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DE60200654D1 - Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellung - Google Patents

Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellung

Info

Publication number
DE60200654D1
DE60200654D1 DE60200654T DE60200654T DE60200654D1 DE 60200654 D1 DE60200654 D1 DE 60200654D1 DE 60200654 T DE60200654 T DE 60200654T DE 60200654 T DE60200654 T DE 60200654T DE 60200654 D1 DE60200654 D1 DE 60200654D1
Authority
DE
Germany
Prior art keywords
electromagnetic shielding
production
bead
base station
mobile phone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60200654T
Other languages
English (en)
Other versions
DE60200654T2 (de
Inventor
Magnus Mattsson
Mikael Jacobsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nolato Silikonteknik AB
Original Assignee
Nolato Silikonteknik AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nolato Silikonteknik AB filed Critical Nolato Silikonteknik AB
Application granted granted Critical
Publication of DE60200654D1 publication Critical patent/DE60200654D1/de
Publication of DE60200654T2 publication Critical patent/DE60200654T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B29C70/62—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres the filler being oriented during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49067—Specified diverse magnetic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
DE60200654T 2001-10-26 2002-10-23 Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellung Expired - Lifetime DE60200654T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0103597A SE521689C2 (sv) 2001-10-26 2001-10-26 Element för elektromagnetisk skärmning samt metod för framställning därav
SE0103597 2001-10-26
PCT/SE2002/001926 WO2003037057A1 (en) 2001-10-26 2002-10-23 Element for electromagnetic shielding and method for manufacturing thereof

Publications (2)

Publication Number Publication Date
DE60200654D1 true DE60200654D1 (de) 2004-07-22
DE60200654T2 DE60200654T2 (de) 2004-11-11

Family

ID=20285805

Family Applications (2)

Application Number Title Priority Date Filing Date
DE20280417U Expired - Lifetime DE20280417U1 (de) 2001-10-26 2002-10-23 Element zum elektromagnetischen Abschirmen
DE60200654T Expired - Lifetime DE60200654T2 (de) 2001-10-26 2002-10-23 Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE20280417U Expired - Lifetime DE20280417U1 (de) 2001-10-26 2002-10-23 Element zum elektromagnetischen Abschirmen

Country Status (7)

Country Link
US (1) US7161090B2 (de)
EP (1) EP1360885B1 (de)
CN (1) CN1259802C (de)
AT (1) ATE269632T1 (de)
DE (2) DE20280417U1 (de)
SE (1) SE521689C2 (de)
WO (1) WO2003037057A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10221100C1 (de) * 2002-05-03 2003-06-05 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung
CN1332592C (zh) * 2004-01-09 2007-08-15 佛山市顺德区顺达电脑厂有限公司 抑制电磁干扰以及在电路板上制作扼流器的方法
EP1701605B1 (de) * 2005-03-11 2008-02-27 Schroff GmbH HF-Dichtungsstreifen
DE102006016725B4 (de) * 2006-04-04 2010-07-01 Rcc Polymertechnik Gmbh Verfahren zur Herstellung von Elastomer- oder Duromerteilen mit einer Schicht hoher elektrischer Leitfähigkeit
US7815998B2 (en) * 2007-02-06 2010-10-19 World Properties, Inc. Conductive polymer foams, method of manufacture, and uses thereof
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
US20100240421A1 (en) * 2009-03-17 2010-09-23 Michael Sekora Cellular phone cover/case that blocks radiation from reaching the user through the implementation of faraday cage and/or conductive material properties
GB2491505B (en) * 2009-12-29 2014-03-12 Rogers Corp Conductive polymer foams, method of manufacture, and uses therof
US9545043B1 (en) * 2010-09-28 2017-01-10 Rockwell Collins, Inc. Shielding encapsulation for electrical circuitry
EP2461657A1 (de) 2010-12-02 2012-06-06 Siemens Aktiengesellschaft Elektrische Baugruppe und Verfahren zur Herstellung einer elektrischen Baugruppe
US8270929B1 (en) 2011-09-09 2012-09-18 Contech RF Devices, LLC RF shielding for mobile devices
US8921709B2 (en) 2013-03-15 2014-12-30 Continental Accessory Corp. RF shielding for mobile devices
US9845142B2 (en) * 2014-08-15 2017-12-19 The Boeing Company Conductive thermoplastic ground plane for use in an aircraft
WO2023012664A1 (en) * 2021-08-05 2023-02-09 3M Innovative Properties Company Electrically conductive bonding tape with low passive intermodulation
KR20230132021A (ko) * 2022-03-07 2023-09-15 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
SE546233C2 (en) * 2022-10-18 2024-07-23 Nolato Silikonteknik Ab Method for manufacturing a gasket for electromagnetic shielding
SE546302C2 (en) * 2023-01-13 2024-10-01 Nolato Silikonteknik Ab Multilayer gasket for electromagnetic shielding comprising wave-reflecting and wave-absorbing layers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2849312A (en) 1954-02-01 1958-08-26 Milton J Peterman Method of aligning magnetic particles in a non-magnetic matrix
JPS5826381B2 (ja) 1979-04-28 1983-06-02 信越ポリマ−株式会社 電磁気シ−ルドガスケットおよびその製造方法
US5006397A (en) * 1987-02-06 1991-04-09 Key-Tech, Inc. Printed circuit board
US4770685A (en) * 1987-07-13 1988-09-13 Ford Motor Company Method of manufacturing a formed glass sheet with paint thereon
US4778635A (en) 1987-09-18 1988-10-18 American Telephone And Telegraph Company Method and apparatus for fabricating anisotropically conductive material
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US5882720A (en) * 1996-02-01 1999-03-16 Mpm Corporation Monitoring deposited pads
US6121545A (en) 1997-07-11 2000-09-19 Parker-Hannifin Corporation Low closure force EMI shielding spacer gasket

Also Published As

Publication number Publication date
SE521689C2 (sv) 2003-11-25
US20040026100A1 (en) 2004-02-12
CN1259802C (zh) 2006-06-14
US7161090B2 (en) 2007-01-09
DE20280417U1 (de) 2004-06-09
WO2003037057A1 (en) 2003-05-01
CN1481661A (zh) 2004-03-10
DE60200654T2 (de) 2004-11-11
SE0103597D0 (sv) 2001-10-26
ATE269632T1 (de) 2004-07-15
EP1360885A1 (de) 2003-11-12
SE0103597L (sv) 2003-04-27
EP1360885B1 (de) 2004-06-16

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Legal Events

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