[go: up one dir, main page]

DE60113152D1 - Magazin, komponentenablagenzuführungseinrichtung und komponentenanbringungseinrichtung - Google Patents

Magazin, komponentenablagenzuführungseinrichtung und komponentenanbringungseinrichtung

Info

Publication number
DE60113152D1
DE60113152D1 DE60113152T DE60113152T DE60113152D1 DE 60113152 D1 DE60113152 D1 DE 60113152D1 DE 60113152 T DE60113152 T DE 60113152T DE 60113152 T DE60113152 T DE 60113152T DE 60113152 D1 DE60113152 D1 DE 60113152D1
Authority
DE
Germany
Prior art keywords
component
magazine
filing
feeding device
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60113152T
Other languages
English (en)
Other versions
DE60113152T2 (de
Inventor
Nobuyuki Kakita
Kazunori Kanai
Osamu Okuda
Akira Kabeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60113152D1 publication Critical patent/DE60113152D1/de
Application granted granted Critical
Publication of DE60113152T2 publication Critical patent/DE60113152T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60113152T 2000-12-12 2001-12-11 Magazin, komponentenablagenzuführungseinrichtung und komponentenanbringungseinrichtung Expired - Lifetime DE60113152T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000376980 2000-12-12
JP2000376980 2000-12-12
PCT/JP2001/010825 WO2002049409A1 (en) 2000-12-12 2001-12-11 Magazine, tray component feeding device, and component mounting device

Publications (2)

Publication Number Publication Date
DE60113152D1 true DE60113152D1 (de) 2005-10-06
DE60113152T2 DE60113152T2 (de) 2006-03-09

Family

ID=18845760

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60113152T Expired - Lifetime DE60113152T2 (de) 2000-12-12 2001-12-11 Magazin, komponentenablagenzuführungseinrichtung und komponentenanbringungseinrichtung

Country Status (6)

Country Link
US (1) US7331103B2 (de)
EP (1) EP1344441B1 (de)
KR (1) KR100835042B1 (de)
CN (1) CN1271906C (de)
DE (1) DE60113152T2 (de)
WO (1) WO2002049409A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496631B1 (ko) * 2002-06-25 2005-06-20 미래산업 주식회사 전자부품 공급방법
DE102007007819A1 (de) 2007-02-16 2008-08-21 Siemens Ag Modulare Flächenmagazin-Bereitstellungsvorrichtung für Bestücksysteme
DE102007008755A1 (de) 2007-02-22 2008-08-28 Siemens Ag Vorrichtung und Verfahren zum Bereitstellen von Flächenmagazinen, Bestücksystem
JP4840422B2 (ja) * 2008-09-04 2011-12-21 パナソニック株式会社 電子部品実装用装置及び電子部品実装用装置による作業方法
US20100122456A1 (en) * 2008-11-17 2010-05-20 Chen-Hua Yu Integrated Alignment and Bonding System
US20140069844A1 (en) * 2012-09-07 2014-03-13 Medtronic, Inc. Circuit board magazine having retention bar with a locking mechanism
JP6166903B2 (ja) * 2013-01-11 2017-07-19 ヤマハ発動機株式会社 電子部品実装装置
CN104355072B (zh) * 2014-09-25 2017-07-14 深圳市时代高科技设备股份有限公司 一种电池单元卸载设备
JP6596649B2 (ja) * 2014-11-14 2019-10-30 パナソニックＩｐマネジメント株式会社 トレイフィーダ及び部品実装装置
ES2777530T3 (es) * 2014-12-22 2020-08-05 Essegi Automation Srl Unidad de almacenamiento mejorada
CN104743341A (zh) * 2015-01-20 2015-07-01 京东方科技集团股份有限公司 挡块、基板卡匣组件
WO2018173226A1 (ja) * 2017-03-23 2018-09-27 株式会社Ｆｕｊｉ 実装装置及び実装方法
IT201700041473A1 (it) * 2017-04-13 2018-10-13 I Tronik S R L Dispositivo per lo stoccaggio di bobine di componenti elettronici
WO2018193501A1 (ja) * 2017-04-17 2018-10-25 株式会社Ｆｕｊｉ 部品供給装置およびパレット移動方法
DE102018205926B3 (de) * 2018-04-18 2019-08-29 Asm Assembly Systems Gmbh & Co. Kg Beladevorrichtung, Bestücksystem und Verfahren zum Bestücken von SMT Leiterplatten mit SMT Bauteilen
CN108601320B (zh) * 2018-04-23 2020-07-17 苏州智合源电子科技有限公司 一种fofi缓存散热设备
US20220315334A1 (en) * 2019-09-03 2022-10-06 DWFritz Automation, Inc. Tray exchange and dispositioning systems, methods, and apparatuses
CN114451077B (zh) * 2019-09-30 2023-09-26 株式会社富士 料盘更换装置
KR102282521B1 (ko) * 2019-12-26 2021-07-27 윈텍주식회사 마이크로 칩 멀티 마운터
CN114871156A (zh) * 2022-05-09 2022-08-09 苏州天准科技股份有限公司 一种尾料盒、下料分选设备和分选系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2041726B (en) * 1979-01-08 1983-04-13 Plessey Co Ltd Storage cabinets
JPS6160527A (ja) 1984-08-31 1986-03-28 Hitachi Ltd ロ−ダ・アンロ−ダ装置
JP2804601B2 (ja) * 1989-05-31 1998-09-30 三洋電機株式会社 部品供給装置
JP2540673B2 (ja) 1991-07-10 1996-10-09 株式会社テンリュウテクニックス トレイおよび電子部品の供給装置
JP3096334B2 (ja) * 1991-11-08 2000-10-10 パイオニア株式会社 位置検出装置
JPH08292696A (ja) 1995-04-20 1996-11-05 Ricoh Co Ltd 電子写真画像形成装置におけるトナー回収量検知方法
JP3379413B2 (ja) 1997-12-05 2003-02-24 日本ビクター株式会社 ディスクマガジン
JPH11346093A (ja) 1998-06-02 1999-12-14 Matsushita Electric Ind Co Ltd 部品実装機

Also Published As

Publication number Publication date
WO2002049409A1 (en) 2002-06-20
KR20030059266A (ko) 2003-07-07
EP1344441A1 (de) 2003-09-17
EP1344441B1 (de) 2005-08-31
US7331103B2 (en) 2008-02-19
CN1476742A (zh) 2004-02-18
US20040031768A1 (en) 2004-02-19
KR100835042B1 (ko) 2008-06-03
DE60113152T2 (de) 2006-03-09
CN1271906C (zh) 2006-08-23

Similar Documents

Publication Publication Date Title
DE60113152D1 (de) Magazin, komponentenablagenzuführungseinrichtung und komponentenanbringungseinrichtung
EP1437515A4 (de) Klemmvorrichtung
NO995201D0 (no) Elektronisk innretning, fortrinnsvis en elektronisk bok
EP1523946A4 (de) Clip-operationsgerät
GB2362427B (en) Component attaching device
DE60131175D1 (de) Teilezuführungseinrichtung
HUP0402198A3 (en) Feeding device
MXPA03009590A (es) DISPOSITIVO DE SUJECIoN MAGNETICO.
ZA200105744B (en) Scarft organizing device.
FI20002869L (fi) Elektroninen laite, elektronisen laitteen lisälaite ja tukielin
GB0123131D0 (en) Clamping device
DE50004477D1 (de) Buchklemmvorrichtung
GB0100712D0 (en) An improved support device
IT249548Y1 (it) Dispositivo di serraggio a depressione.
GB0104139D0 (en) Clip device
TW468822U (en) Cooler clip device
TW524429U (en) Sand-proof heat-dissipating device
GB0105685D0 (en) Tray incorperating clamping device
TW524038U (en) The grafting clip feeding device
ZA200101335B (en) Clamp device.
ZA200101524B (en) Clamp device.
ZA200101525B (en) Clamp device.
SE0003374D0 (sv) Utfodringsanordning
ZA200105510B (en) Holder device.
GB9900120D0 (en) Filing device

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)