (de) * 1997-06-07 1998-12-10 Biotronik Mess & Therapieg Elektronische Speichervorrichtung, insbesondere zur Anwendung bei implantierbaren medizinischen Geräten
JP3896250B2 (ja) * 1997-11-06 2007-03-22 株式会社ルネサステクノロジ 情報処理装置
US5933327A (en) * 1998-04-03 1999-08-03 Ericsson, Inc. Wire bond attachment of a integrated circuit package to a heat sink
JP2000077609A (ja) * 1998-08-28 2000-03-14 Hitachi Ltd 半導体集積回路装置
US6392296B1 (en) 1998-08-31 2002-05-21 Micron Technology, Inc. Silicon interposer with optical connections
US6281042B1 (en) 1998-08-31 2001-08-28 Micron Technology, Inc. Structure and method for a high performance electronic packaging assembly
US6586835B1 (en) * 1998-08-31 2003-07-01 Micron Technology, Inc. Compact system module with built-in thermoelectric cooling
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6255852B1 (en) 1999-02-09 2001-07-03 Micron Technology, Inc. Current mode signal interconnects and CMOS amplifier
US7554829B2 (en) * 1999-07-30 2009-06-30 Micron Technology, Inc. Transmission lines for CMOS integrated circuits
US6406940B1 (en) 2000-08-14 2002-06-18 Intermedics Inc. Method and apparatus for stacking IC devices
US6349050B1 (en) * 2000-10-10 2002-02-19 Rambus, Inc. Methods and systems for reducing heat flux in memory systems
US7101770B2 (en) 2002-01-30 2006-09-05 Micron Technology, Inc. Capacitive techniques to reduce noise in high speed interconnections
US7235457B2 (en) * 2002-03-13 2007-06-26 Micron Technology, Inc. High permeability layered films to reduce noise in high speed interconnects
US7230146B2 (en) 2003-10-27 2007-06-12 Honeywell International Inc. Process for producing fluoropropenes
US7606293B2 (en) * 2002-10-25 2009-10-20 Gct Semiconductor, Inc. Bidirectional turbo ISI canceller-based DSSS receiver for high-speed wireless LAN
US7444546B2 (en) * 2003-04-17 2008-10-28 Arm Limited On-board diagnostic circuit for an integrated circuit
US7302025B2 (en) * 2003-09-25 2007-11-27 Analog Devices, Inc. Efficient joint equalization/decoding method and apparatus for Complementary-Code-Keying based systems
US8324725B2 (en) * 2004-09-27 2012-12-04 Formfactor, Inc. Stacked die module
US7015823B1 (en) 2004-10-15 2006-03-21 Systran Federal Corporation Tamper resistant circuit boards
US7281667B2 (en) * 2005-04-14 2007-10-16 International Business Machines Corporation Method and structure for implementing secure multichip modules for encryption applications
US7582951B2 (en) 2005-10-20 2009-09-01 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
US7808087B2 (en) * 2006-06-01 2010-10-05 Broadcom Corporation Leadframe IC packages having top and bottom integrated heat spreaders
JP4863953B2 (ja) * 2007-08-30 2012-01-25 日立オートモティブシステムズ株式会社 物理量変換センサ及びそれを用いたモータ制御システム
US8443175B2 (en) * 2009-07-10 2013-05-14 Via Technologies, Inc. Microprocessor with first processor for debugging second processor
US8762779B2 (en) * 2010-01-22 2014-06-24 Via Technologies, Inc. Multi-core processor with external instruction execution rate heartbeat
US8495344B2 (en) * 2010-01-22 2013-07-23 Via Technologies, Inc. Simultaneous execution resumption of multiple processor cores after core state information dump to facilitate debugging via multi-core processor simulator using the state information
US8639919B2 (en) 2011-01-18 2014-01-28 Via Technologies, Inc. Tracer configuration and enablement by reset microcode
US9153508B2 (en) 2011-08-17 2015-10-06 Rambus Inc. Multi-chip package and interposer with signal line compression
US8634221B2 (en) 2011-11-01 2014-01-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Memory system that utilizes a wide input/output (I/O) interface to interface memory storage with an interposer and that utilizes a SerDes interface to interface a memory controller with an integrated circuit, and a method
KR102104578B1 (ko) * 2013-08-30 2020-04-27 에스케이하이닉스 주식회사 데이터 비트 인버전 기능을 갖는 반도체 장치
US11391147B2 (en) 2016-09-27 2022-07-19 Halliburton Energy Services, Inc. Formation tester comprising reactive filter material
CN112927747B (zh) * 2021-04-22 2021-09-21 中科一芯科技(深圳)有限公司 一种嵌入式存储芯片打线导致芯片失效的解决方法
CN114679424B (zh) * 2022-03-31 2023-07-07 中科芯集成电路有限公司 一种多裸芯集成微系统dma实现方法

Family Cites Families (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US22739A (en) * 1859-01-25 Antonio metjcci
US131228A (en) * 1872-09-10 Improvement in stump-extractors
US24389A (en) * 1859-06-14 Improvement in horse-rakes
US56911A (en) * 1866-08-07 Improved washing-machine
US40261A (en) * 1863-10-13 Improvement in granaries
US33013A (en) * 1861-08-06 Improvement in seed-sowing machines
US3851221A (en) * 1972-11-30 1974-11-26 P Beaulieu Integrated circuit package
US4172282A (en) * 1976-10-29 1979-10-23 International Business Machines Corporation Processor controlled memory refresh
US4144561A (en) * 1977-07-08 1979-03-13 Xerox Corporation Chip topography for MOS integrated circuitry microprocessor chip
JPS5537641A (en) 1978-09-08 1980-03-15 Fujitsu Ltd Synchronization system for doubled processor
US4245273A (en) 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
IT1128896B (it) * 1980-07-03 1986-06-04 Olivetti & Co Spa Apparecchiatura di elaborazione dati con memoria permanente programmabile
US4443278A (en) * 1981-05-26 1984-04-17 International Business Machines Corporation Inspection of multilayer ceramic circuit modules by electrical inspection of green specimens
US4504784A (en) * 1981-07-02 1985-03-12 International Business Machines Corporation Method of electrically testing a packaging structure having N interconnected integrated circuit chips
US4441075A (en) * 1981-07-02 1984-04-03 International Business Machines Corporation Circuit arrangement which permits the testing of each individual chip and interchip connection in a high density packaging structure having a plurality of interconnected chips, without any physical disconnection
US4602271A (en) * 1981-07-22 1986-07-22 International Business Machines Corporation Personalizable masterslice substrate for semiconductor chips
US4432055A (en) * 1981-09-29 1984-02-14 Honeywell Information Systems Inc. Sequential word aligned addressing apparatus
JPS5961152A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 半導体装置
US5149940A (en) * 1983-02-24 1992-09-22 Beckworth Davis International Inc. Method for controlling and synchronizing a welding power supply
JPS6050940A (ja) * 1983-08-31 1985-03-22 Toshiba Corp 半導体集積回路
US4649474A (en) * 1983-09-23 1987-03-10 Western Digital Corporation Chip topography for a MOS disk memory controller circuit
US4618953A (en) * 1984-05-01 1986-10-21 Pitney Bowes Inc. Watchdog circuit
US4577293A (en) * 1984-06-01 1986-03-18 International Business Machines Corporation Distributed, on-chip cache
JPS617656A (ja) * 1984-06-22 1986-01-14 Toshiba Corp マルチチップパッケ−ジ
JPS61112345A (ja) * 1984-11-07 1986-05-30 Toshiba Corp 半導体装置の製造方法
US4803682A (en) * 1985-03-04 1989-02-07 Sanyo Electric Co., Ltd. Resetting system
US4692839A (en) * 1985-06-24 1987-09-08 Digital Equipment Corporation Multiple chip interconnection system and package
GB2182176B (en) * 1985-09-25 1989-09-20 Ncr Co Data security device for protecting stored data
JPS6281745A (ja) * 1985-10-05 1987-04-15 Fujitsu Ltd ウエハ−規模のｌｓｉ半導体装置とその製造方法
US4922363A (en) * 1985-10-17 1990-05-01 General Electric Company Contactor control system
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
JPS62162749A (ja) 1986-01-13 1987-07-18 Komatsu Ltd 内燃機関発電機
US4752927A (en) * 1986-04-09 1988-06-21 Tektronix, Inc. Synchronous changeover
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
GB2195478B (en) * 1986-09-24 1990-06-13 Ncr Co Security device for sensitive data
US4783695A (en) * 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
US4918811A (en) * 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4773044A (en) * 1986-11-21 1988-09-20 Advanced Micro Devices, Inc Array-word-organized display memory and address generator with time-multiplexed address bus
US4868634A (en) * 1987-03-13 1989-09-19 Citizen Watch Co., Ltd. IC-packaged device
JPS63245952A (ja) * 1987-04-01 1988-10-13 Hitachi Ltd マルチチップモジュ−ル構造体
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5243208A (en) * 1987-05-27 1993-09-07 Hitachi, Ltd. Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US4947183A (en) * 1987-11-14 1990-08-07 Ricoh Company, Ltd. Edge type thermal printhead
US5028986A (en) * 1987-12-28 1991-07-02 Hitachi, Ltd. Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
JPH07107956B2 (ja) 1988-02-29 1995-11-15 沖電気工業株式会社 プロセッサ塔載回路
JP2645068B2 (ja) 1988-04-08 1997-08-25 株式会社東芝 メモリモジュール
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
EP0339154B1 (de) * 1988-04-26 1994-11-17 Citizen Watch Co. Ltd. Speicherkarte
US4888773A (en) * 1988-06-15 1989-12-19 International Business Machines Corporation Smart memory card architecture and interface
US5185717A (en) * 1988-08-05 1993-02-09 Ryoichi Mori Tamper resistant module having logical elements arranged in multiple layers on the outer surface of a substrate to protect stored information
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
CA2002213C (en) * 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
JPH02219254A (ja) * 1989-02-20 1990-08-31 Hitachi Ltd 半導体集積回路装置
US4993143A (en) * 1989-03-06 1991-02-19 Delco Electronics Corporation Method of making a semiconductive structure useful as a pressure sensor
JPH02289014A (ja) 1989-03-17 1990-11-29 Nec Corp Ｄｒａｍ制御装置
DE68916784T2 (de) * 1989-04-20 1995-01-05 Ibm Integrierte Schaltungspackung.
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US5068850A (en) * 1989-06-12 1991-11-26 Moore Industries-International, Inc. Parameter value communication system
US4922379A (en) * 1989-07-18 1990-05-01 Hughes Aircraft Company Power semiconductor package
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US5182632A (en) * 1989-11-22 1993-01-26 Tactical Fabs, Inc. High density multichip package with interconnect structure and heatsink
US5019943A (en) * 1990-02-14 1991-05-28 Unisys Corporation High density chip stack having a zigzag-shaped face which accommodates connections between chips
US5128737A (en) * 1990-03-02 1992-07-07 Silicon Dynamics, Inc. Semiconductor integrated circuit fabrication yield improvements
US5200810A (en) * 1990-04-05 1993-04-06 General Electric Company High density interconnect structure with top mounted components
SG52794A1 (en) * 1990-04-26 1998-09-28 Hitachi Ltd Semiconductor device and method for manufacturing same
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5050039A (en) * 1990-06-26 1991-09-17 Digital Equipment Corporation Multiple circuit chip mounting and cooling arrangement
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5768613A (en) * 1990-07-06 1998-06-16 Advanced Micro Devices, Inc. Computing apparatus configured for partitioned processing
DE69133311T2 (de) * 1990-10-15 2004-06-24 Aptix Corp., San Jose Verbindungssubstrat mit integrierter Schaltung zur programmierbaren Verbindung und Probenuntersuchung
JP2960560B2 (ja) * 1991-02-28 1999-10-06 株式会社日立製作所 超小型電子機器
JPH0833978B2 (ja) * 1991-04-26 1996-03-29 インターナショナル・ビジネス・マシーンズ・コーポレイション 磁気ヘッド及びその製造方法
US5237203A (en) * 1991-05-03 1993-08-17 Trw Inc. Multilayer overlay interconnect for high-density packaging of circuit elements
US5121293A (en) * 1991-08-08 1992-06-09 Sun Microsystems, Inc. Method and apparatus for interconnecting devices using tab in board technology
JP2634516B2 (ja) * 1991-10-15 1997-07-30 三菱電機株式会社 反転型ｉｃの製造方法、反転型ｉｃ、ｉｃモジュール
US5576554A (en) * 1991-11-05 1996-11-19 Monolithic System Technology, Inc. Wafer-scale integrated circuit interconnect structure architecture
US5801432A (en) * 1992-06-04 1998-09-01 Lsi Logic Corporation Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes
JP3210466B2 (ja) * 1993-02-25 2001-09-17 株式会社リコー Ｃｐｕコア、該ｃｐｕコアを有するａｓｉｃ、及び該ａｓｉｃを備えたエミュレーションシステム
US5391917A (en) * 1993-05-10 1995-02-21 International Business Machines Corporation Multiprocessor module packaging
KR0147259B1 (ko) * 1994-10-27 1998-08-01 김광호 적층형 패키지 및 그 제조방법
JPH08147197A (ja) * 1994-11-25 1996-06-07 Sanyo Electric Co Ltd 障害情報を記憶する情報処理装置
JP2677216B2 (ja) 1994-12-16 1997-11-17 株式会社押野電気製作所 パネル・プリント基板用小形ランプソケット装置
US5552633A (en) * 1995-06-06 1996-09-03 Martin Marietta Corporation Three-dimensional multimodule HDI arrays with heat spreading
JPH11120075A (ja) * 1997-10-20 1999-04-30 Toshiba Corp 半導体記憶装置及び半導体記憶システム
US6198118B1 (en) * 1998-03-09 2001-03-06 Integration Associates, Inc. Distributed photodiode structure
US6268660B1 (en) * 1999-03-05 2001-07-31 International Business Machines Corporation Silicon packaging with through wafer interconnects
JP2000315776A (ja) * 1999-05-06 2000-11-14 Hitachi Ltd 半導体装置
JP2001024150A (ja) * 1999-07-06 2001-01-26 Sony Corp 半導体装置
US6612605B2 (en) * 1999-09-29 2003-09-02 K-2 Corporation Integrated modular glide board
JP4569912B2 (ja) * 2000-03-10 2010-10-27 エルピーダメモリ株式会社 メモリシステム
JP4569913B2 (ja) * 2000-03-10 2010-10-27 エルピーダメモリ株式会社 メモリモジュール
KR100336281B1 (ko) * 2000-04-20 2002-05-13 윤종용 수리할 수 있는 멀티 칩 패키지
JP2002108835A (ja) * 2000-09-29 2002-04-12 Mitsubishi Electric Corp 車載電子制御装置
KR20050025132A (ko) * 2001-11-16 2005-03-11 아엠이-아그로린츠 멜라민 인터내셔날 게엠베하 멜렘-비함유 멜라민의 제조 방법 및 냉각기
US7246245B2 (en) * 2002-01-10 2007-07-17 Broadcom Corporation System on a chip for network storage devices

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US5614761A (en) 1997-03-25
EP1394557A3 (de) 2004-10-20
EP0501474B1 (de) 2003-05-21
EP0786809B1 (de) 2004-01-28
US7701743B2 (en) 2010-04-20
DE69233297D1 (de) 2004-03-04
US20040164324A1 (en) 2004-08-26
DE69233063T2 (de) 2004-09-16
DE69233297T2 (de) 2004-11-18
US20080303175A1 (en) 2008-12-11
US20010010064A1 (en) 2001-07-26
JPH04273470A (ja) 1992-09-29
US6584004B2 (en) 2003-06-24
US20050248017A1 (en) 2005-11-10
US5789805A (en) 1998-08-04
EP0786809A1 (de) 1997-07-30
US6728904B2 (en) 2004-04-27
JP2960560B2 (ja) 1999-10-06
CA2061949A1 (en) 1992-08-29
US20070158814A1 (en) 2007-07-12
US6223273B1 (en) 2001-04-24
US5468992A (en) 1995-11-21
US7425763B2 (en) 2008-09-16
EP0501474A2 (de) 1992-09-02
US6195742B1 (en) 2001-02-27
US20030156441A1 (en) 2003-08-21
EP0501474A3 (en) 1993-01-13
EP1394557A2 (de) 2004-03-03
US7233534B2 (en) 2007-06-19
US7120069B2 (en) 2006-10-10
CA2061949C (en) 1998-01-27

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