DE3688008D1 - Gegossenes produkt mit einer gedruckten schaltungsplatte. - Google Patents
Gegossenes produkt mit einer gedruckten schaltungsplatte.Info
- Publication number
- DE3688008D1 DE3688008D1 DE8686108137T DE3688008T DE3688008D1 DE 3688008 D1 DE3688008 D1 DE 3688008D1 DE 8686108137 T DE8686108137 T DE 8686108137T DE 3688008 T DE3688008 T DE 3688008T DE 3688008 D1 DE3688008 D1 DE 3688008D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- molded product
- molded
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12916885A JPS61288483A (ja) | 1985-06-15 | 1985-06-15 | プリント基板を有する成形物 |
JP60149193A JPS6211289A (ja) | 1985-07-09 | 1985-07-09 | プリント基板 |
JP1213386A JPS62171184A (ja) | 1986-01-24 | 1986-01-24 | プリント基板を有する成形物 |
JP2026786A JPS62178333A (ja) | 1986-02-03 | 1986-02-03 | プリント基板 |
JP2408986A JPS62183592A (ja) | 1986-02-07 | 1986-02-07 | フレキシブルプリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3688008D1 true DE3688008D1 (de) | 1993-04-22 |
DE3688008T2 DE3688008T2 (de) | 1993-10-14 |
Family
ID=27519366
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19863688008 Expired - Fee Related DE3688008T2 (de) | 1985-06-15 | 1986-06-13 | Gegossenes Produkt mit einer gedruckten Schaltungsplatte. |
DE1986108137 Pending DE206179T1 (de) | 1985-06-15 | 1986-06-13 | Gegossenes produkt mit einer gedruckten schaltungsplatte. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1986108137 Pending DE206179T1 (de) | 1985-06-15 | 1986-06-13 | Gegossenes produkt mit einer gedruckten schaltungsplatte. |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0206179B1 (de) |
DE (2) | DE3688008T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8706857D0 (en) * | 1987-03-23 | 1987-04-29 | Bradley International Ltd Alle | Chip carriers |
US4924590A (en) * | 1988-01-08 | 1990-05-15 | Siemens Aktiengesellschaft | Method for making metal core printed circuit board |
DE19631520C2 (de) | 1996-08-03 | 2001-10-18 | Kavernen Bau Und Betr S Gmbh | Verfahren und Anlage zur soltechnischen Gewinnung von Evaporiten und Aufbereitung von Salzlösungen |
US9247649B2 (en) | 2013-05-06 | 2016-01-26 | Globalfoundries Inc. | Printed circuit boards fabricated using congruent molds |
CN106535465B (zh) * | 2016-11-15 | 2021-11-26 | 智恩电子(大亚湾)有限公司 | 一种抗冲击的印制线路板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3233693C2 (de) * | 1982-09-10 | 1995-01-05 | American National Can Co | Orientierte Verbundfolie und deren Verwendung |
JPS60113665U (ja) * | 1984-01-05 | 1985-08-01 | 昭和電工株式会社 | 混成集積回路用基板 |
JPS6181448A (ja) * | 1984-09-06 | 1986-04-25 | Kuraray Co Ltd | 耐衝撃性を有する樹脂組成物 |
-
1986
- 1986-06-13 DE DE19863688008 patent/DE3688008T2/de not_active Expired - Fee Related
- 1986-06-13 EP EP19860108137 patent/EP0206179B1/de not_active Expired - Lifetime
- 1986-06-13 DE DE1986108137 patent/DE206179T1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0206179B1 (de) | 1993-03-17 |
DE3688008T2 (de) | 1993-10-14 |
DE206179T1 (de) | 1987-05-21 |
EP0206179A3 (en) | 1988-01-13 |
EP0206179A2 (de) | 1986-12-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |