DE69105684D1 - Löteinrichtung. - Google Patents

Löteinrichtung.

Info

Publication number: DE69105684D1
Authority: DE; Germany
Prior art keywords: soldering device; soldering
Prior art date: 1990-09-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69105684T

Other languages

English (en)

Other versions

DE69105684T2 (de

Inventor

Terry F Hayden

Christopher A Hicks

Peter G Ledermann

Alvin D Nguyen

Stephen C Steinbach

Stanley K Yu

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-09-24

Filing date

1991-09-04

Publication date

1995-01-19

1991-09-04 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1995-01-19 Publication of DE69105684D1 publication Critical patent/DE69105684D1/de

1995-05-24 Application granted granted Critical

1995-05-24 Publication of DE69105684T2 publication Critical patent/DE69105684T2/de

2011-09-05 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Wire Bonding (AREA)
Nozzles (AREA)

DE69105684T 1990-09-24 1991-09-04 Löteinrichtung. Expired - Fee Related DE69105684T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US07/586,654 US5065932A (en)	1990-09-24	1990-09-24	Solder placement nozzle with inert cover gas and inert gas bleed

Publications (2)

Publication Number	Publication Date
DE69105684D1 true DE69105684D1 (de)	1995-01-19
DE69105684T2 DE69105684T2 (de)	1995-05-24

Family

ID=24346614

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69105684T Expired - Fee Related DE69105684T2 (de)	1990-09-24	1991-09-04	Löteinrichtung.

Country Status (4)

Country	Link
US (1)	US5065932A (de)
EP (1)	EP0478161B1 (de)
JP (1)	JP2528575B2 (de)
DE (1)	DE69105684T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0652747B2 (ja) *	1990-02-05	1994-07-06	インターナショナル・ビジネス・マシーンズ・コーポレイション	断熱装置
WO1994004305A1 (en) *	1992-08-18	1994-03-03	Precision Dispensing Equipment, Inc.	Method and apparatus for applying flux
US5328085A (en) *	1992-08-18	1994-07-12	Precision Dispensing Equipment, Inc.	Apparatus for applying flux
DE4320055A1 (de) *	1993-06-17	1994-12-22	Ghassem Dipl Ing Azdasht	Belötungsvorrichtung
US5320273A (en) *	1993-08-02	1994-06-14	Ford Motor Company	Gas flow distribution system for molten solder dispensing process
DE59502618D1 (de) *	1994-11-04	1998-07-23	Siemens Ag	Verfahren und vorrichtung zum kontaktieren des wicklungsdrahtes einer spule
US6015083A (en) *	1995-12-29	2000-01-18	Microfab Technologies, Inc.	Direct solder bumping of hard to solder substrate
US5746368A (en) *	1996-05-15	1998-05-05	Ford Motor Company	Molten solder dispensing system
US5810241A (en) *	1996-09-16	1998-09-22	International Business Machines Corporation	Solder bonding/debonding nozzle insert
US6076723A (en) *	1998-08-19	2000-06-20	Hewlett-Packard Company	Metal jet deposition system
US6244788B1 (en)	1999-06-02	2001-06-12	William Hernandez	Apparatus for supplying solder balls
JP2001274532A (ja) *	2000-03-24	2001-10-05	Olympus Optical Co Ltd	電気配線形成システム
SG91867A1 (en) *	2000-05-24	2002-10-15	Casem Asia Pte Ltd	Improved apparatus and method for dispensing solder
US6484923B2 (en) *	2001-02-27	2002-11-26	Miguel Figueroa-Rivera	Hand held flux and solder feeding tool
US6827249B2 (en) *	2002-09-30	2004-12-07	Newport Corporation	Fluxless tube seal
JP4320350B2 (ja) *	2006-08-23	2009-08-26	Ｔｄｋ株式会社	導電性部材供給装置及び導電性部材供給方法
US7699208B2 (en)	2007-11-30	2010-04-20	Nordson Corporation	Soldering tip, soldering iron, and soldering system
KR101216192B1 (ko) *	2012-07-31	2012-12-28	이승해	스폿 용접 건의 용접 팁 교환장치
CN110402032B (zh) *	2019-08-16	2022-03-25	河南拓普艾科技有限公司	一种利用热传导性对电路板进行预加工的设备
EP3936271B1 (de) *	2020-07-08	2024-09-25	Illinois Tool Works, Inc.	Lötdüse, system und verwendung
JP2024530935A (ja)	2021-08-04	2024-08-27	ベシスウィツァランドエージー	はんだ線を吐出するための装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US1760519A (en) *	1926-12-29	1930-05-27	Gen Electric	Soldering iron
US1906225A (en) *	1931-04-15	1933-05-02	Dupau Fernand	Electrically-heated soldering-iron
FR752389A (fr) *	1932-06-16	1933-09-21	Chaudronneries Des Pyrenees	Procédé de soudure à l'hydrogène atomique par l'utilisation du gaz à l'eau et produits en résultant
US2194920A (en) *	1937-08-31	1940-03-26	Union Carbide & Carbon Res Lab	Process of dispensing volatile welding flux
US2891308A (en) *	1952-11-15	1959-06-23	Metallizing Company Of America	Method and apparatus for applying solder
US2780712A (en) *	1955-02-16	1957-02-05	John F Thomas	Soldering device
US3358897A (en) *	1964-03-31	1967-12-19	Tempress Res Co	Electric lead wire bonding tools
US3524752A (en) *	1967-08-01	1970-08-18	Du Pont	Addition of nitrogen gas to atmosphere in alloy diffusion coating
NL6918814A (de) *	1969-12-16	1971-06-18
US3838240A (en) *	1973-04-04	1974-09-24	Rca Corp	Bonding tool and method of bonding therewith
US3917147A (en) *	1974-04-02	1975-11-04	Louis Vanyi	Solder tip cleaning apparatus
US4549059A (en) *	1982-11-24	1985-10-22	Nec Corporation	Wire bonder with controlled atmosphere
DK362684A (da) *	1984-07-24	1986-01-25	Birger Hans Poelckemann	Loddekolbe
JPS6158246A (ja) *	1984-08-30	1986-03-25	Toshiba Corp	ワイヤボンデイング方法
US4805830A (en) *	1986-04-09	1989-02-21	Apollo Seiko Ltd.	Method for soldering arrayed terminals and an automatic soldering device
US4976393A (en) *	1986-12-26	1990-12-11	Hitachi, Ltd.	Semiconductor device and production process thereof, as well as wire bonding device used therefor
US4898117A (en) *	1988-04-15	1990-02-06	International Business Machines Corporation	Solder deposition system

1990
- 1990-09-24 US US07/586,654 patent/US5065932A/en not_active Expired - Fee Related
1991
- 1991-08-16 JP JP3229729A patent/JP2528575B2/ja not_active Expired - Fee Related
- 1991-09-04 EP EP91308092A patent/EP0478161B1/de not_active Expired - Lifetime
- 1991-09-04 DE DE69105684T patent/DE69105684T2/de not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP0478161A3 (en)	1992-06-03
JPH04246888A (ja)	1992-09-02
EP0478161B1 (de)	1994-12-07
JP2528575B2 (ja)	1996-08-28
US5065932A (en)	1991-11-19
EP0478161A2 (de)	1992-04-01
DE69105684T2 (de)	1995-05-24

Publication	Publication Date	Title
DE68914006D1 (de)	1994-04-28	Reflowartiger Lötapparat.
NO912647L (no)	1992-02-03	Betraktningsanordning.
DE69107395D1 (de)	1995-03-23	Einschlitzvorrichtung.
DE69111278D1 (de)	1995-08-24	Biege-Vorrichtung.
DE69103935D1 (de)	1994-10-20	Biegungseinrichtung.
DE69107121D1 (de)	1995-03-16	Laservorrichtung.
DE69108141D1 (de)	1995-04-20	Stanzgerät.
DE69105684D1 (de)	1995-01-19	Löteinrichtung.
DE69108336D1 (de)	1995-04-27	Lötmittelaufbringung.
DE69203841D1 (de)	1995-09-07	Verbindungsvorrichtung.
DE69107423D1 (de)	1995-03-23	Klemmvorrichtung.
TR26312A (tr)	1995-03-15	Resim-icinde-resim islemeli televizyon aygiti.
DE69122204D1 (de)	1996-10-24	Lötgerät
DE69108745D1 (de)	1995-05-18	Einblendgerät.
DE69114244D1 (de)	1995-12-07	Steppvorrichtung.
DE69115283D1 (de)	1996-01-18	Positioniervorrichtung.
DE69109455D1 (de)	1995-06-08	Ausgangsvorrichtung.
DE69004565D1 (de)	1993-12-16	Klemmvorrichtung.
DE69202448D1 (de)	1995-06-14	Lötverfahren.
FI921140A0 (fi)	1992-03-17	Gelformulater foer farliga produkter.
DE59104211D1 (de)	1995-02-23	Positioniervorrichtung.
FI900185L (fi)	1991-07-13	Appliceringsanordning.
ITRM910970A0 (it)	1991-12-24	Dispositivo di zettatura.
FI910744L (fi)	1991-08-18	Telekommunikationsanordning.
FI910743L (fi)	1991-08-18	Telekommunikationsanordning.

Legal Events

Date	Code	Title	Description
1996-01-11	8364	No opposition during term of opposition
1997-09-11	8339	Ceased/non-payment of the annual fee