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DE60239200D1 - Isoliergraben und verfahren zu dessen herstellung - Google Patents

Isoliergraben und verfahren zu dessen herstellung

Info

Publication number
DE60239200D1
DE60239200D1 DE60239200T DE60239200T DE60239200D1 DE 60239200 D1 DE60239200 D1 DE 60239200D1 DE 60239200 T DE60239200 T DE 60239200T DE 60239200 T DE60239200 T DE 60239200T DE 60239200 D1 DE60239200 D1 DE 60239200D1
Authority
DE
Germany
Prior art keywords
grapes
isolation
production
isolation grapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60239200T
Other languages
English (en)
Inventor
Michel Marty
Arnoud Fortuin
Vincent Arnal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Application granted granted Critical
Publication of DE60239200D1 publication Critical patent/DE60239200D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/31604—Deposition from a gas or vapour
    • H01L21/31608—Deposition of SiO2
    • H01L21/31612—Deposition of SiO2 on a silicon body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76237—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials introducing impurities in trench side or bottom walls, e.g. for forming channel stoppers or alter isolation behavior

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Drying Of Semiconductors (AREA)
DE60239200T 2001-06-14 2002-06-13 Isoliergraben und verfahren zu dessen herstellung Expired - Lifetime DE60239200D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0107774A FR2826179A1 (fr) 2001-06-14 2001-06-14 Tranchee d'isolement profonde et procede de realisation
PCT/FR2002/002029 WO2002103772A2 (fr) 2001-06-14 2002-06-13 Tranchee d'isolement profonde et procede de realisation

Publications (1)

Publication Number Publication Date
DE60239200D1 true DE60239200D1 (de) 2011-03-31

Family

ID=8864293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60239200T Expired - Lifetime DE60239200D1 (de) 2001-06-14 2002-06-13 Isoliergraben und verfahren zu dessen herstellung

Country Status (6)

Country Link
US (1) US7038289B2 (de)
EP (1) EP1396016B1 (de)
JP (1) JP4763234B2 (de)
DE (1) DE60239200D1 (de)
FR (1) FR2826179A1 (de)
WO (1) WO2002103772A2 (de)

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DE102004005804B4 (de) 2004-02-06 2007-04-05 X-Fab Semiconductor Foundries Ag Verfahren zur Verfüllung von Isolationsgräben unter Nutzung von CMOS-Standardprozessen zur Realisierung dielektrisch isolierter Gebiete auf SOI Scheiben
KR100621884B1 (ko) * 2004-02-09 2006-09-14 삼성전자주식회사 보이드를 갖는 트렌치 구조 및 이를 포함하는 인덕터
DE102004022781A1 (de) * 2004-05-08 2005-12-01 X-Fab Semiconductor Foundries Ag SOI-Scheiben mit MEMS-Strukturen und verfüllten Isolationsgräben definierten Querschnitts
US7339253B2 (en) * 2004-08-16 2008-03-04 Taiwan Semiconductor Manufacturing Company Retrograde trench isolation structures
US7396732B2 (en) * 2004-12-17 2008-07-08 Interuniversitair Microelektronica Centrum Vzw (Imec) Formation of deep trench airgaps and related applications
US20060264054A1 (en) * 2005-04-06 2006-11-23 Gutsche Martin U Method for etching a trench in a semiconductor substrate
US20070235783A9 (en) * 2005-07-19 2007-10-11 Micron Technology, Inc. Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions
US7772672B2 (en) 2005-09-01 2010-08-10 Micron Technology, Inc. Semiconductor constructions
JP5026718B2 (ja) * 2006-03-31 2012-09-19 トヨタ自動車株式会社 半導体装置の製造方法
US7799694B2 (en) 2006-04-11 2010-09-21 Micron Technology, Inc. Methods of forming semiconductor constructions
KR100761466B1 (ko) * 2006-06-12 2007-09-27 삼성전자주식회사 반도체장치의 소자분리구조 형성방법
US7709320B2 (en) * 2006-06-28 2010-05-04 International Business Machines Corporation Method of fabricating trench capacitors and memory cells using trench capacitors
US7560344B2 (en) * 2006-11-15 2009-07-14 Samsung Electronics Co., Ltd. Semiconductor device having a pair of fins and method of manufacturing the same
DE102007001523A1 (de) * 2007-01-10 2008-07-17 Infineon Technologies Ag Halbleiterschaltungsanordnung und Verfahren zu deren Herstellung
US8120094B2 (en) 2007-08-14 2012-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Shallow trench isolation with improved structure and method of forming
KR20090068539A (ko) * 2007-12-24 2009-06-29 주식회사 동부하이텍 반도체 소자 및 그 제조방법
JP2010003983A (ja) * 2008-06-23 2010-01-07 Az Electronic Materials Kk シャロー・トレンチ・アイソレーション構造とその形成方法
JP5679626B2 (ja) * 2008-07-07 2015-03-04 セイコーインスツル株式会社 半導体装置
US7985654B2 (en) * 2009-09-14 2011-07-26 International Business Machines Corporation Planarization stop layer in phase change memory integration
KR20130025204A (ko) 2011-09-01 2013-03-11 삼성전자주식회사 반도체 장치 및 이의 제조 방법
US8395217B1 (en) * 2011-10-27 2013-03-12 International Business Machines Corporation Isolation in CMOSFET devices utilizing buried air bags
CN103247517B (zh) * 2012-02-08 2016-06-01 郭磊 一种半导体结构及其形成方法
US9269609B2 (en) * 2012-06-01 2016-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor isolation structure with air gaps in deep trenches
US9142400B1 (en) 2012-07-17 2015-09-22 Stc.Unm Method of making a heteroepitaxial layer on a seed area
US8772126B2 (en) * 2012-08-10 2014-07-08 Infineon Technologies Ag Method of manufacturing a semiconductor device including grinding from a back surface and semiconductor device
US20140159132A1 (en) * 2012-12-06 2014-06-12 Micron Technology, Inc. Memory arrays with air gaps between conductors and the formation thereof
US9245797B2 (en) 2013-08-19 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Opening fill process and structure formed thereby
US9559134B2 (en) * 2014-12-09 2017-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. Deep trench spacing isolation for complementary metal-oxide-semiconductor (CMOS) image sensors
KR102426666B1 (ko) * 2015-03-25 2022-07-28 삼성전자주식회사 집적회로 장치 및 이의 제조 방법
US9984918B2 (en) * 2015-12-31 2018-05-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and manufacturing method thereof
JP6523997B2 (ja) * 2016-03-14 2019-06-05 株式会社東芝 半導体装置の製造方法
US9812446B2 (en) 2016-03-30 2017-11-07 Toyota Motor Engineering & Manufacturing North America, Inc. Electronic apparatus with pocket of low permittivity material to reduce electromagnetic interference
US10847596B2 (en) * 2017-11-10 2020-11-24 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Bendable display panel and fabricating method thereof
US10224396B1 (en) * 2017-11-20 2019-03-05 Globalfoundries Inc. Deep trench isolation structures
US10546937B2 (en) * 2017-11-21 2020-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Structures and methods for noise isolation in semiconductor devices
US11226506B2 (en) * 2020-03-17 2022-01-18 Taiwan Semiconductor Manufacturing Company, Ltd. Heater structure with a gas-filled isolation structure to improve thermal efficiency in a modulator device
DE102020205170A1 (de) 2020-04-23 2021-10-28 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur
CN113644048B (zh) * 2020-04-27 2023-12-22 联华电子股份有限公司 半导体元件及其制造方法
US12112981B2 (en) * 2020-04-27 2024-10-08 United Microelectronics Corp. Semiconductor device and method for fabricating semiconductor device
FR3112894B1 (fr) * 2020-07-27 2023-04-21 St Microelectronics Crolles 2 Sas Procédé de formation d’une tranchée capacitive d’isolation et substrat comprenant une telle tranchée
US11488980B2 (en) 2020-08-26 2022-11-01 Globalfoundries U.S. Inc. Wafer with localized semiconductor on insulator regions with cavity structures
US12027580B2 (en) 2020-09-22 2024-07-02 Globalfoundries U.S. Inc. Semiconductor on insulator wafer with cavity structures
DE102021200073A1 (de) 2021-01-07 2022-07-07 Robert Bosch Gesellschaft mit beschränkter Haftung Herstellungsverfahren für ein mikromechanisches Bauelement und entsprechendes mikromechanisches Bauelement
US11948832B2 (en) * 2021-09-21 2024-04-02 Applied Materials, Inc. Bottom implant and airgap isolation for nanosheet semiconductor devices
US12136649B2 (en) 2022-04-19 2024-11-05 Globalfoundries Singapore Pte. Ltd. Deep trench isolation structures with a substrate connection

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JPS59172246A (ja) * 1983-03-18 1984-09-28 Seiko Instr & Electronics Ltd 凹部分離半導体装置とその製造方法
US4533430A (en) * 1984-01-04 1985-08-06 Advanced Micro Devices, Inc. Process for forming slots having near vertical sidewalls at their upper extremities
JPH0779133B2 (ja) * 1986-06-12 1995-08-23 松下電器産業株式会社 半導体装置の製造方法
JPH01315161A (ja) * 1988-06-15 1989-12-20 Fujitsu Ltd 半導体装置の製造方法
JP3602313B2 (ja) * 1997-06-30 2004-12-15 富士通株式会社 半導体装置の製造方法
US5891807A (en) * 1997-09-25 1999-04-06 Siemens Aktiengesellschaft Formation of a bottle shaped trench
US5943581A (en) * 1997-11-05 1999-08-24 Vanguard International Semiconductor Corporation Method of fabricating a buried reservoir capacitor structure for high-density dynamic random access memory (DRAM) circuits
JPH11195702A (ja) * 1997-12-29 1999-07-21 Toshiba Corp 半導体装置及びその製造方法
JPH11284146A (ja) * 1998-03-30 1999-10-15 Nippon Steel Corp 半導体記憶装置及びその製造方法
JP3171166B2 (ja) * 1998-05-27 2001-05-28 日本電気株式会社 半導体装置の製造方法
JP2000183149A (ja) * 1998-12-10 2000-06-30 Sanyo Electric Co Ltd 半導体装置
US6307247B1 (en) * 1999-07-12 2001-10-23 Robert Bruce Davies Monolithic low dielectric constant platform for passive components and method
JP4295927B2 (ja) * 2001-04-23 2009-07-15 株式会社東芝 不揮発性半導体記憶装置の製造方法
FR2830984B1 (fr) * 2001-10-17 2005-02-25 St Microelectronics Sa Tranchee d'isolement et procede de realisation

Also Published As

Publication number Publication date
US7038289B2 (en) 2006-05-02
US20040147093A1 (en) 2004-07-29
JP4763234B2 (ja) 2011-08-31
JP2004531070A (ja) 2004-10-07
EP1396016B1 (de) 2011-02-16
FR2826179A1 (fr) 2002-12-20
EP1396016A2 (de) 2004-03-10
WO2002103772A3 (fr) 2003-05-01
WO2002103772A2 (fr) 2002-12-27

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