DE60332500D1 - Halbleitervorrichtung - Google Patents
HalbleitervorrichtungInfo
- Publication number
- DE60332500D1 DE60332500D1 DE60332500T DE60332500T DE60332500D1 DE 60332500 D1 DE60332500 D1 DE 60332500D1 DE 60332500 T DE60332500 T DE 60332500T DE 60332500 T DE60332500 T DE 60332500T DE 60332500 D1 DE60332500 D1 DE 60332500D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
- H10D12/038—Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
- H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/141—Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
- H10D62/142—Anode regions of thyristors or collector regions of gated bipolar-mode devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/50—Physical imperfections
- H10D62/53—Physical imperfections the imperfections being within the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/000443 WO2004066391A1 (ja) | 2003-01-20 | 2003-01-20 | 半導体装置 |
PCT/JP2003/008869 WO2004066394A1 (ja) | 2003-01-20 | 2003-07-11 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60332500D1 true DE60332500D1 (de) | 2010-06-17 |
Family
ID=32750570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60332500T Expired - Lifetime DE60332500D1 (de) | 2003-01-20 | 2003-07-11 | Halbleitervorrichtung |
Country Status (8)
Country | Link |
---|---|
US (3) | US20050156283A1 (de) |
EP (1) | EP1601020B1 (de) |
JP (1) | JPWO2004066394A1 (de) |
KR (1) | KR100697770B1 (de) |
CN (1) | CN100414713C (de) |
DE (1) | DE60332500D1 (de) |
TW (1) | TWI241634B (de) |
WO (2) | WO2004066391A1 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7026650B2 (en) | 2003-01-15 | 2006-04-11 | Cree, Inc. | Multiple floating guard ring edge termination for silicon carbide devices |
JP4907955B2 (ja) * | 2005-11-10 | 2012-04-04 | パナソニック株式会社 | ショットキーバリアダイオード及びその製造方法 |
JP2008066694A (ja) * | 2006-03-16 | 2008-03-21 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
JP2007288094A (ja) * | 2006-04-20 | 2007-11-01 | Fuji Electric Device Technology Co Ltd | Igbtとそれを駆動するゲート駆動回路 |
JP4945167B2 (ja) * | 2006-05-12 | 2012-06-06 | スタンレー電気株式会社 | 半導体発光素子の製造方法及び該製造方法により製造された半導体発光素子の実装方法 |
JP4412344B2 (ja) * | 2007-04-03 | 2010-02-10 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP2008311301A (ja) * | 2007-06-12 | 2008-12-25 | Sanyo Electric Co Ltd | 絶縁ゲートバイポーラトランジスタ |
JP4600563B2 (ja) * | 2007-10-24 | 2010-12-15 | 株式会社デンソー | 半導体装置及びその製造方法 |
US8710568B2 (en) * | 2007-10-24 | 2014-04-29 | Denso Corporation | Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same |
EP2086012A1 (de) * | 2007-12-19 | 2009-08-05 | ABB Technology AG | Rückwärtsleitender, bipolarer Transistor mit isoliertem Gate und Herstellungsverfahren dafür |
EP2073271A1 (de) * | 2007-12-19 | 2009-06-24 | ABB Technology AG | Rückwärtsleitender, bipolarer Transistor mit isoliertem Gate und Herstellungsverfahren dafür |
US8779462B2 (en) * | 2008-05-19 | 2014-07-15 | Infineon Technologies Ag | High-ohmic semiconductor substrate and a method of manufacturing the same |
TW201015718A (en) * | 2008-10-03 | 2010-04-16 | Sanyo Electric Co | Semiconductor device and method for manufacturing the same |
JP2010098189A (ja) * | 2008-10-17 | 2010-04-30 | Toshiba Corp | 半導体装置 |
JP5366521B2 (ja) * | 2008-12-05 | 2013-12-11 | 三菱電機株式会社 | 炭化珪素半導体装置及びその製造方法 |
US8507352B2 (en) * | 2008-12-10 | 2013-08-13 | Denso Corporation | Method of manufacturing semiconductor device including insulated gate bipolar transistor and diode |
JP4947111B2 (ja) * | 2008-12-10 | 2012-06-06 | 株式会社デンソー | 半導体装置の製造方法 |
TWI473270B (zh) * | 2009-05-15 | 2015-02-11 | 尼克森微電子股份有限公司 | 半導體元件及其製造方法 |
JP2011023527A (ja) * | 2009-07-15 | 2011-02-03 | Toshiba Corp | 半導体装置 |
JP2011049393A (ja) * | 2009-08-27 | 2011-03-10 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
KR101058593B1 (ko) * | 2009-09-08 | 2011-08-22 | 삼성전기주식회사 | 반도체 소자 및 그 제조 방법 |
JP5526811B2 (ja) * | 2010-01-29 | 2014-06-18 | 富士電機株式会社 | 逆導通形絶縁ゲート型バイポーラトランジスタ |
JP5721339B2 (ja) * | 2010-04-01 | 2015-05-20 | 三菱電機株式会社 | 半導体装置 |
GB2479372B (en) * | 2010-04-07 | 2013-07-24 | Ge Aviat Systems Ltd | Power switches for aircraft |
WO2011129443A1 (ja) * | 2010-04-15 | 2011-10-20 | 富士電機株式会社 | 半導体装置 |
CN102064199A (zh) * | 2010-11-23 | 2011-05-18 | 哈尔滨工程大学 | 自对准内嵌肖特基结的功率半导体场效应晶体管 |
JP2013074181A (ja) * | 2011-09-28 | 2013-04-22 | Toyota Motor Corp | 半導体装置とその製造方法 |
WO2013073623A1 (ja) * | 2011-11-15 | 2013-05-23 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
CN104380470B (zh) * | 2012-05-18 | 2018-01-02 | 富士电机株式会社 | 半导体装置 |
US9281359B2 (en) | 2012-08-20 | 2016-03-08 | Infineon Technologies Ag | Semiconductor device comprising contact trenches |
WO2014041652A1 (ja) * | 2012-09-13 | 2014-03-20 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2015041638A (ja) * | 2013-08-20 | 2015-03-02 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
CN104576716B (zh) * | 2013-10-24 | 2017-12-05 | 上海华虹宏力半导体制造有限公司 | 集成超势垒整流器的igbt器件及制造方法 |
US9818837B2 (en) * | 2014-12-10 | 2017-11-14 | Semiconductor Components Industries, Llc | Process of forming an electronic device having an electronic component |
US20160211258A1 (en) * | 2015-01-05 | 2016-07-21 | Maxpower Semiconductor Inc. | Reverse-Conducting Gated-Base Bipolar-Conduction Devices and Methods with Reduced Risk of Warping |
US9780206B2 (en) * | 2015-02-27 | 2017-10-03 | Purdue Research Foundation | Methods of reducing the electrical and thermal resistance of SiC substrates and devices made thereby |
CN107635453B (zh) * | 2015-06-22 | 2019-07-26 | 奥林巴斯株式会社 | 内窥镜用摄像装置 |
CN105161530B (zh) * | 2015-08-21 | 2018-05-18 | 中国东方电气集团有限公司 | 具有自适应性的场截止电流控制型功率器件 |
JP2019016738A (ja) * | 2017-07-10 | 2019-01-31 | トヨタ自動車株式会社 | 半導体装置 |
CN110419111B (zh) | 2018-01-16 | 2023-08-15 | 艾鲍尔半导体 | 自对准且稳健的绝缘栅双极晶体管器件 |
CN111602250B (zh) * | 2018-02-07 | 2023-08-11 | 艾鲍尔半导体 | 具有用于场截止和反向传导的三维背侧结构的igbt器件 |
US10546948B1 (en) | 2018-09-11 | 2020-01-28 | Semiconductor Components Industries, Llc | Electronic device including an insulated gate bipolar transistor having a field-stop region and a process of forming the same |
US11764209B2 (en) * | 2020-10-19 | 2023-09-19 | MW RF Semiconductors, LLC | Power semiconductor device with forced carrier extraction and method of manufacture |
CN112951905B (zh) * | 2021-01-25 | 2024-03-29 | 南瑞联研半导体有限责任公司 | 一种SiC逆导型绝缘栅双极型晶体管器件及其制造方法 |
Family Cites Families (23)
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US3370209A (en) * | 1964-08-31 | 1968-02-20 | Gen Electric | Power bulk breakdown semiconductor devices |
JPH0828506B2 (ja) * | 1988-11-07 | 1996-03-21 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JPH04192474A (ja) | 1990-11-26 | 1992-07-10 | Sharp Corp | 太陽電池の製造方法 |
JP2689047B2 (ja) * | 1991-07-24 | 1997-12-10 | 三菱電機株式会社 | 絶縁ゲート型バイポーラトランジスタとその製造方法 |
JP3124611B2 (ja) * | 1992-01-16 | 2001-01-15 | 日本碍子株式会社 | Mosアノードショート補助ゲート構造を有する半導体素子 |
JPH05190831A (ja) * | 1992-01-16 | 1993-07-30 | Nissan Motor Co Ltd | ガードリング |
JP2950025B2 (ja) * | 1992-07-02 | 1999-09-20 | 株式会社デンソー | 絶縁ゲート型バイポーラトランジスタ |
JPH06350109A (ja) * | 1993-06-10 | 1994-12-22 | Nec Corp | Pin構造半導体装置 |
JPH08213292A (ja) | 1995-02-02 | 1996-08-20 | Hitachi Ltd | 半導体基板及びその製造方法 |
JP2989113B2 (ja) * | 1995-02-20 | 1999-12-13 | ローム株式会社 | 半導体装置およびその製法 |
JP3413021B2 (ja) * | 1996-07-30 | 2003-06-03 | 株式会社東芝 | 半導体装置 |
JP4167313B2 (ja) * | 1997-03-18 | 2008-10-15 | 株式会社東芝 | 高耐圧電力用半導体装置 |
JPH1131208A (ja) | 1997-05-15 | 1999-02-02 | Nippon Telegr & Teleph Corp <Ntt> | 半導体チップおよびその製造方法 |
US6104062A (en) * | 1998-06-30 | 2000-08-15 | Intersil Corporation | Semiconductor device having reduced effective substrate resistivity and associated methods |
JP2000040833A (ja) * | 1998-07-23 | 2000-02-08 | Mitsubishi Materials Corp | 半導体装置の製造方法 |
JP2000260670A (ja) | 1999-03-05 | 2000-09-22 | Mitsubishi Materials Corp | シリコンウェーハ及びその製造方法 |
US6162702A (en) | 1999-06-17 | 2000-12-19 | Intersil Corporation | Self-supported ultra thin silicon wafer process |
JP3860705B2 (ja) * | 2000-03-31 | 2006-12-20 | 新電元工業株式会社 | 半導体装置 |
JP2002016266A (ja) * | 2000-06-28 | 2002-01-18 | Sankosha Corp | 半導体素子とその製造方法 |
JP2002076326A (ja) * | 2000-09-04 | 2002-03-15 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
CA2423028A1 (en) * | 2000-09-21 | 2002-03-28 | Cambridge Semiconductor Limited | Semiconductor device and method of forming a semiconductor device |
JP2002170963A (ja) * | 2000-12-01 | 2002-06-14 | Sanken Electric Co Ltd | 半導体素子、半導体装置、及び半導体素子の製造方法 |
JP4292964B2 (ja) * | 2003-08-08 | 2009-07-08 | 三菱電機株式会社 | 縦型半導体装置 |
-
2003
- 2003-01-20 WO PCT/JP2003/000443 patent/WO2004066391A1/ja not_active Application Discontinuation
- 2003-07-11 CN CNB038064294A patent/CN100414713C/zh not_active Expired - Fee Related
- 2003-07-11 US US10/505,179 patent/US20050156283A1/en not_active Abandoned
- 2003-07-11 DE DE60332500T patent/DE60332500D1/de not_active Expired - Lifetime
- 2003-07-11 WO PCT/JP2003/008869 patent/WO2004066394A1/ja active Application Filing
- 2003-07-11 JP JP2004544176A patent/JPWO2004066394A1/ja active Pending
- 2003-07-11 EP EP03741371A patent/EP1601020B1/de not_active Expired - Lifetime
- 2003-07-11 KR KR1020047014332A patent/KR100697770B1/ko not_active Expired - Fee Related
- 2003-09-05 TW TW092124557A patent/TWI241634B/zh active
-
2006
- 2006-11-20 US US11/561,823 patent/US7635892B2/en not_active Expired - Fee Related
-
2009
- 2009-10-16 US US12/580,303 patent/US20100038707A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2004066394A1 (ja) | 2004-08-05 |
EP1601020A1 (de) | 2005-11-30 |
US20050156283A1 (en) | 2005-07-21 |
US7635892B2 (en) | 2009-12-22 |
US20070075332A1 (en) | 2007-04-05 |
KR100697770B1 (ko) | 2007-03-20 |
CN100414713C (zh) | 2008-08-27 |
US20100038707A1 (en) | 2010-02-18 |
KR20040095284A (ko) | 2004-11-12 |
TW200425275A (en) | 2004-11-16 |
JPWO2004066394A1 (ja) | 2006-05-18 |
TWI241634B (en) | 2005-10-11 |
EP1601020B1 (de) | 2010-05-05 |
EP1601020A4 (de) | 2008-01-02 |
WO2004066391A1 (ja) | 2004-08-05 |
CN1643698A (zh) | 2005-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |