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DE3688008D1 - Gegossenes produkt mit einer gedruckten schaltungsplatte. - Google Patents

Gegossenes produkt mit einer gedruckten schaltungsplatte.

Info

Publication number
DE3688008D1
DE3688008D1 DE8686108137T DE3688008T DE3688008D1 DE 3688008 D1 DE3688008 D1 DE 3688008D1 DE 8686108137 T DE8686108137 T DE 8686108137T DE 3688008 T DE3688008 T DE 3688008T DE 3688008 D1 DE3688008 D1 DE 3688008D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
molded product
molded
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686108137T
Other languages
English (en)
Other versions
DE3688008T2 (de
Inventor
Masahiko Maeda
Kenzi Showa Denko Sha Fuzitani
Yoshihiro Moteki
Kazuya Nagata
Yasutoki Saito
Taketsugu Otani
Yuichi Sakon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12916885A external-priority patent/JPS61288483A/ja
Priority claimed from JP60149193A external-priority patent/JPS6211289A/ja
Priority claimed from JP1213386A external-priority patent/JPS62171184A/ja
Priority claimed from JP2026786A external-priority patent/JPS62178333A/ja
Priority claimed from JP2408986A external-priority patent/JPS62183592A/ja
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of DE3688008D1 publication Critical patent/DE3688008D1/de
Application granted granted Critical
Publication of DE3688008T2 publication Critical patent/DE3688008T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1327Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
DE19863688008 1985-06-15 1986-06-13 Gegossenes Produkt mit einer gedruckten Schaltungsplatte. Expired - Fee Related DE3688008T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP12916885A JPS61288483A (ja) 1985-06-15 1985-06-15 プリント基板を有する成形物
JP60149193A JPS6211289A (ja) 1985-07-09 1985-07-09 プリント基板
JP1213386A JPS62171184A (ja) 1986-01-24 1986-01-24 プリント基板を有する成形物
JP2026786A JPS62178333A (ja) 1986-02-03 1986-02-03 プリント基板
JP2408986A JPS62183592A (ja) 1986-02-07 1986-02-07 フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
DE3688008D1 true DE3688008D1 (de) 1993-04-22
DE3688008T2 DE3688008T2 (de) 1993-10-14

Family

ID=27519366

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19863688008 Expired - Fee Related DE3688008T2 (de) 1985-06-15 1986-06-13 Gegossenes Produkt mit einer gedruckten Schaltungsplatte.
DE1986108137 Pending DE206179T1 (de) 1985-06-15 1986-06-13 Gegossenes produkt mit einer gedruckten schaltungsplatte.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1986108137 Pending DE206179T1 (de) 1985-06-15 1986-06-13 Gegossenes produkt mit einer gedruckten schaltungsplatte.

Country Status (2)

Country Link
EP (1) EP0206179B1 (de)
DE (2) DE3688008T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US4924590A (en) * 1988-01-08 1990-05-15 Siemens Aktiengesellschaft Method for making metal core printed circuit board
DE19631520C2 (de) 1996-08-03 2001-10-18 Kavernen Bau Und Betr S Gmbh Verfahren und Anlage zur soltechnischen Gewinnung von Evaporiten und Aufbereitung von Salzlösungen
US9247649B2 (en) 2013-05-06 2016-01-26 Globalfoundries Inc. Printed circuit boards fabricated using congruent molds
CN106535465B (zh) * 2016-11-15 2021-11-26 智恩电子(大亚湾)有限公司 一种抗冲击的印制线路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3233693C2 (de) * 1982-09-10 1995-01-05 American National Can Co Orientierte Verbundfolie und deren Verwendung
JPS60113665U (ja) * 1984-01-05 1985-08-01 昭和電工株式会社 混成集積回路用基板
JPS6181448A (ja) * 1984-09-06 1986-04-25 Kuraray Co Ltd 耐衝撃性を有する樹脂組成物

Also Published As

Publication number Publication date
EP0206179B1 (de) 1993-03-17
DE3688008T2 (de) 1993-10-14
DE206179T1 (de) 1987-05-21
EP0206179A3 (en) 1988-01-13
EP0206179A2 (de) 1986-12-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee