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DE60107071D1 - Polymerische zusammensetzung für die verpackung von einer halbleitervorrichtung und damit hergestellte verpackung - Google Patents

Polymerische zusammensetzung für die verpackung von einer halbleitervorrichtung und damit hergestellte verpackung

Info

Publication number
DE60107071D1
DE60107071D1 DE60107071T DE60107071T DE60107071D1 DE 60107071 D1 DE60107071 D1 DE 60107071D1 DE 60107071 T DE60107071 T DE 60107071T DE 60107071 T DE60107071 T DE 60107071T DE 60107071 D1 DE60107071 D1 DE 60107071D1
Authority
DE
Germany
Prior art keywords
packaging
semiconductor device
polymeric composition
polymeric
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60107071T
Other languages
English (en)
Other versions
DE60107071T2 (de
Inventor
Roberto Zafarana
Antonino Scandurra
Salvatore Pignataro
Yuichi Tenya
Akira Yoshizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Kyocera Chemical Corp
Original Assignee
STMicroelectronics SRL
Kyocera Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL, Kyocera Chemical Corp filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE60107071D1 publication Critical patent/DE60107071D1/de
Publication of DE60107071T2 publication Critical patent/DE60107071T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE60107071T 2000-04-28 2001-04-30 Polymerische zusammensetzung für die verpackung von einer halbleitervorrichtung und damit hergestellte verpackung Expired - Lifetime DE60107071T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00830320A EP1149864A1 (de) 2000-04-28 2000-04-28 Polymerische Zusammensetzung zur Verpackung einer Halbleiteranordnung und Verpackung damit hergestellt
EP00830320 2000-04-28
PCT/EP2001/004882 WO2001083604A1 (en) 2000-04-28 2001-04-30 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom

Publications (2)

Publication Number Publication Date
DE60107071D1 true DE60107071D1 (de) 2004-12-16
DE60107071T2 DE60107071T2 (de) 2006-02-16

Family

ID=8175308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60107071T Expired - Lifetime DE60107071T2 (de) 2000-04-28 2001-04-30 Polymerische zusammensetzung für die verpackung von einer halbleitervorrichtung und damit hergestellte verpackung

Country Status (6)

Country Link
US (1) US6645643B2 (de)
EP (2) EP1149864A1 (de)
JP (1) JP2003531938A (de)
AU (1) AU6591601A (de)
DE (1) DE60107071T2 (de)
WO (1) WO2001083604A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100479858B1 (ko) * 2001-12-28 2005-03-30 제일모직주식회사 반도체 소자 밀봉용 액상 에폭시 수지 조성물
US8017449B2 (en) * 2003-08-08 2011-09-13 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
KR100629902B1 (ko) * 2006-07-06 2006-09-28 박정호 아스팔트 포장용 에폭시 수지 조성물 및 이를 이용한에폭시 아스팔트 포장 혼합물
WO2010024391A1 (ja) * 2008-09-01 2010-03-04 積水化学工業株式会社 積層体及び積層体の製造方法
CN102341474B (zh) 2009-03-02 2014-09-24 霍尼韦尔国际公司 热界面材料及制造和使用它的方法
KR101362887B1 (ko) * 2011-05-23 2014-02-14 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
TWI602873B (zh) * 2012-06-11 2017-10-21 味之素股份有限公司 Resin composition
EP3426746B1 (de) 2016-03-08 2021-07-14 Honeywell International Inc. Phasenwechselmaterial
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
JP6933300B2 (ja) * 2018-11-01 2021-09-08 住友ベークライト株式会社 パワーデバイス封止用樹脂組成物およびパワーデバイス
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
JP7475794B2 (ja) 2021-05-12 2024-04-30 信越化学工業株式会社 封止用樹脂組成物及び半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
JPS58166747A (ja) * 1982-03-29 1983-10-01 Toshiba Corp 樹脂封止型半導体装置
JPS5981328A (ja) * 1982-10-30 1984-05-11 Nitto Electric Ind Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62209126A (ja) * 1986-03-11 1987-09-14 Toshiba Corp 半導体装置封止用エポキシ樹脂組成物
US4847122A (en) * 1987-05-27 1989-07-11 Palmer International, Inc. Cavitation-resistant polymer and coating
JPH03122114A (ja) * 1989-10-06 1991-05-24 Somar Corp 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物
JPH0778108B2 (ja) * 1990-06-18 1995-08-23 東レ株式会社 半導体封止用エポキシ樹脂組成物
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3714377B2 (ja) * 1997-05-23 2005-11-09 信越化学工業株式会社 難燃性エポキシ樹脂組成物
JP3712045B2 (ja) * 1999-04-26 2005-11-02 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
US20020022679A1 (en) 2002-02-21
DE60107071T2 (de) 2006-02-16
WO2001083604A1 (en) 2001-11-08
EP1149864A1 (de) 2001-10-31
EP1278796A1 (de) 2003-01-29
EP1278796B1 (de) 2004-11-10
JP2003531938A (ja) 2003-10-28
US6645643B2 (en) 2003-11-11
AU6591601A (en) 2001-11-12

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition