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DE60332500D1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE60332500D1
DE60332500D1 DE60332500T DE60332500T DE60332500D1 DE 60332500 D1 DE60332500 D1 DE 60332500D1 DE 60332500 T DE60332500 T DE 60332500T DE 60332500 T DE60332500 T DE 60332500T DE 60332500 D1 DE60332500 D1 DE 60332500D1
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60332500T
Other languages
English (en)
Inventor
Norifumi Tokuda
Shigeru Kusunoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE60332500D1 publication Critical patent/DE60332500D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • H10D12/032Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/038Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/64Electrodes comprising a Schottky barrier to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/60Schottky-barrier diodes 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10158Shape being other than a cuboid at the passive surface
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/141Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
    • H10D62/142Anode regions of thyristors or collector regions of gated bipolar-mode devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50Physical imperfections
    • H10D62/53Physical imperfections the imperfections being within the semiconductor body 

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
DE60332500T 2003-01-20 2003-07-11 Halbleitervorrichtung Expired - Lifetime DE60332500D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2003/000443 WO2004066391A1 (ja) 2003-01-20 2003-01-20 半導体装置
PCT/JP2003/008869 WO2004066394A1 (ja) 2003-01-20 2003-07-11 半導体装置

Publications (1)

Publication Number Publication Date
DE60332500D1 true DE60332500D1 (de) 2010-06-17

Family

ID=32750570

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60332500T Expired - Lifetime DE60332500D1 (de) 2003-01-20 2003-07-11 Halbleitervorrichtung

Country Status (8)

Country Link
US (3) US20050156283A1 (de)
EP (1) EP1601020B1 (de)
JP (1) JPWO2004066394A1 (de)
KR (1) KR100697770B1 (de)
CN (1) CN100414713C (de)
DE (1) DE60332500D1 (de)
TW (1) TWI241634B (de)
WO (2) WO2004066391A1 (de)

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JP2008066694A (ja) * 2006-03-16 2008-03-21 Sanyo Electric Co Ltd 半導体装置及びその製造方法
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JP4412344B2 (ja) * 2007-04-03 2010-02-10 株式会社デンソー 半導体装置およびその製造方法
JP2008311301A (ja) * 2007-06-12 2008-12-25 Sanyo Electric Co Ltd 絶縁ゲートバイポーラトランジスタ
JP4600563B2 (ja) * 2007-10-24 2010-12-15 株式会社デンソー 半導体装置及びその製造方法
US8710568B2 (en) * 2007-10-24 2014-04-29 Denso Corporation Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same
EP2086012A1 (de) * 2007-12-19 2009-08-05 ABB Technology AG Rückwärtsleitender, bipolarer Transistor mit isoliertem Gate und Herstellungsverfahren dafür
EP2073271A1 (de) * 2007-12-19 2009-06-24 ABB Technology AG Rückwärtsleitender, bipolarer Transistor mit isoliertem Gate und Herstellungsverfahren dafür
US8779462B2 (en) * 2008-05-19 2014-07-15 Infineon Technologies Ag High-ohmic semiconductor substrate and a method of manufacturing the same
TW201015718A (en) * 2008-10-03 2010-04-16 Sanyo Electric Co Semiconductor device and method for manufacturing the same
JP2010098189A (ja) * 2008-10-17 2010-04-30 Toshiba Corp 半導体装置
JP5366521B2 (ja) * 2008-12-05 2013-12-11 三菱電機株式会社 炭化珪素半導体装置及びその製造方法
US8507352B2 (en) * 2008-12-10 2013-08-13 Denso Corporation Method of manufacturing semiconductor device including insulated gate bipolar transistor and diode
JP4947111B2 (ja) * 2008-12-10 2012-06-06 株式会社デンソー 半導体装置の製造方法
TWI473270B (zh) * 2009-05-15 2015-02-11 尼克森微電子股份有限公司 半導體元件及其製造方法
JP2011023527A (ja) * 2009-07-15 2011-02-03 Toshiba Corp 半導体装置
JP2011049393A (ja) * 2009-08-27 2011-03-10 Mitsubishi Electric Corp 半導体装置及びその製造方法
KR101058593B1 (ko) * 2009-09-08 2011-08-22 삼성전기주식회사 반도체 소자 및 그 제조 방법
JP5526811B2 (ja) * 2010-01-29 2014-06-18 富士電機株式会社 逆導通形絶縁ゲート型バイポーラトランジスタ
JP5721339B2 (ja) * 2010-04-01 2015-05-20 三菱電機株式会社 半導体装置
GB2479372B (en) * 2010-04-07 2013-07-24 Ge Aviat Systems Ltd Power switches for aircraft
WO2011129443A1 (ja) * 2010-04-15 2011-10-20 富士電機株式会社 半導体装置
CN102064199A (zh) * 2010-11-23 2011-05-18 哈尔滨工程大学 自对准内嵌肖特基结的功率半导体场效应晶体管
JP2013074181A (ja) * 2011-09-28 2013-04-22 Toyota Motor Corp 半導体装置とその製造方法
WO2013073623A1 (ja) * 2011-11-15 2013-05-23 富士電機株式会社 半導体装置および半導体装置の製造方法
CN104380470B (zh) * 2012-05-18 2018-01-02 富士电机株式会社 半导体装置
US9281359B2 (en) 2012-08-20 2016-03-08 Infineon Technologies Ag Semiconductor device comprising contact trenches
WO2014041652A1 (ja) * 2012-09-13 2014-03-20 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2015041638A (ja) * 2013-08-20 2015-03-02 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
CN104576716B (zh) * 2013-10-24 2017-12-05 上海华虹宏力半导体制造有限公司 集成超势垒整流器的igbt器件及制造方法
US9818837B2 (en) * 2014-12-10 2017-11-14 Semiconductor Components Industries, Llc Process of forming an electronic device having an electronic component
US20160211258A1 (en) * 2015-01-05 2016-07-21 Maxpower Semiconductor Inc. Reverse-Conducting Gated-Base Bipolar-Conduction Devices and Methods with Reduced Risk of Warping
US9780206B2 (en) * 2015-02-27 2017-10-03 Purdue Research Foundation Methods of reducing the electrical and thermal resistance of SiC substrates and devices made thereby
CN107635453B (zh) * 2015-06-22 2019-07-26 奥林巴斯株式会社 内窥镜用摄像装置
CN105161530B (zh) * 2015-08-21 2018-05-18 中国东方电气集团有限公司 具有自适应性的场截止电流控制型功率器件
JP2019016738A (ja) * 2017-07-10 2019-01-31 トヨタ自動車株式会社 半導体装置
CN110419111B (zh) 2018-01-16 2023-08-15 艾鲍尔半导体 自对准且稳健的绝缘栅双极晶体管器件
CN111602250B (zh) * 2018-02-07 2023-08-11 艾鲍尔半导体 具有用于场截止和反向传导的三维背侧结构的igbt器件
US10546948B1 (en) 2018-09-11 2020-01-28 Semiconductor Components Industries, Llc Electronic device including an insulated gate bipolar transistor having a field-stop region and a process of forming the same
US11764209B2 (en) * 2020-10-19 2023-09-19 MW RF Semiconductors, LLC Power semiconductor device with forced carrier extraction and method of manufacture
CN112951905B (zh) * 2021-01-25 2024-03-29 南瑞联研半导体有限责任公司 一种SiC逆导型绝缘栅双极型晶体管器件及其制造方法

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Also Published As

Publication number Publication date
WO2004066394A1 (ja) 2004-08-05
EP1601020A1 (de) 2005-11-30
US20050156283A1 (en) 2005-07-21
US7635892B2 (en) 2009-12-22
US20070075332A1 (en) 2007-04-05
KR100697770B1 (ko) 2007-03-20
CN100414713C (zh) 2008-08-27
US20100038707A1 (en) 2010-02-18
KR20040095284A (ko) 2004-11-12
TW200425275A (en) 2004-11-16
JPWO2004066394A1 (ja) 2006-05-18
TWI241634B (en) 2005-10-11
EP1601020B1 (de) 2010-05-05
EP1601020A4 (de) 2008-01-02
WO2004066391A1 (ja) 2004-08-05
CN1643698A (zh) 2005-07-20

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Legal Events

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