[go: up one dir, main page]

DE69015164D1 - Stromlose Abscheidung von Nickel auf Oberflächen wie Kupfer oder geschmolzenem Wolfram. - Google Patents

Stromlose Abscheidung von Nickel auf Oberflächen wie Kupfer oder geschmolzenem Wolfram.

Info

Publication number
DE69015164D1
DE69015164D1 DE69015164T DE69015164T DE69015164D1 DE 69015164 D1 DE69015164 D1 DE 69015164D1 DE 69015164 T DE69015164 T DE 69015164T DE 69015164 T DE69015164 T DE 69015164T DE 69015164 D1 DE69015164 D1 DE 69015164D1
Authority
DE
Germany
Prior art keywords
nickel
copper
electroless deposition
molten tungsten
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69015164T
Other languages
English (en)
Other versions
DE69015164T2 (de
Inventor
Jon E Bengston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of DE69015164D1 publication Critical patent/DE69015164D1/de
Application granted granted Critical
Publication of DE69015164T2 publication Critical patent/DE69015164T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Prevention Of Electric Corrosion (AREA)
DE1990615164 1990-05-08 1990-12-24 Stromlose Abscheidung von Nickel auf Oberflächen wie Kupfer oder geschmolzenem Wolfram. Expired - Lifetime DE69015164T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52063590A 1990-05-08 1990-05-08

Publications (2)

Publication Number Publication Date
DE69015164D1 true DE69015164D1 (de) 1995-01-26
DE69015164T2 DE69015164T2 (de) 1995-05-24

Family

ID=24073448

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990615164 Expired - Lifetime DE69015164T2 (de) 1990-05-08 1990-12-24 Stromlose Abscheidung von Nickel auf Oberflächen wie Kupfer oder geschmolzenem Wolfram.

Country Status (5)

Country Link
EP (1) EP0455915B1 (de)
JP (1) JPH0651910B2 (de)
CA (1) CA2031549C (de)
DE (1) DE69015164T2 (de)
ES (1) ES2068351T3 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279407B2 (en) 2004-09-02 2007-10-09 Micron Technology, Inc. Selective nickel plating of aluminum, copper, and tungsten structures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0260516A1 (de) * 1986-09-15 1988-03-23 General Electric Company Verfahren zur photoselektiven Metallisierung
JP5439812B2 (ja) 2008-12-26 2014-03-12 トヨタ自動車株式会社 電解質膜の製造方法

Also Published As

Publication number Publication date
EP0455915B1 (de) 1994-12-14
EP0455915A1 (de) 1991-11-13
JPH04228577A (ja) 1992-08-18
DE69015164T2 (de) 1995-05-24
CA2031549C (en) 1998-04-28
JPH0651910B2 (ja) 1994-07-06
CA2031549A1 (en) 1991-11-09
ES2068351T3 (es) 1995-04-16

Similar Documents

Publication Publication Date Title
DE69005348D1 (de) Oberflächenbeschichteter Werkzeugteil aus Hartmetall auf der Basis von Wolframcarbid.
IT8123952A0 (it) Placcatura di leghe non elettrolitica.
IT8420287A0 (it) Catodi di polisolfuri insolubili di metalli pesanti.
NL188172C (nl) Gesinterd gecementeerd wolfraamcarbide-lichaam.
IT8483392A0 (it) Cesoia per metalli.
DE3880007D1 (de) Superlegierung auf der basis von nickel.
DE69016976D1 (de) Übergangsmetallfreies Schmiermittel.
FI821269A7 (fi) Jalometallin talteenotto.
IT8467576A1 (it) Rivestimento di vetro caldo con metalli o composti metallici, specialmente ossidi.
IT7921366A0 (it) Elettroplaccatura di metalli.
AU572665B2 (en) Phosphino-hydrocarbon-gold, silver or copper complexes
DE3771040D1 (de) Metallischer ueberzug auf einem mineralischen substrat.
DE3678100D1 (de) Stromlose duktile kupferabscheidung.
DE3584601D1 (de) Digitale konferenzschaltung.
DE69015164D1 (de) Stromlose Abscheidung von Nickel auf Oberflächen wie Kupfer oder geschmolzenem Wolfram.
EP0228017A3 (de) Metallnetz
DE69007500D1 (de) Lösung für stromlose Kupferplattierung.
DE3777538D1 (de) Wolfram metallisierung.
JPS55134191A (en) Silver or silver alloy plating bath
DE68902551D1 (de) Stromlose kupferplattierloesung.
NO880392D0 (no) Korrosjonshemmende blanding.
DE69015689D1 (de) Stromloses Plattierverfahren.
DE3580273D1 (de) Beseitigung von niederschlag auf kontaktlinsen.
DE3784754D1 (de) Drahtteil aus zementiertem karbid auf der basis von wolframkarbid.
BR8404612A (pt) Processo de deposicao de cobre metalico

Legal Events

Date Code Title Description
8364 No opposition during term of opposition