DE69131541D1 - Halbleiterbauelement mit vergrösserter elektrostatischer Durchbruchspannung - Google Patents
Halbleiterbauelement mit vergrösserter elektrostatischer DurchbruchspannungInfo
- Publication number
- DE69131541D1 DE69131541D1 DE69131541T DE69131541T DE69131541D1 DE 69131541 D1 DE69131541 D1 DE 69131541D1 DE 69131541 T DE69131541 T DE 69131541T DE 69131541 T DE69131541 T DE 69131541T DE 69131541 D1 DE69131541 D1 DE 69131541D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- breakdown voltage
- electrostatic breakdown
- increased electrostatic
- increased
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0181—Manufacturing their gate insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4946190 | 1990-03-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69131541D1 true DE69131541D1 (de) | 1999-09-30 |
DE69131541T2 DE69131541T2 (de) | 2000-01-13 |
Family
ID=12831785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69131541T Expired - Fee Related DE69131541T2 (de) | 1990-03-02 | 1991-02-28 | Halbleiterbauelement mit vergrösserter elektrostatischer Durchbruchspannung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5239194A (de) |
EP (1) | EP0444686B1 (de) |
KR (1) | KR940004449B1 (de) |
DE (1) | DE69131541T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2878587B2 (ja) * | 1993-10-20 | 1999-04-05 | 株式会社日立製作所 | 半導体装置 |
JPH07321306A (ja) * | 1994-03-31 | 1995-12-08 | Seiko Instr Inc | 半導体装置およびその製造方法 |
TW308733B (de) * | 1995-07-20 | 1997-06-21 | Siemens Ag | |
US5929491A (en) * | 1995-07-20 | 1999-07-27 | Siemens Aktiengesellschaft | Integrated circuit with ESD protection |
JPH1187727A (ja) * | 1997-09-12 | 1999-03-30 | Mitsubishi Electric Corp | 半導体装置 |
JP4054093B2 (ja) | 1997-10-09 | 2008-02-27 | 株式会社ルネサステクノロジ | 半導体装置 |
US6815775B2 (en) | 2001-02-02 | 2004-11-09 | Industrial Technology Research Institute | ESD protection design with turn-on restraining method and structures |
US7244992B2 (en) * | 2003-07-17 | 2007-07-17 | Ming-Dou Ker | Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection |
CN110223979B (zh) * | 2019-07-17 | 2021-07-09 | 昆山国显光电有限公司 | 静电保护电路、显示面板和显示装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5671975A (en) * | 1979-11-16 | 1981-06-15 | Matsushita Electric Ind Co Ltd | Mos type semiconductor system |
JPS5833870A (ja) * | 1981-08-24 | 1983-02-28 | Hitachi Ltd | 半導体装置 |
JPS59121976A (ja) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | 半導体装置 |
JPH0695563B2 (ja) * | 1985-02-01 | 1994-11-24 | 株式会社日立製作所 | 半導体装置 |
US4918501A (en) * | 1984-05-23 | 1990-04-17 | Hitachi, Ltd. | Semiconductor device and method of producing the same |
JPS61216477A (ja) * | 1985-03-22 | 1986-09-26 | Nec Corp | 半導体装置 |
US4734752A (en) * | 1985-09-27 | 1988-03-29 | Advanced Micro Devices, Inc. | Electrostatic discharge protection device for CMOS integrated circuit outputs |
JPS63122175A (ja) * | 1986-11-11 | 1988-05-26 | Oki Electric Ind Co Ltd | Mos電界効果トランジスタ |
-
1991
- 1991-02-27 KR KR1019910003152A patent/KR940004449B1/ko not_active IP Right Cessation
- 1991-02-28 EP EP91103048A patent/EP0444686B1/de not_active Expired - Lifetime
- 1991-02-28 DE DE69131541T patent/DE69131541T2/de not_active Expired - Fee Related
- 1991-02-28 US US07/661,816 patent/US5239194A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR910017623A (ko) | 1991-11-05 |
DE69131541T2 (de) | 2000-01-13 |
EP0444686B1 (de) | 1999-08-25 |
US5239194A (en) | 1993-08-24 |
EP0444686A1 (de) | 1991-09-04 |
KR940004449B1 (ko) | 1994-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |