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DE69202448D1 - Lötverfahren. - Google Patents

Lötverfahren.

Info

Publication number
DE69202448D1
DE69202448D1 DE69202448T DE69202448T DE69202448D1 DE 69202448 D1 DE69202448 D1 DE 69202448D1 DE 69202448 T DE69202448 T DE 69202448T DE 69202448 T DE69202448 T DE 69202448T DE 69202448 D1 DE69202448 D1 DE 69202448D1
Authority
DE
Germany
Prior art keywords
soldering process
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69202448T
Other languages
English (en)
Other versions
DE69202448T2 (de
Inventor
Yoshiharu Tsujimoto
Iku Takenaka
Hiromitsu Onishi
Edward K Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Oxygen Industries Ltd
Original Assignee
Osaka Oxygen Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Oxygen Industries Ltd filed Critical Osaka Oxygen Industries Ltd
Publication of DE69202448D1 publication Critical patent/DE69202448D1/de
Application granted granted Critical
Publication of DE69202448T2 publication Critical patent/DE69202448T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/383Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69202448T 1991-12-20 1992-12-17 Lötverfahren. Expired - Fee Related DE69202448T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03338422A JP3103410B2 (ja) 1991-12-20 1991-12-20 特殊雰囲気ガスを用いたはんだ付け方法

Publications (2)

Publication Number Publication Date
DE69202448D1 true DE69202448D1 (de) 1995-06-14
DE69202448T2 DE69202448T2 (de) 1995-09-14

Family

ID=18318005

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69202448T Expired - Fee Related DE69202448T2 (de) 1991-12-20 1992-12-17 Lötverfahren.

Country Status (7)

Country Link
US (1) US5295621A (de)
EP (1) EP0549262B1 (de)
JP (1) JP3103410B2 (de)
AU (1) AU3023292A (de)
CA (1) CA2085820A1 (de)
DE (1) DE69202448T2 (de)
ZA (1) ZA929880B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2683713B2 (ja) * 1992-11-24 1997-12-03 ティーディーケイ株式会社 電子部品のはんだ付け方法及び装置
FR2755260B1 (fr) * 1996-10-31 1998-12-18 Air Liquide Procede et installation de regulation de la composition de l'atmosphere d'une enceinte
US6106281A (en) * 1997-12-12 2000-08-22 Materna; Peter A. Method of reducing the flow of gas needed for a chamber with controlled temperature and controlled composition of gas
CN1191747C (zh) * 2001-09-06 2005-03-02 株式会社理光 电子元件组装检查方法
FR2853806B1 (fr) * 2003-04-09 2005-05-27 Procede et installation de brasage de composants electroniques par refusion limitant les phenomenes de basculement (effet manathan)
CN1981968B (zh) * 2005-10-19 2011-04-13 株式会社田村制作所 锡焊装置的气氛形成方法和气氛形成装置
DE102009003023A1 (de) * 2009-05-12 2010-11-18 Robert Bosch Gmbh Verfahren zum Betreiben eines Durchlauf-Lötofens und Vorrichtung
BR102012032031A2 (pt) 2012-12-14 2014-09-09 Air Liquide Brasil Ltda Equipamento portátil para monitoramento e controle do nível de oxigênio em atmosfera de fornos de refusão
EP3053691A1 (de) * 2015-02-04 2016-08-10 Illinois Tool Works Inc. Reflow Lötofen mit verbessertem Gasreinigungssystem
WO2023196103A1 (en) * 2022-04-08 2023-10-12 Kulicke And Soffa Industries, Inc. Bonding systems, and methods of providing a reducing gas on a bonding system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4240574A (en) * 1978-03-13 1980-12-23 Ford Motor Company Fluxless brazing of aluminum in inert gas
NL7805800A (nl) * 1978-05-29 1979-12-03 Philips Nv Werkwijze en inrichting voor het solderen van onderde- len op een gatloos dikke-film substraat alsmede dikke-film substraat met onderdelen gesoldeerd met de werkwijze.
US4610391A (en) * 1984-12-18 1986-09-09 Union Carbide Corporation Process for wave soldering
US5071058A (en) * 1988-09-30 1991-12-10 Union Carbide Industrial Gases Technology Corporation Process for joining/coating using an atmosphere having a controlled oxidation capability
CA2011030C (en) * 1989-03-20 1994-10-18 Nikhiles Bandyopadhyay Process for reflow soldering
US5046658A (en) * 1989-07-27 1991-09-10 At&T Bell Laboratories Method and apparatus for soldering articles
US5121875A (en) * 1991-02-22 1992-06-16 Union Carbide Industrial Gases Technology Corporation Wave soldering in a protective atmosphere enclosure over a solder pot

Also Published As

Publication number Publication date
EP0549262A1 (de) 1993-06-30
US5295621A (en) 1994-03-22
ZA929880B (en) 1993-12-20
CA2085820A1 (en) 1993-06-21
JP3103410B2 (ja) 2000-10-30
EP0549262B1 (de) 1995-05-10
DE69202448T2 (de) 1995-09-14
AU3023292A (en) 1993-06-24
JPH05191033A (ja) 1993-07-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee