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DE69131541D1 - Halbleiterbauelement mit vergrösserter elektrostatischer Durchbruchspannung - Google Patents

Halbleiterbauelement mit vergrösserter elektrostatischer Durchbruchspannung

Info

Publication number
DE69131541D1
DE69131541D1 DE69131541T DE69131541T DE69131541D1 DE 69131541 D1 DE69131541 D1 DE 69131541D1 DE 69131541 T DE69131541 T DE 69131541T DE 69131541 T DE69131541 T DE 69131541T DE 69131541 D1 DE69131541 D1 DE 69131541D1
Authority
DE
Germany
Prior art keywords
semiconductor device
breakdown voltage
electrostatic breakdown
increased electrostatic
increased
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69131541T
Other languages
English (en)
Other versions
DE69131541T2 (de
Inventor
Satoshi Ohtani
Masayuki Yoshida
Nobutaka Kitagawa
Tomotaka Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69131541D1 publication Critical patent/DE69131541D1/de
Application granted granted Critical
Publication of DE69131541T2 publication Critical patent/DE69131541T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0181Manufacturing their gate insulating layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
DE69131541T 1990-03-02 1991-02-28 Halbleiterbauelement mit vergrösserter elektrostatischer Durchbruchspannung Expired - Fee Related DE69131541T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4946190 1990-03-02

Publications (2)

Publication Number Publication Date
DE69131541D1 true DE69131541D1 (de) 1999-09-30
DE69131541T2 DE69131541T2 (de) 2000-01-13

Family

ID=12831785

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69131541T Expired - Fee Related DE69131541T2 (de) 1990-03-02 1991-02-28 Halbleiterbauelement mit vergrösserter elektrostatischer Durchbruchspannung

Country Status (4)

Country Link
US (1) US5239194A (de)
EP (1) EP0444686B1 (de)
KR (1) KR940004449B1 (de)
DE (1) DE69131541T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2878587B2 (ja) * 1993-10-20 1999-04-05 株式会社日立製作所 半導体装置
JPH07321306A (ja) * 1994-03-31 1995-12-08 Seiko Instr Inc 半導体装置およびその製造方法
TW308733B (de) * 1995-07-20 1997-06-21 Siemens Ag
US5929491A (en) * 1995-07-20 1999-07-27 Siemens Aktiengesellschaft Integrated circuit with ESD protection
JPH1187727A (ja) * 1997-09-12 1999-03-30 Mitsubishi Electric Corp 半導体装置
JP4054093B2 (ja) 1997-10-09 2008-02-27 株式会社ルネサステクノロジ 半導体装置
US6815775B2 (en) 2001-02-02 2004-11-09 Industrial Technology Research Institute ESD protection design with turn-on restraining method and structures
US7244992B2 (en) * 2003-07-17 2007-07-17 Ming-Dou Ker Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection
CN110223979B (zh) * 2019-07-17 2021-07-09 昆山国显光电有限公司 静电保护电路、显示面板和显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5671975A (en) * 1979-11-16 1981-06-15 Matsushita Electric Ind Co Ltd Mos type semiconductor system
JPS5833870A (ja) * 1981-08-24 1983-02-28 Hitachi Ltd 半導体装置
JPS59121976A (ja) * 1982-12-28 1984-07-14 Fujitsu Ltd 半導体装置
JPH0695563B2 (ja) * 1985-02-01 1994-11-24 株式会社日立製作所 半導体装置
US4918501A (en) * 1984-05-23 1990-04-17 Hitachi, Ltd. Semiconductor device and method of producing the same
JPS61216477A (ja) * 1985-03-22 1986-09-26 Nec Corp 半導体装置
US4734752A (en) * 1985-09-27 1988-03-29 Advanced Micro Devices, Inc. Electrostatic discharge protection device for CMOS integrated circuit outputs
JPS63122175A (ja) * 1986-11-11 1988-05-26 Oki Electric Ind Co Ltd Mos電界効果トランジスタ

Also Published As

Publication number Publication date
KR910017623A (ko) 1991-11-05
DE69131541T2 (de) 2000-01-13
EP0444686B1 (de) 1999-08-25
US5239194A (en) 1993-08-24
EP0444686A1 (de) 1991-09-04
KR940004449B1 (ko) 1994-05-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee