DE69202448D1 - Lötverfahren. - Google Patents
Lötverfahren.Info
- Publication number
- DE69202448D1 DE69202448D1 DE69202448T DE69202448T DE69202448D1 DE 69202448 D1 DE69202448 D1 DE 69202448D1 DE 69202448 T DE69202448 T DE 69202448T DE 69202448 T DE69202448 T DE 69202448T DE 69202448 D1 DE69202448 D1 DE 69202448D1
- Authority
- DE
- Germany
- Prior art keywords
- soldering process
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
- B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03338422A JP3103410B2 (ja) | 1991-12-20 | 1991-12-20 | 特殊雰囲気ガスを用いたはんだ付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69202448D1 true DE69202448D1 (de) | 1995-06-14 |
DE69202448T2 DE69202448T2 (de) | 1995-09-14 |
Family
ID=18318005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69202448T Expired - Fee Related DE69202448T2 (de) | 1991-12-20 | 1992-12-17 | Lötverfahren. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5295621A (de) |
EP (1) | EP0549262B1 (de) |
JP (1) | JP3103410B2 (de) |
AU (1) | AU3023292A (de) |
CA (1) | CA2085820A1 (de) |
DE (1) | DE69202448T2 (de) |
ZA (1) | ZA929880B (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2683713B2 (ja) * | 1992-11-24 | 1997-12-03 | ティーディーケイ株式会社 | 電子部品のはんだ付け方法及び装置 |
FR2755260B1 (fr) * | 1996-10-31 | 1998-12-18 | Air Liquide | Procede et installation de regulation de la composition de l'atmosphere d'une enceinte |
US6106281A (en) * | 1997-12-12 | 2000-08-22 | Materna; Peter A. | Method of reducing the flow of gas needed for a chamber with controlled temperature and controlled composition of gas |
CN1191747C (zh) * | 2001-09-06 | 2005-03-02 | 株式会社理光 | 电子元件组装检查方法 |
FR2853806B1 (fr) * | 2003-04-09 | 2005-05-27 | Procede et installation de brasage de composants electroniques par refusion limitant les phenomenes de basculement (effet manathan) | |
CN1981968B (zh) * | 2005-10-19 | 2011-04-13 | 株式会社田村制作所 | 锡焊装置的气氛形成方法和气氛形成装置 |
DE102009003023A1 (de) * | 2009-05-12 | 2010-11-18 | Robert Bosch Gmbh | Verfahren zum Betreiben eines Durchlauf-Lötofens und Vorrichtung |
BR102012032031A2 (pt) | 2012-12-14 | 2014-09-09 | Air Liquide Brasil Ltda | Equipamento portátil para monitoramento e controle do nível de oxigênio em atmosfera de fornos de refusão |
EP3053691A1 (de) * | 2015-02-04 | 2016-08-10 | Illinois Tool Works Inc. | Reflow Lötofen mit verbessertem Gasreinigungssystem |
WO2023196103A1 (en) * | 2022-04-08 | 2023-10-12 | Kulicke And Soffa Industries, Inc. | Bonding systems, and methods of providing a reducing gas on a bonding system |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4240574A (en) * | 1978-03-13 | 1980-12-23 | Ford Motor Company | Fluxless brazing of aluminum in inert gas |
NL7805800A (nl) * | 1978-05-29 | 1979-12-03 | Philips Nv | Werkwijze en inrichting voor het solderen van onderde- len op een gatloos dikke-film substraat alsmede dikke-film substraat met onderdelen gesoldeerd met de werkwijze. |
US4610391A (en) * | 1984-12-18 | 1986-09-09 | Union Carbide Corporation | Process for wave soldering |
US5071058A (en) * | 1988-09-30 | 1991-12-10 | Union Carbide Industrial Gases Technology Corporation | Process for joining/coating using an atmosphere having a controlled oxidation capability |
CA2011030C (en) * | 1989-03-20 | 1994-10-18 | Nikhiles Bandyopadhyay | Process for reflow soldering |
US5046658A (en) * | 1989-07-27 | 1991-09-10 | At&T Bell Laboratories | Method and apparatus for soldering articles |
US5121875A (en) * | 1991-02-22 | 1992-06-16 | Union Carbide Industrial Gases Technology Corporation | Wave soldering in a protective atmosphere enclosure over a solder pot |
-
1991
- 1991-12-20 JP JP03338422A patent/JP3103410B2/ja not_active Expired - Fee Related
-
1992
- 1992-12-10 US US07/988,565 patent/US5295621A/en not_active Expired - Fee Related
- 1992-12-17 DE DE69202448T patent/DE69202448T2/de not_active Expired - Fee Related
- 1992-12-17 AU AU30232/92A patent/AU3023292A/en not_active Abandoned
- 1992-12-17 EP EP92311524A patent/EP0549262B1/de not_active Expired - Lifetime
- 1992-12-18 CA CA002085820A patent/CA2085820A1/en not_active Abandoned
- 1992-12-18 ZA ZA929880A patent/ZA929880B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP0549262A1 (de) | 1993-06-30 |
US5295621A (en) | 1994-03-22 |
ZA929880B (en) | 1993-12-20 |
CA2085820A1 (en) | 1993-06-21 |
JP3103410B2 (ja) | 2000-10-30 |
EP0549262B1 (de) | 1995-05-10 |
DE69202448T2 (de) | 1995-09-14 |
AU3023292A (en) | 1993-06-24 |
JPH05191033A (ja) | 1993-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |