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DE60320488D1 - Halbleitervorrichtung mit eingebautem Kontaktsensor - Google Patents

Halbleitervorrichtung mit eingebautem Kontaktsensor

Info

Publication number
DE60320488D1
DE60320488D1 DE60320488T DE60320488T DE60320488D1 DE 60320488 D1 DE60320488 D1 DE 60320488D1 DE 60320488 T DE60320488 T DE 60320488T DE 60320488 T DE60320488 T DE 60320488T DE 60320488 D1 DE60320488 D1 DE 60320488D1
Authority
DE
Germany
Prior art keywords
built
semiconductor device
contact sensor
sensor
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320488T
Other languages
English (en)
Other versions
DE60320488T2 (de
Inventor
Toshiyuki Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Semiconductor Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE60320488D1 publication Critical patent/DE60320488D1/de
Application granted granted Critical
Publication of DE60320488T2 publication Critical patent/DE60320488T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Wire Bonding (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
DE60320488T 2002-07-10 2003-06-19 Halbleitervorrichtung mit eingebautem Sensor vom Kontakttyp und Herstellungsverfahren solch einer Halbleitervorrichtung Expired - Lifetime DE60320488T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002201384A JP3971674B2 (ja) 2002-07-10 2002-07-10 接触型センサ内蔵半導体装置及びその製造方法
JP2002201384 2002-07-10

Publications (2)

Publication Number Publication Date
DE60320488D1 true DE60320488D1 (de) 2008-06-05
DE60320488T2 DE60320488T2 (de) 2008-09-18

Family

ID=29728463

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320488T Expired - Lifetime DE60320488T2 (de) 2002-07-10 2003-06-19 Halbleitervorrichtung mit eingebautem Sensor vom Kontakttyp und Herstellungsverfahren solch einer Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US6765274B2 (de)
EP (1) EP1380985B1 (de)
JP (1) JP3971674B2 (de)
KR (1) KR100922529B1 (de)
DE (1) DE60320488T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO315017B1 (no) * 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
JP4090329B2 (ja) * 2002-11-13 2008-05-28 タッチパネル・システムズ株式会社 音響波型接触検出装置
JP2004163262A (ja) * 2002-11-13 2004-06-10 Touch Panel Systems Kk 音響波型接触検出装置
JP2005340780A (ja) * 2004-04-27 2005-12-08 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品装着方法
JP5045028B2 (ja) * 2006-08-16 2012-10-10 富士通セミコンダクター株式会社 表面形状センサとその製造方法
US20080049980A1 (en) * 2006-08-28 2008-02-28 Motorola, Inc. Button with integrated biometric sensor
KR100919300B1 (ko) * 2007-04-16 2009-10-01 (주)멜파스 접촉 센서 모듈 및 그 제조 방법
NO20093601A1 (no) 2009-12-29 2011-06-30 Idex Asa Overflatesensor
CN103038782A (zh) 2010-06-18 2013-04-10 奥森泰克公司 包括在感测区域上的包封层的手指传感器和相关方法
NO20131423A1 (no) 2013-02-22 2014-08-25 Idex Asa Integrert fingeravtrykksensor
KR102255740B1 (ko) 2014-02-21 2021-05-26 이덱스 바이오메트릭스 아사 중첩된 그리드 라인을 이용하는 센서 및 그리드 라인으로부터 감지면을 확장하기 위한 전도성 프로브
US9385099B2 (en) * 2014-03-28 2016-07-05 Nxp, B.V. Die interconnect
JP6401066B2 (ja) * 2015-01-27 2018-10-03 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
JP7027108B2 (ja) 2017-10-12 2022-03-01 Ｆｃｎｔ株式会社 電子機器
CN109829419B (zh) * 2019-01-28 2021-08-24 京东方科技集团股份有限公司 指纹识别模组及其驱动方法和制作方法、显示装置
CN111126351B (zh) * 2020-01-21 2024-02-09 北京京东方光电科技有限公司 指纹识别模组
JP7395364B2 (ja) * 2020-01-22 2023-12-11 株式会社ジャパンディスプレイ 指紋読み取り装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE669572C (de) * 1938-12-29 Braeuning & Co G M B H Einfassschiene fuer Laeufer und Teppiche
JP4024335B2 (ja) * 1996-01-26 2007-12-19 ハリス コーポレイション 集積回路のダイを露出させる開口部を有する集積回路装置とその製造方法
UA47538C2 (uk) * 1998-05-19 2002-07-15 Інфінеон Текнолоджіз Аг Сенсорний пристрій для сприймання біометричних ознак, зокрема відбитків пальців
JP2001141411A (ja) * 1999-11-12 2001-05-25 Sony Corp 指紋認識用半導体装置
WO2001048830A1 (en) * 1999-12-24 2001-07-05 Koninklijke Philips Electronics N.V. ELECTRO-OPTICAL DEVICE HAVING AN ITO LAYER, A SiN LAYER AND AN INTERMEDIATE SILICON OXIDE LAYER
JP2001208509A (ja) * 2000-01-24 2001-08-03 Sony Corp 表面形状認識用半導体装置およびその製造方法
JP2003282791A (ja) * 2002-03-20 2003-10-03 Fujitsu Ltd 接触型センサ内蔵半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP1380985B1 (de) 2008-04-23
US6765274B2 (en) 2004-07-20
EP1380985A2 (de) 2004-01-14
JP2004047623A (ja) 2004-02-12
US20040065915A1 (en) 2004-04-08
EP1380985A3 (de) 2004-11-17
JP3971674B2 (ja) 2007-09-05
KR20040014196A (ko) 2004-02-14
KR100922529B1 (ko) 2009-10-21
DE60320488T2 (de) 2008-09-18

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU MICROELECTRONICS LTD., TOKYO, JP

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU SEMICONDUCTOR LTD., YOKOHAMA, KANAGAWA, JP

8328 Change in the person/name/address of the agent

Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE