[go: up one dir, main page]

DE50010390D1 - Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen - Google Patents

Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Info

Publication number
DE50010390D1
DE50010390D1 DE50010390T DE50010390T DE50010390D1 DE 50010390 D1 DE50010390 D1 DE 50010390D1 DE 50010390 T DE50010390 T DE 50010390T DE 50010390 T DE50010390 T DE 50010390T DE 50010390 D1 DE50010390 D1 DE 50010390D1
Authority
DE
Germany
Prior art keywords
tin layer
producing
copper alloys
hollow components
reduction solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE50010390T
Other languages
English (en)
Inventor
Ulrich Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cunova GmbH
Original Assignee
KM Europa Metal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
Priority to DE50010390T priority Critical patent/DE50010390D1/de
Application granted granted Critical
Publication of DE50010390D1 publication Critical patent/DE50010390D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1803Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837Multistep pretreatment
    • C23C18/1844Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Coating With Molten Metal (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Conductive Materials (AREA)
DE50010390T 2000-01-28 2000-12-30 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen Expired - Fee Related DE50010390D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50010390T DE50010390D1 (de) 2000-01-28 2000-12-30 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10003582A DE10003582A1 (de) 2000-01-28 2000-01-28 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen
DE50010390T DE50010390D1 (de) 2000-01-28 2000-12-30 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Publications (1)

Publication Number Publication Date
DE50010390D1 true DE50010390D1 (de) 2005-06-30

Family

ID=7628943

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10003582A Withdrawn DE10003582A1 (de) 2000-01-28 2000-01-28 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen
DE50010390T Expired - Fee Related DE50010390D1 (de) 2000-01-28 2000-12-30 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10003582A Withdrawn DE10003582A1 (de) 2000-01-28 2000-01-28 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Country Status (9)

Country Link
US (1) US6572754B2 (de)
EP (1) EP1120477B1 (de)
JP (1) JP2001288577A (de)
AT (1) ATE296364T1 (de)
DE (2) DE10003582A1 (de)
DK (1) DK1120477T3 (de)
ES (1) ES2238967T3 (de)
HU (1) HUP0100444A3 (de)
PT (1) PT1120477E (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10213185A1 (de) * 2002-03-23 2003-10-02 Km Europa Metal Ag Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs
US7771542B1 (en) 2006-05-30 2010-08-10 Stone Chemical Company Compositions and methods for removing lead from metal surfaces

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
JPS56112496A (en) * 1980-02-05 1981-09-04 Mitsubishi Electric Corp Plating method
US4751049A (en) * 1985-07-05 1988-06-14 Shannon John K Connector and alloy
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
US5211831A (en) * 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JP3026527B2 (ja) * 1992-07-27 2000-03-27 株式会社ジャパンエナジー 無電解めっきの前処理方法および前処理液
GB9409811D0 (en) * 1994-05-17 1994-07-06 Imi Yorkshire Fittings Improvements in copper alloy water fittings
JP2804722B2 (ja) * 1994-10-26 1998-09-30 株式会社神戸製鋼所 銅又は銅合金管内面への錫めっき方法
DK0842332T3 (da) * 1995-08-03 2001-08-06 Europa Metalli Spa Vandinstallationskomponenter med en lav afgivelse af bly og fremstillet af kobberbaserede legeringer, der indeholder bly, og en fremgangsmåde til at opnå disse
JP3005469B2 (ja) * 1996-06-05 2000-01-31 住友軽金属工業株式会社 内面スズめっき長尺銅管の製造方法
WO1997046732A1 (fr) * 1996-06-05 1997-12-11 Sumitomo Light Metal Industries, Ltd. Procede de fabrication de tuyau de cuivre dont l'interieur est plaque a l'etain
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
US6197210B1 (en) * 1998-08-17 2001-03-06 Gerber Plumbing Fixtures Corp. Process for treating brass components to substantially eliminate leachabale lead

Also Published As

Publication number Publication date
ES2238967T3 (es) 2005-09-16
HU0100444D0 (en) 2001-03-28
EP1120477B1 (de) 2005-05-25
HUP0100444A3 (en) 2003-02-28
HUP0100444A2 (hu) 2001-12-28
JP2001288577A (ja) 2001-10-19
EP1120477A2 (de) 2001-08-01
DK1120477T3 (da) 2005-09-26
ATE296364T1 (de) 2005-06-15
DE10003582A1 (de) 2001-08-02
US20010010834A1 (en) 2001-08-02
US6572754B2 (en) 2003-06-03
EP1120477A3 (de) 2002-06-12
PT1120477E (pt) 2005-08-31

Similar Documents

Publication Publication Date Title
JPH0713304B2 (ja) 銅の表面処理法
JP3292774B2 (ja) プリント配線板用銅箔およびその製造方法
JPH0335394B2 (de)
JP2005336614A (ja) プラスチック表面をめっきするための方法
US5234574A (en) Process for direct zinc electroplating of aluminum strip
JPS61243193A (ja) ステンレス鋼に純金めつきする方法
TW583349B (en) Method for enhancing the solderability of a surface
KR910006008A (ko) 금속화된 폴리이미드 복합체의 제조방법
DE50010390D1 (de) Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen
DE69907477D1 (de) Drahtelektrode zum Funkenerodieren und Verfahren zur Herstellung
ATE304220T1 (de) Verfahren zur herstellung einer t-förmigen elektrode
JP3623621B2 (ja) 銅箔の表面処理方法
EP0536170B1 (de) Gold-elektrolyt-kombination zur stromlosen goldabscheidung
JPS63183178A (ja) プリント回路用銅箔およびその製造方法
JP2002030481A (ja) 銅若しくは銅合金箔及びその製造方法
CN102021578B (zh) 一种浓缩黄金镀层退镀液的生产方法
US4781788A (en) Process for preparing printed circuit boards
JP4191881B2 (ja) 銅酸化物還元用の処理液および処理方法
ATE224966T1 (de) Verfahren und bad zur selektiven bleientfernung von sanitärkomponenten aus kupferlegierungen
JP2007009261A (ja) プリント配線板用銅箔及びその製造方法
JPS63186891A (ja) Ni−Ti系合金の表面処理法
JP3126417B2 (ja) アディティブ法におけるメッキ液の前処理方法
GB1464048A (en) Processes for the manufacture of aluminium articles coated with metals
JPH1030194A (ja) 銅及び銅合金の表面処理剤
JPS61253886A (ja) プリント回路用銅箔

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KME GERMANY AG, 49074 OSNABRUECK, DE

8327 Change in the person/name/address of the patent owner

Owner name: KME GERMANY AG & CO. KG, 49074 OSNABRUECK, DE

8339 Ceased/non-payment of the annual fee