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DE69116783D1 - Laserdiodenmodul und Verfahren zu seiner Herstellung - Google Patents

Laserdiodenmodul und Verfahren zu seiner Herstellung

Info

Publication number
DE69116783D1
DE69116783D1 DE69116783T DE69116783T DE69116783D1 DE 69116783 D1 DE69116783 D1 DE 69116783D1 DE 69116783 T DE69116783 T DE 69116783T DE 69116783 T DE69116783 T DE 69116783T DE 69116783 D1 DE69116783 D1 DE 69116783D1
Authority
DE
Germany
Prior art keywords
manufacture
laser diode
diode module
module
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69116783T
Other languages
English (en)
Other versions
DE69116783T2 (de
Inventor
Takayuki Masuko
Shunichi Satoh
Tetsuo Ishizaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69116783D1 publication Critical patent/DE69116783D1/de
Publication of DE69116783T2 publication Critical patent/DE69116783T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G02B6/4208—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69116783T 1990-09-25 1991-09-24 Laserdiodenmodul und Verfahren zu seiner Herstellung Expired - Fee Related DE69116783T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2251829A JP2959678B2 (ja) 1990-09-25 1990-09-25 半導体レーザモジュール及び該モジュールの製造方法

Publications (2)

Publication Number Publication Date
DE69116783D1 true DE69116783D1 (de) 1996-03-14
DE69116783T2 DE69116783T2 (de) 1996-07-11

Family

ID=17228545

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69116783T Expired - Fee Related DE69116783T2 (de) 1990-09-25 1991-09-24 Laserdiodenmodul und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
US (1) US5214660A (de)
EP (1) EP0477841B1 (de)
JP (1) JP2959678B2 (de)
DE (1) DE69116783T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2763980B2 (ja) * 1992-01-14 1998-06-11 富士通株式会社 光半導体モジュール
BE1006983A3 (nl) * 1993-04-06 1995-02-07 Koninkl Philips Electronics Nv Opto-electronische inrichting met een koppeling tussen een opto-electronische component, in het bijzonder een halfgeleiderdiodelaser, en een optische glasvezel en werkwijze ter vervaardiging van een dergelijke inrichting.
AU1379095A (en) * 1993-12-10 1995-06-27 Jds Fitel Inc. Optical non-reciprocal devices
US5522225A (en) * 1994-12-19 1996-06-04 Xerox Corporation Thermoelectric cooler and temperature sensor subassembly with improved temperature control
US5717712A (en) * 1995-09-12 1998-02-10 Lucent Technologies Inc. Laser communication system with temperature controlled
DE19617552A1 (de) * 1996-05-02 1997-11-06 Heidelberger Druckmasch Ag Verfahren und Vorrichtung zur Regelung der Temperatur in einer mit Laserlicht arbeitenden Druckplatten-Beschriftungseinheit, insbesondere einer Offset-Druckmaschine
US5740191A (en) * 1996-07-13 1998-04-14 Lucent Technologies Inc. Wide temperature range uncooled lightwave transmitter having a heated laser
JP3076246B2 (ja) * 1996-08-13 2000-08-14 日本電気株式会社 ペルチェクーラ内蔵半導体レーザモジュール
JPH10190131A (ja) * 1996-12-27 1998-07-21 Fuji Photo Film Co Ltd 半導体レーザー
JPH10200208A (ja) * 1997-01-09 1998-07-31 Nec Corp 半導体レーザーモジュール
US20040069339A1 (en) * 2002-10-10 2004-04-15 Agere Systems Inc. Thermoelectric cooler having first and second TEC elements with differing physical parameters
JP3775397B2 (ja) * 2003-03-27 2006-05-17 住友電気工業株式会社 光送信モジュール
JP2005303242A (ja) 2004-03-19 2005-10-27 Hitachi Cable Ltd 冷却機能付き電気−光変換モジュール
US7856038B2 (en) 2006-03-27 2010-12-21 Sumitomo Electric Industries, Ltd. Light-emitting module installing thermo-electric controller
WO2017221441A1 (ja) * 2016-06-20 2017-12-28 三菱電機株式会社 光通信デバイス
JP7507682B2 (ja) * 2020-12-28 2024-06-28 新光電気工業株式会社 半導体パッケージ用ステム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102390A (en) * 1980-12-17 1982-06-25 Fuji Kagakushi Kogyo Co Ltd Transfer textile printing heat sensitive recording medium
US4399541A (en) * 1981-02-17 1983-08-16 Northern Telecom Limited Light emitting device package having combined heater/cooler
JPS5877273A (ja) * 1981-11-02 1983-05-10 Hitachi Ltd レ−ザ−ダイオ−ド
JPS6052079A (ja) * 1983-09-01 1985-03-23 Matsushita Electric Ind Co Ltd 半導体レ−ザ装置
JPS61234588A (ja) * 1985-04-11 1986-10-18 Mitsubishi Electric Corp 光半導体素子用サブマウント
JPS62188293A (ja) * 1986-02-13 1987-08-17 Nec Corp 半導体レ−ザ装置
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
NL8800140A (nl) * 1988-01-22 1989-08-16 Philips Nv Laserdiode module.
US5068865A (en) * 1988-06-09 1991-11-26 Nec Corporation Semiconductor laser module

Also Published As

Publication number Publication date
EP0477841B1 (de) 1996-01-31
US5214660A (en) 1993-05-25
DE69116783T2 (de) 1996-07-11
JPH04132286A (ja) 1992-05-06
JP2959678B2 (ja) 1999-10-06
EP0477841A2 (de) 1992-04-01
EP0477841A3 (en) 1992-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee