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DE60308867D1 - Infrarotsensorbaustein - Google Patents

Infrarotsensorbaustein

Info

Publication number
DE60308867D1
DE60308867D1 DE60308867T DE60308867T DE60308867D1 DE 60308867 D1 DE60308867 D1 DE 60308867D1 DE 60308867 T DE60308867 T DE 60308867T DE 60308867 T DE60308867 T DE 60308867T DE 60308867 D1 DE60308867 D1 DE 60308867D1
Authority
DE
Germany
Prior art keywords
sensor module
infrared sensor
infrared
module
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60308867T
Other languages
English (en)
Other versions
DE60308867T2 (de
Inventor
Ryo Taniguchi
Yuji Takada
Masahiro Kodoh
Masato Shinotani
Hisanobu Tanaka
Atsushi Hironaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002184639A external-priority patent/JP4370757B2/ja
Priority claimed from JP2002281811A external-priority patent/JP4258193B2/ja
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of DE60308867D1 publication Critical patent/DE60308867D1/de
Publication of DE60308867T2 publication Critical patent/DE60308867T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0205Mechanical elements; Supports for optical elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/04Casings
    • G01J5/041Mountings in enclosures or in a particular environment
    • G01J5/045Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
DE60308867T 2002-06-25 2003-06-24 Infrarotsensorbaustein Expired - Lifetime DE60308867T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002184639A JP4370757B2 (ja) 2002-06-25 2002-06-25 赤外線検出器
JP2002184639 2002-06-25
JP2002281811A JP4258193B2 (ja) 2002-09-26 2002-09-26 赤外線検出器
JP2002281811 2002-09-26
PCT/JP2003/007988 WO2004001908A1 (en) 2002-06-25 2003-06-24 Infrared sensor package

Publications (2)

Publication Number Publication Date
DE60308867D1 true DE60308867D1 (de) 2006-11-16
DE60308867T2 DE60308867T2 (de) 2007-09-06

Family

ID=30002275

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60308867T Expired - Lifetime DE60308867T2 (de) 2002-06-25 2003-06-24 Infrarotsensorbaustein

Country Status (8)

Country Link
US (1) US7157709B2 (de)
EP (1) EP1516397B1 (de)
KR (1) KR100586785B1 (de)
CN (1) CN1312809C (de)
AU (1) AU2003243007A1 (de)
DE (1) DE60308867T2 (de)
TW (1) TWI220922B (de)
WO (1) WO2004001908A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7119326B2 (en) * 2004-12-17 2006-10-10 Delphi Technologies, Inc. Method and apparatus for testing an infrared sensor
US20090302859A1 (en) * 2005-11-16 2009-12-10 Microsystems On Silicon (Pty) Ltd. Method for testing a passive infrared sensor
WO2007060861A1 (en) * 2005-11-22 2007-05-31 Matsushita Electric Works, Ltd. Infrared detector and process for fabricating the same
TW200840246A (en) * 2007-03-29 2008-10-01 Unity Opto Technology Co Ltd Infrared receiver manufacturing method and the structure thereof
JP4456628B2 (ja) * 2007-11-22 2010-04-28 パナソニック電工株式会社 熱線センサ付き自動スイッチ
JP5492213B2 (ja) * 2009-08-17 2014-05-14 パナソニック株式会社 赤外線センサ
TWM399313U (en) * 2010-07-30 2011-03-01 Sigurd Microelectronics Corp Proximity sensor package structure
JP5287906B2 (ja) * 2011-03-02 2013-09-11 オムロン株式会社 赤外線温度センサ、電子機器、および赤外線温度センサの製造方法
JP5754626B2 (ja) * 2011-03-30 2015-07-29 三菱マテリアル株式会社 赤外線センサ
KR20130028822A (ko) * 2011-09-09 2013-03-20 (주)아이블포토닉스 단결정 재료를 사용한 초전형 적외선 센서
CN103208536B (zh) * 2012-01-16 2016-12-28 昆山科融电子技术有限公司 用于热释电红外传感器的半导体封装结构件及其制造方法和传感器
WO2013049983A1 (zh) * 2011-10-08 2013-04-11 江苏科融电子技术有限公司 用于热释电红外传感器的半导体封装结构件及其制造方法和传感器
CN103776538A (zh) * 2012-10-18 2014-05-07 友丽系统制造股份有限公司 连板式红外线传感器群组架构及红外线传感器的制造方法
JP2014126495A (ja) * 2012-12-27 2014-07-07 Seiko Epson Corp センサー、電子機器、および移動体
JP6194799B2 (ja) * 2014-01-15 2017-09-13 オムロン株式会社 赤外線センサ
KR101632975B1 (ko) 2015-04-07 2016-06-24 (주)에스팩솔루션 적외선 센서 패키지의 제조방법 및 상기 제조방법에 의한 적외선 센서 패키지
KR101810419B1 (ko) * 2016-04-26 2017-12-19 (주)파트론 온도센서 패키지
JP1624076S (de) * 2018-04-16 2019-02-12
WO2020057123A1 (zh) * 2018-09-17 2020-03-26 日盈汽车电子(上海)有限公司 车载红外温度传感器及其应用
CN109945980A (zh) * 2019-03-28 2019-06-28 东莞传晟光电有限公司 一种邮票孔焊盘表面贴装型热释电传感器
CN110146176A (zh) * 2019-06-21 2019-08-20 中国人民解放军陆军工程大学 一种红外传感器
CN114018411A (zh) * 2021-11-02 2022-02-08 森霸传感科技股份有限公司 一种贴装热释电红外传感器
CN116723688B (zh) * 2023-08-07 2024-03-08 中航星(西安)智能系统有限公司 一种多功能集成电路传感器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
JPS6370550A (ja) * 1986-09-12 1988-03-30 Nec Corp 半導体集積回路装置
JPH0815007A (ja) * 1994-06-29 1996-01-19 Matsushita Electric Ind Co Ltd 赤外線センサおよびその製造方法
TW346688B (en) * 1996-04-15 1998-12-01 Matsushita Electric Works Ltd Pyroelectric-type IR receiving element and IR sensor using the same
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
DE19723615A1 (de) * 1997-06-05 1998-12-10 Trw Automotive Electron & Comp Drucksensoreinheit, insbesondere für die Kraftfahrzeugtechnik
JP3092067B2 (ja) * 1998-05-22 2000-09-25 モレックス インコーポレーテッド 電気コネクタの製造方法
CN2368020Y (zh) * 1998-10-21 2000-03-08 陈朝旺 红外线温度测量装置
SG88807A1 (en) * 1999-12-17 2002-05-21 Matsushita Electric Works Ltd Infrared ray receiving element and infrared ray sensor using the same

Also Published As

Publication number Publication date
EP1516397B1 (de) 2006-10-04
DE60308867T2 (de) 2007-09-06
KR100586785B1 (ko) 2006-06-08
CN1545752A (zh) 2004-11-10
EP1516397A1 (de) 2005-03-23
US20040178344A1 (en) 2004-09-16
WO2004001908A1 (en) 2003-12-31
AU2003243007A1 (en) 2004-01-06
US7157709B2 (en) 2007-01-02
CN1312809C (zh) 2007-04-25
TW200404995A (en) 2004-04-01
TWI220922B (en) 2004-09-11
KR20040035701A (ko) 2004-04-29

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Legal Events

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