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JPS60113665U - 混成集積回路用基板 - Google Patents

混成集積回路用基板

Info

Publication number
JPS60113665U
JPS60113665U JP1984000029U JP2984U JPS60113665U JP S60113665 U JPS60113665 U JP S60113665U JP 1984000029 U JP1984000029 U JP 1984000029U JP 2984 U JP2984 U JP 2984U JP S60113665 U JPS60113665 U JP S60113665U
Authority
JP
Japan
Prior art keywords
ethylene
hybrid integrated
substrate
integrated circuits
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984000029U
Other languages
English (en)
Inventor
前田　正彦
員也 永田
斉藤　泰旻
大谷　武次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP1984000029U priority Critical patent/JPS60113665U/ja
Priority to EP19850100063 priority patent/EP0148157A3/en
Priority to US06/688,924 priority patent/US4671984A/en
Publication of JPS60113665U publication Critical patent/JPS60113665U/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0853—Ethene vinyl acetate copolymers
    • C08L23/0861—Saponified copolymers, e.g. ethene vinyl alcohol copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は両面銅箔張り混成集積回綺基板の代表例の一部
の断面図の拡大図である。第２図は片面銅箔張り混成集
積回路用基板の代表例の一部の断１・・・導電性金属箔
、２・・・エチレン−アクリル酸共重合体および／また
はエチレン−メタクリル酸　　　。

Claims (1)

    【実用新案登録請求の範囲】
  1. Ａアルミニウム、銅および鉄ならびｉここれらの金属の
    合金の板、Ｂエチレン−アクリル酸共重合体および／ま
    たはエチレン−メタクリル酸共重合体ならびにエチレン
    −酢酸ビニル共重合体のけん化物からなる厚さが３ミク
    ロンないし２０ミクロン未満の樹脂層ならびにＣ導電性
    金属箔を順次積層してなる混成集積回路用基板。
JP1984000029U 1984-01-05 1984-01-05 混成集積回路用基板 Pending JPS60113665U (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1984000029U JPS60113665U (ja) 1984-01-05 1984-01-05 混成集積回路用基板
EP19850100063 EP0148157A3 (en) 1984-01-05 1985-01-03 Printed circuit boards
US06/688,924 US4671984A (en) 1984-01-05 1985-01-04 Printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984000029U JPS60113665U (ja) 1984-01-05 1984-01-05 混成集積回路用基板

Publications (1)

Publication Number Publication Date
JPS60113665U true JPS60113665U (ja) 1985-08-01

Family

ID=11462936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984000029U Pending JPS60113665U (ja) 1984-01-05 1984-01-05 混成集積回路用基板

Country Status (3)

Country Link
US (1) US4671984A (ja)
EP (1) EP0148157A3 (ja)
JP (1) JPS60113665U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6248088A (ja) * 1985-08-27 1987-03-02 三菱電線工業株式会社 金属芯基板及びその製造方法

Families Citing this family (33)

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DE3688008T2 (de) * 1985-06-15 1993-10-14 Showa Denko Kk Gegossenes Produkt mit einer gedruckten Schaltungsplatte.
US4772496A (en) * 1985-06-15 1988-09-20 Showa Denko Kabushiki Kaisha Molded product having printed circuit board
JPS63158711A (ja) * 1986-12-22 1988-07-01 帝国通信工業株式会社 フレキシブルプリント基板の端子構造
US5006397A (en) * 1987-02-06 1991-04-09 Key-Tech, Inc. Printed circuit board
US4863757A (en) * 1987-02-06 1989-09-05 Key-Tech, Inc. Printed circuit board
US4839227A (en) * 1987-03-12 1989-06-13 Minnesota Mining And Manufacturing Company Resilient electrically and thermally conductive flexible composite
US4774127A (en) * 1987-06-15 1988-09-27 Tektronix, Inc. Fabrication of a multilayer conductive pattern on a dielectric substrate
DE3839857A1 (de) * 1988-11-25 1990-05-31 Bayer Ag Weiche, flexible polymermischungen aus verseiftem ethylen-vinylacetat und acrylatkautschuken
JP2993065B2 (ja) * 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 表面平滑金属箔張積層板
TW440528B (en) * 1995-03-28 2001-06-16 Sumitomo Bakelite Co Laminated board and process for production thereof
US5928767A (en) * 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
SG47174A1 (en) * 1995-09-18 1998-03-20 Ibm Cross-linked biobased materials and fabricating methods thereof
US5972447A (en) * 1996-09-30 1999-10-26 Kuraray Co., Ltd. Thermoformable multilayer film and thermoformed container
JP3579740B2 (ja) * 1998-04-18 2004-10-20 Ｔｄｋ株式会社 電子部品の製造方法
US6258203B1 (en) * 1999-09-21 2001-07-10 Ahlstrom Glassfibre Oy Base webs for printed circuit board production using the foam process and acrylic fibers
US6527162B2 (en) * 2000-08-04 2003-03-04 Denso Corporation Connecting method and connecting structure of printed circuit boards
US7226806B2 (en) * 2001-02-16 2007-06-05 Dai Nippon Printing Co., Ltd. Wet etched insulator and electronic circuit component
JP3768908B2 (ja) * 2001-03-27 2006-04-19 キヤノン株式会社 電子放出素子、電子源、画像形成装置
DE10145749A1 (de) * 2001-09-17 2003-04-24 Infineon Technologies Ag Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht
US7258819B2 (en) * 2001-10-11 2007-08-21 Littelfuse, Inc. Voltage variable substrate material
US6609915B2 (en) * 2001-11-30 2003-08-26 Fci Americas Technology Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
US7183891B2 (en) * 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
DE112007000585T5 (de) * 2006-03-10 2009-01-15 Littelfuse, Inc., Des Plaines Unterdrücken elektrostatischer Entladung, die mit Radiofrequenz-Identifikations Tags zusammenhängt
US7595112B1 (en) * 2006-07-31 2009-09-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Resin infusion of layered metal/composite hybrid and resulting metal/composite hybrid laminate
US8349143B2 (en) * 2008-12-30 2013-01-08 Intermolecular, Inc. Shadow masks for patterned deposition on substrates
US8421204B2 (en) * 2011-05-18 2013-04-16 Fairchild Semiconductor Corporation Embedded semiconductor power modules and packages
KR101330770B1 (ko) * 2011-11-16 2013-11-18 엘지이노텍 주식회사 백라이트 유닛용 절곡 인쇄회로기판
KR102070207B1 (ko) * 2013-03-05 2020-01-28 엘지전자 주식회사 전도성 필름 및 이의 제조 방법, 그리고 이를 포함하는 전자 장치
JP2016004841A (ja) * 2014-06-13 2016-01-12 住友ベークライト株式会社 金属箔張基板、回路基板および発熱体搭載基板
JP2016002669A (ja) * 2014-06-13 2016-01-12 住友ベークライト株式会社 金属箔張基板、回路基板および電子部品搭載基板
US10384431B2 (en) * 2017-03-31 2019-08-20 Intel Corporation Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate
US11277909B2 (en) * 2019-08-30 2022-03-15 Ttm Technologies Inc. Three-dimensional circuit assembly with composite bonded encapsulation
CN111484615A (zh) * 2020-05-11 2020-08-04 浙江中科玖源新材料有限公司 低热膨胀系数和吸水率的透明聚酰亚胺薄膜及制备方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6248088A (ja) * 1985-08-27 1987-03-02 三菱電線工業株式会社 金属芯基板及びその製造方法

Also Published As

Publication number Publication date
EP0148157A3 (en) 1988-01-13
EP0148157A2 (en) 1985-07-10
US4671984A (en) 1987-06-09

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