[go: up one dir, main page]

DE69116173D1 - Verfahren zum beschichten von dielektrischen werkstücken aus keramik - Google Patents

Verfahren zum beschichten von dielektrischen werkstücken aus keramik

Info

Publication number
DE69116173D1
DE69116173D1 DE69116173T DE69116173T DE69116173D1 DE 69116173 D1 DE69116173 D1 DE 69116173D1 DE 69116173 T DE69116173 T DE 69116173T DE 69116173 T DE69116173 T DE 69116173T DE 69116173 D1 DE69116173 D1 DE 69116173D1
Authority
DE
Germany
Prior art keywords
dielectric ceramic
coating dielectric
ceramic workpieces
workpieces
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69116173T
Other languages
English (en)
Other versions
DE69116173T2 (de
Inventor
Elli Galla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pulse Finland Oy
Original Assignee
LK Products Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LK Products Oy filed Critical LK Products Oy
Publication of DE69116173D1 publication Critical patent/DE69116173D1/de
Application granted granted Critical
Publication of DE69116173T2 publication Critical patent/DE69116173T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69116173T 1990-09-19 1991-09-18 Verfahren zum beschichten von dielektrischen werkstücken aus keramik Expired - Fee Related DE69116173T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI904623A FI88286C (fi) 1990-09-19 1990-09-19 Foerfarande foer att belaegga ett dielektriskt keramiskt stycke med ett elektricitet ledande skikt
PCT/FI1991/000284 WO1992005127A1 (en) 1990-09-19 1991-09-18 Method for coating a dielectric ceramic piece

Publications (2)

Publication Number Publication Date
DE69116173D1 true DE69116173D1 (de) 1996-02-15
DE69116173T2 DE69116173T2 (de) 1996-06-05

Family

ID=8531088

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69116173T Expired - Fee Related DE69116173T2 (de) 1990-09-19 1991-09-18 Verfahren zum beschichten von dielektrischen werkstücken aus keramik

Country Status (7)

Country Link
US (1) US5281326A (de)
EP (1) EP0591198B1 (de)
JP (1) JPH05501852A (de)
DE (1) DE69116173T2 (de)
DK (1) DK0591198T3 (de)
FI (1) FI88286C (de)
WO (1) WO1992005127A1 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638629C2 (de) * 1996-09-20 2000-05-31 Epcos Ag Verfahren zum Aufbringen einer elektrisch leitfähigen Grundschicht auf einen Keramikkörper
KR100384867B1 (ko) 2001-05-03 2003-05-23 주식회사 하이닉스반도체 캐패시터의 제조 방법
US6809612B2 (en) * 2002-04-30 2004-10-26 Cts Corporation Dielectric block signal filters with cost-effective conductive coatings
US7476422B2 (en) * 2002-05-23 2009-01-13 Delphi Technologies, Inc. Copper circuit formed by kinetic spray
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
FI118748B (fi) * 2004-06-28 2008-02-29 Pulse Finland Oy Pala-antenni
WO2006000650A1 (en) * 2004-06-28 2006-01-05 Pulse Finland Oy Antenna component
FI20041455A (fi) * 2004-11-11 2006-05-12 Lk Products Oy Antennikomponentti
FI20055420A0 (fi) * 2005-07-25 2005-07-25 Lk Products Oy Säädettävä monikaista antenni
FI119009B (fi) * 2005-10-03 2008-06-13 Pulse Finland Oy Monikaistainen antennijärjestelmä
FI118782B (fi) 2005-10-14 2008-03-14 Pulse Finland Oy Säädettävä antenni
FI119577B (fi) * 2005-11-24 2008-12-31 Pulse Finland Oy Monikaistainen antennikomponentti
US8618990B2 (en) 2011-04-13 2013-12-31 Pulse Finland Oy Wideband antenna and methods
US10211538B2 (en) 2006-12-28 2019-02-19 Pulse Finland Oy Directional antenna apparatus and methods
FI20075269A0 (fi) * 2007-04-19 2007-04-19 Pulse Finland Oy Menetelmä ja järjestely antennin sovittamiseksi
FI120427B (fi) 2007-08-30 2009-10-15 Pulse Finland Oy Säädettävä monikaista-antenni
FI20096134A0 (fi) 2009-11-03 2009-11-03 Pulse Finland Oy Säädettävä antenni
FI20096251A0 (sv) 2009-11-27 2009-11-27 Pulse Finland Oy MIMO-antenn
US8847833B2 (en) * 2009-12-29 2014-09-30 Pulse Finland Oy Loop resonator apparatus and methods for enhanced field control
FI20105158A (fi) 2010-02-18 2011-08-19 Pulse Finland Oy Kuorisäteilijällä varustettu antenni
US9406998B2 (en) 2010-04-21 2016-08-02 Pulse Finland Oy Distributed multiband antenna and methods
FI20115072A0 (fi) 2011-01-25 2011-01-25 Pulse Finland Oy Moniresonanssiantenni, -antennimoduuli ja radiolaite
US9673507B2 (en) 2011-02-11 2017-06-06 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US8648752B2 (en) 2011-02-11 2014-02-11 Pulse Finland Oy Chassis-excited antenna apparatus and methods
US8866689B2 (en) 2011-07-07 2014-10-21 Pulse Finland Oy Multi-band antenna and methods for long term evolution wireless system
US9450291B2 (en) 2011-07-25 2016-09-20 Pulse Finland Oy Multiband slot loop antenna apparatus and methods
US9123990B2 (en) 2011-10-07 2015-09-01 Pulse Finland Oy Multi-feed antenna apparatus and methods
US9531058B2 (en) 2011-12-20 2016-12-27 Pulse Finland Oy Loosely-coupled radio antenna apparatus and methods
US9484619B2 (en) 2011-12-21 2016-11-01 Pulse Finland Oy Switchable diversity antenna apparatus and methods
US8988296B2 (en) 2012-04-04 2015-03-24 Pulse Finland Oy Compact polarized antenna and methods
US9979078B2 (en) 2012-10-25 2018-05-22 Pulse Finland Oy Modular cell antenna apparatus and methods
US10069209B2 (en) 2012-11-06 2018-09-04 Pulse Finland Oy Capacitively coupled antenna apparatus and methods
US9647338B2 (en) 2013-03-11 2017-05-09 Pulse Finland Oy Coupled antenna structure and methods
US10079428B2 (en) 2013-03-11 2018-09-18 Pulse Finland Oy Coupled antenna structure and methods
EP2803756A1 (de) * 2013-05-13 2014-11-19 Atotech Deutschland GmbH Verfahren zur Ablagerung dicker Kupferschichten auf gesinterten Materialien
US9634383B2 (en) 2013-06-26 2017-04-25 Pulse Finland Oy Galvanically separated non-interacting antenna sector apparatus and methods
US9680212B2 (en) 2013-11-20 2017-06-13 Pulse Finland Oy Capacitive grounding methods and apparatus for mobile devices
US9590308B2 (en) 2013-12-03 2017-03-07 Pulse Electronics, Inc. Reduced surface area antenna apparatus and mobile communications devices incorporating the same
US9350081B2 (en) 2014-01-14 2016-05-24 Pulse Finland Oy Switchable multi-radiator high band antenna apparatus
US9948002B2 (en) 2014-08-26 2018-04-17 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9973228B2 (en) 2014-08-26 2018-05-15 Pulse Finland Oy Antenna apparatus with an integrated proximity sensor and methods
US9722308B2 (en) 2014-08-28 2017-08-01 Pulse Finland Oy Low passive intermodulation distributed antenna system for multiple-input multiple-output systems and methods of use
US9906260B2 (en) 2015-07-30 2018-02-27 Pulse Finland Oy Sensor-based closed loop antenna swapping apparatus and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607681A (en) * 1969-09-03 1971-09-21 Hooker Chemical Corp Metallization of ceramics
FR2188025B1 (de) * 1972-06-01 1974-07-26 Saint Gobain Pont A Mousson
JPS61121501A (ja) * 1984-11-17 1986-06-09 Tdk Corp 誘電体共振器およびその製造方法
JPH0785495B2 (ja) * 1985-03-18 1995-09-13 ティーディーケイ株式会社 酸化物セラミツク上の銅電極形成法
US4808274A (en) * 1986-09-10 1989-02-28 Engelhard Corporation Metallized substrates and process for producing
JPH0817140B2 (ja) * 1988-07-28 1996-02-21 昭栄化学工業株式会社 セラミックコンデンサ端子電極用導電性組成物
US5066620A (en) * 1989-01-31 1991-11-19 Asahi Glass Company Ltd. Conductive paste compositions and ceramic substrates

Also Published As

Publication number Publication date
FI88286B (fi) 1993-01-15
DE69116173T2 (de) 1996-06-05
FI904623A (fi) 1992-03-20
FI88286C (fi) 1993-04-26
DK0591198T3 (da) 1996-02-05
FI904623A0 (fi) 1990-09-19
JPH05501852A (ja) 1993-04-08
EP0591198B1 (de) 1996-01-03
US5281326A (en) 1994-01-25
EP0591198A1 (de) 1994-04-13
WO1992005127A1 (en) 1992-04-02

Similar Documents

Publication Publication Date Title
DE69116173D1 (de) Verfahren zum beschichten von dielektrischen werkstücken aus keramik
DE69025746D1 (de) Verfahren zum Auftragen keramischer Schichten
DE69501010D1 (de) Verfahren zum Beschichten metallischer Oberflächen
DE69731826D1 (de) Verfahren zum beschichten von substraten
DE59201549D1 (de) Verfahren zur Feinbearbeitung von Werkstück-Oberflächen.
AT383149B (de) Verfahren zum galvanischen metallisieren von gegenstaenden
DE69522809D1 (de) Verfahren zum Verblasen von Kupferstein
DE69310845D1 (de) Verfahren zum Hartlöten von Aluminium-Gegenständen
DE69301060D1 (de) Verfahren zum Aufbringen von Lot
DE69201913D1 (de) Verfahren zum Trocknen von Gegenständen.
DE59405452D1 (de) Verfahren zum Pulverbeschichten von Werkstücken
DE69619898D1 (de) Verfahren zum Verbinden von Keramik
DE69016043D1 (de) Verfahren zum entfernen von polyacetalbindemitteln aus keramischen grünkörpern.
DE69508293D1 (de) Verfahren zum Polieren von Metallbändern
DE59206321D1 (de) Verfahren zum phosphatieren von metalloberflächen
DE69211850D1 (de) Verfahren zum löten
DE69028174D1 (de) Verfahren zum Beschichten
DE69306782D1 (de) Verfahren zum verbinden von perfluorelastomeren
DE69319347D1 (de) Verfahren zum verkleben von oberflächen
DE69322994D1 (de) Verfahren zum Löten
DE58901967D1 (de) Verfahren zum metallisieren von substratoberflaechen.
DE69301684D1 (de) Verfahren zum Kernzeichnen und Dekorieren von Keramik
DE59302511D1 (de) Verfahren zum Beschichten von Substraten
DE69114048D1 (de) Verfahren zum Schützen von keramischen Oberflächen.
DE59609735D1 (de) Verfahren zum Bearbeiten der Oberflächen von Werkstücken

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee