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DE3778939D1 - Waermeleitende anordnung. - Google Patents

Waermeleitende anordnung.

Info

Publication number
DE3778939D1
DE3778939D1 DE8787101348T DE3778939T DE3778939D1 DE 3778939 D1 DE3778939 D1 DE 3778939D1 DE 8787101348 T DE8787101348 T DE 8787101348T DE 3778939 T DE3778939 T DE 3778939T DE 3778939 D1 DE3778939 D1 DE 3778939D1
Authority
DE
Germany
Prior art keywords
heat
conducting arrangement
conducting
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787101348T
Other languages
English (en)
Inventor
Tadakatsu - Tsukuba H Nakajima
Wataru Nakayama
Shigeo Niihari-Ryo Oohashi
Heikichi Kuwabara
Takahiro Daikoku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3778939D1 publication Critical patent/DE3778939D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/907—Porous

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8787101348T 1986-03-20 1987-02-02 Waermeleitende anordnung. Expired - Lifetime DE3778939D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61060558A JP2569003B2 (ja) 1986-03-20 1986-03-20 熱伝導装置

Publications (1)

Publication Number Publication Date
DE3778939D1 true DE3778939D1 (de) 1992-06-17

Family

ID=13145724

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787101348T Expired - Lifetime DE3778939D1 (de) 1986-03-20 1987-02-02 Waermeleitende anordnung.

Country Status (4)

Country Link
US (1) US4823863A (de)
EP (1) EP0237741B1 (de)
JP (1) JP2569003B2 (de)
DE (1) DE3778939D1 (de)

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US4884169A (en) * 1989-01-23 1989-11-28 Technology Enterprises Company Bubble generation in condensation wells for cooling high density integrated circuit chips
US5205353A (en) * 1989-11-30 1993-04-27 Akzo N.V. Heat exchanging member
US5057909A (en) * 1990-01-29 1991-10-15 International Business Machines Corporation Electronic device and heat sink assembly
US5169805A (en) * 1990-01-29 1992-12-08 International Business Machines Corporation Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation
EP0471552B1 (de) * 1990-08-14 1997-07-02 Texas Instruments Incorporated Wärmetransportmodul für Anwendungen ultrahoher Dichte und Silizium auf Siliziumpackungen
EP0510734A1 (de) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Wärmeaustauschkörper, insbesondere zum Kühlen eines Halbleitermodules
DE9102118U1 (de) * 1991-02-22 1992-06-25 Laumen, Michael, 4150 Krefeld Vorrichtung zur Wärmeübertragung im thermoelektrischen Wärmetransportsystem
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
EP0732743A3 (de) * 1995-03-17 1998-05-13 Texas Instruments Incorporated Wärmesenken
US5572404A (en) * 1995-09-21 1996-11-05 Unisys Corporation Heat transfer module incorporating liquid metal squeezed from a compliant body
US5561590A (en) * 1995-09-21 1996-10-01 Unisys Corporation Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring
AT404532B (de) * 1996-02-13 1998-12-28 Electrovac Kühlkörper für elektrische und elektronische bauelemente
US6105659A (en) 1996-09-12 2000-08-22 Jaro Technologies, Inc. Rechargeable thermal battery for latent energy storage and transfer
US5825087A (en) * 1996-12-03 1998-10-20 International Business Machines Corporation Integral mesh flat plate cooling module
US6053241A (en) * 1998-09-17 2000-04-25 Nikon Corporation Cooling method and apparatus for charged particle lenses and deflectors
US7069975B1 (en) 1999-09-16 2006-07-04 Raytheon Company Method and apparatus for cooling with a phase change material and heat pipes
US7575043B2 (en) * 2002-04-29 2009-08-18 Kauppila Richard W Cooling arrangement for conveyors and other applications
WO2004036643A2 (de) * 2002-10-16 2004-04-29 Sew-Eurodrive Gmbh & Co Vorrichtung
US6774482B2 (en) 2002-12-27 2004-08-10 International Business Machines Corporation Chip cooling
US20040251008A1 (en) * 2003-05-30 2004-12-16 O'neill Patrick S. Method for making brazed heat exchanger and apparatus
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
US7264206B2 (en) * 2004-09-30 2007-09-04 The Boeing Company Leading edge flap apparatuses and associated methods
US7394659B2 (en) * 2004-11-19 2008-07-01 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
TWI306651B (en) * 2005-01-13 2009-02-21 Advanced Semiconductor Eng Package structure
US20060185836A1 (en) * 2005-02-24 2006-08-24 Scott Garner Thermally coupled surfaces having controlled minimum clearance
JP4637734B2 (ja) * 2005-11-30 2011-02-23 富士通株式会社 電子装置の冷却装置
JP4623167B2 (ja) * 2008-08-26 2011-02-02 トヨタ自動車株式会社 放熱構造及び車両用インバータ
US8259451B2 (en) 2008-11-25 2012-09-04 Intel Corporation Metal injection molded heat dissipation device
US8953314B1 (en) * 2010-08-09 2015-02-10 Georgia Tech Research Corporation Passive heat sink for dynamic thermal management of hot spots
DE102010062914A1 (de) 2010-12-13 2012-06-14 Robert Bosch Gmbh Halbleiter mit einem Verbindungselement zum Aführen von Wärme und Verfahren
US9279626B2 (en) * 2012-01-23 2016-03-08 Honeywell International Inc. Plate-fin heat exchanger with a porous blocker bar
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
US11060805B2 (en) * 2014-12-12 2021-07-13 Teledyne Scientific & Imaging, Llc Thermal interface material system
JP6497192B2 (ja) * 2015-04-24 2019-04-10 日立化成株式会社 多孔質金属を用いた放熱フィンおよびそれを搭載したヒートシンク、モジュール
US20230418009A1 (en) * 2022-06-26 2023-12-28 International Business Machines Corporation Thermal management of computer hardware modules

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NL295718A (de) * 1962-07-31
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
US4381818A (en) * 1977-12-19 1983-05-03 International Business Machines Corporation Porous film heat transfer
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US4266281A (en) * 1979-04-02 1981-05-05 Allen-Bradley Company Microprogrammed programmable controller
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
JPS6015953A (ja) * 1983-07-06 1985-01-26 Matsushita Electric Ind Co Ltd 半導体装置の冷却方法
FR2570383B1 (fr) * 1984-09-20 1988-03-18 Nec Corp Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module

Also Published As

Publication number Publication date
EP0237741A2 (de) 1987-09-23
JPS62219645A (ja) 1987-09-26
JP2569003B2 (ja) 1997-01-08
EP0237741A3 (en) 1987-12-02
US4823863A (en) 1989-04-25
EP0237741B1 (de) 1992-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee