DE1919129A1 - Organic solder or filling compound - Google Patents

Description

Patent attorney

Hems ». 15, TA If MH

Munich, April 15, 1969

No sign: P 732

Applicant: USM CORPORATION

140 Federal Street,
Boston «Massachusetts USA

Organic solder or filling compound

The invention relates to an organic solder based on polyamide and a method for its use. Organic solders, before mainly based on polyamide compounds for assembling or repairing motor vehicle body parts and the like, are, inter alia, from the USA patents 2,944,036 and 3,249,563 known. This is partly a thixotropic mixture of aminopolyamide that hardens when exposed to heat, Epoxy resin, an anti-flux made from fine alumina, a polar one Hydroxyl-containing organic compound and an inorganic filler. On the other hand, it is a homogeneous mixture of thermoplastic polyurethane plastic, and thermoplastic polyamide with filler finely divided therein.

On organic solders or fillers for processing metal car bodies parts have different requirements with regard to their chemical and physical properties, They must be firm on the one hand, and must be within melt and harden within a narrow temperature range, whereby the melting temperature must be as high as possible, e.g. 160 ° C,

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so that the material remains dimensionally stable when it is subsequently handled, e.g. in a paint drying oven. Width »Should this · material · be storable, ie si ·» üasen ohii · eich ■ «serfetsen _; or to react at least for a few days before they can be stored. Of course, the connection created by the organic solder and a metal body must be permanent even in the event of strong vibrations. Furthermore, after the solder has hardened on the metal body * .B- »with grinding machines, files» rasps, etc. can be processed so that it can form a uniform surface with the metal. After all, the connection must be solvent-proof, and its surface must be able to absorb color "like the surrounding metal parts, so that there is no difference" in color tint over the entire surface "

The solder created by the invention baw. Filler fulfills these requirements. It can be applied to metal parts in the molten state. «Preference swpis · there · is a lot of over 15 percent by weight, calculated on its total weight, made of thermoplastic polyamide,“ an epoxidized material ”and calculated below over 67 percent by weight; on its total weight of finely divided filler. "The Bolyamid and epoxidized · Mate _t rial are coordinated with one another" daft, 'si ·) does not or hardly react with each other under normal storage conditions according to The ^Ring! and ball method determines · softening point of · solder · lies

Preferably over 16o ° C. i ^Λ

The solder according to the invention can be stored In their condition, metal parts can be applied as a permanent coating or as a fill-in preparation. 4 /

The epoxidized material is used as a plasticizer. Preferably it is; A storable ·· «epoxy-dyed edible oil, eg epoxidized · soybean oil, are primarily suitable epoxidized materials with viscosities of about 332 centistokea at 25 ° C? si should be an average molecule V

OOI0A2 / 1S63 _v

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stti ^ t::. ■ .. ■ ■■■: ■ - ■ ■, ■ -. ■■. · ■

! Up9 «wittkt ve * Mo.« t * sj ** Ui * cae * «ewioht at 2S ⁰ C from ■

a ftaximle ilur * sehi of i and * in Epo-

• * «n. 24f; Äi “-267-having” -eerafeige substances are suitable

_ _immwm- & mm &# kä *,; *! * "i" -f "& 4 * n preferred polyamides f ^ '] #% rend the storage do not react very acirw * ch react" while Hill ietand in genchmolsenem after application slowly with the,. , | h »lyajiid react and the mischief. hardens slowly. Preference is given to "-" 1) ** iee is then "epoxidized" soybean oil in slopes of approx. 14-15 percent by weight, calculated on the

EMs developed polyamide used in the composition of the invention . tea on the standing surface on which the mass is applied, . excellent sticky "chat, it does not matter whether the steel surface is provided with an arundic layer or not. The softening point of the mass is relatively high and 'within a narrow range of nature. besides, the crowd is

-: elastic. Since “polyamide material can be a mixture of different

, johieäenen be polyamides * Preferably ei is a mixture j | wil * dt «! Polyamides (in the future called Type I _f Type II ^ Type IIl) ie

. j eioe in the solid state relatively elastic polyamide, (type i) It has excellent adhesive properties on steel ; Polyamide, (type II) and a polyamide with one within one

I Amounts softening point lying within the temperature range (type III).

As preferred elastic "polyamide (type I) is a linear wesentv in borrowed" Reaktioneprodukt comes from chemically equivalent amounts of ethylenediamine and dimerisiertea Linülsiure for use, '' - 'The molecular weight of this polyamide is between 3000 and

- I 1 ^) OOt «* has» a firing point (ring-ball) of 180 ° c -

. ] 19C |? <J »has a specific weight of 0.98 and an umin number of

<4. This polyamide reacts with the epoxidized material :, ordinary storage temperatures only very weak. Bs is at a temperature slightly above its softening point

relatively thick; its using a Brookfield viscometer The viscosity measured in a No. 4 spindle at 20 rpm was

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200 ° C 3 to 4 poises. This helps to improve the fluidity to restrict the melted connection. The elasticity this material leads to excellent properties of use of the mass in solid as well as in molten form State.

The preferred polyamide with good adhesive strength to metal fleece (type II) is: a thermoplastic material that is predominantly linear in its structure and has a higher molecular weight than the one described above. The material can be one of chemically equivalent proportions of dimerized linoleic acid and ethylenediamine-propylenediamine, and / or higher alkylenediamines, the diamine having an amine number of 4-8, a specific gravity of O _# 95 and a softening point (ring and ball) of about 140 ° C should have * Although predominantly linear, this material can - it can see. It is a reaction product of commercially available dimeric acid with small amounts of trimeric molecules - to a small extent crosslink with the groups of the epoxidized oil «, property is more pronounced with this polyamide than with. the polyamide (TYPE X) described in the previous paragraph. This material improves the elasticity of the compound in its natural state, although it can happen that its viscosity is increased to an almost undesirable extent

A hard, relatively brittle substance with an amine number of 3, a specific weight of 0 * 93 and a softening point (ring and ball) <180 - Ι8> Θ ° C is used as the preferred polyamide with a sharply defined (type III). The transition from the solid to the place in this polyamide within sines meh range instead, "In the molten state even at _Λ s above the softening point lying SemporafetSE ·, x-Tcsist the ses polyamide a very low viscosity

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The reaction between the polyamides preferred in the compound and the epoxidized material is very weak during storage, on the one hand because of the low relative reactivity of the substances to one another, and on the other hand because of the epoxies and polyamides used in the mass in only small amounts. The proportion of polyamide in the mass is preferably between 24-30 %. The weight ratio of the first polyamide to the second plus third polyamide is about 1:18, and the ratio of the 2nd to the 3rd polyamide is in the range of about 1 to 4: 1. The polyamides are preferably mixed with one another in a weight ratio of 1: 14: 4.

The bulk preferred filler is a mixture of different materials including 2 ink dust. Based on its zinc dust content, the mass has a metallic-gray color and, after hardening, can be processed with metalworking tools such as files and the like. In addition, the filler mixture contains flame retardants such as antimony oxide. Furthermore, the filler mixture contains potassium carbonate treated with stearate, which is easy to distribute in the solder mass and gives it internal strength after application. In the preferred filler mixture, the stearate treated calcium carbonate and zinc dust make up the major parts. The weight fraction of the filler mixture in the mass is about 72 %.

The mass can be prepared in any form, e.g. as a rod or strand or as granular material and needs to be done first to be melted immediately before use. In the molten state, the solder mass on steel body parts is without prior priming or roughening of the same can be applied. Preferably grease, oil and rust are removed beforehand; however, it is unnecessary to use the usual amounts to remove so-called drawing oils. The metal is preferably heated with a flame before the Loc is applied. After cooling down of the plumb bob, it is filed or ground so that its upper

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surface of the surrounding Ketftllf pool in ErwUna ^ tes? White © anesst. Subsequently, the escape with a primer "can provide layer and painted on common © type. Me painted parts are passed through a stretching oven to 15S ^east C erwärmtenFa th.

The invention sees in connection with the above-described solder a method of assembling or repairing motor vehicle body parts, that consists in the Karosaerieteile be heated, the following da® ob © n described Solder applied in a molten state, and sewn the shape of the body part © according to the cooling and hardening is filed or sanded *

For a better understanding of the invention, reference is made to the following Example referenced§

Components thermoplastic polyamide

Type I.
Type II
Type in

Epoxidized material

Weight lean

Soybean filler blend

Ka Is iumkarbonatj

Air dust

Magnesium aluminum silicate Antimony oxide

10

12th

ac

Of the calcium carbonate particles, 99% were coated with a sbearic acid layer less than 5 microns thick "

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• \ JDi * the above connection was prepared by first assigning the poly- <i * ati4 * itaterial to jgeeehmoiäsiesi and then "with the other substances to liiMogafien Masb". The crowd had one

(Ring and ball) of 168 ° C and was made into a Üfeiöf *. The lot was separated from the steelwork and checked for various properties. The mass was applied to the metal without a primer layer; were allerlilnft M mt uS Itbenaieig existing oil and lubricants removed. The * Lot * "" $$ was applied in a cheeky condition- $ m ₉ meMm di "lletftlif ifcch" with - "iner

beetaad in that the interface between two with 1 1/2 approx. Wide edge overlapping and spot welded at the end no connected in steel sheets on both sides with Let was covered, or after hardening, the solder was matched a «r Met * lif3» surface formed a smooth surface

Another attempt was the solder mass on a dented Stfe'ttXfX & che applied to precipitate the indentation. That was enclosing to one with the surrounding eb * n «i · Fläch« * bciS »echlif fea. Hamn ^ rschiXge on the

f «g« i # iJ «! riiÄgeftid,«! The side of the sheet steel could not measure the mass

fts Mstiöm «reiiiif« ^ Vs) £ inich ^ earth the feces -as tteeiizug on a

applied and sanded to a smooth surface. A grizzly was applied to JPlaelie before she became. The unit was then passed through a Partotroeken oven, which was heated ^{to the needs of the ISS ö C.} It wuräe found that oil "mass <ä & at their feet% m nicint changed, nnü that the paint eisiheifclicrhe FlrlsujEjf" o "teeth broken Steep

woiz & b -ei »Attempt carried out to close the plumb bob

PAD ORIGINAL

191912B

Joining non-welded metal sheets was used. Included 1.25 χ 1.25 cm overlapping sheets were placed with the mass glued. After the mass had hardened, the connection was unbreakable up to more than 450 kg, the break being within the mass and did not occur between the mass and the metal.

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η £ % ε ι. 2/1 f 5

Claims (1)

Expectations , I / solder mass based on polyamide, characterized in that 3 they are too 15 to 30 percent by weight calculated on the mass of thermoplastic Polyamide, from 14 to 15 percent by weight calculated on the polyamide made from epoxyiated material and from 67 to 72 Percentage by weight calculated on the mass of a filler. 2) solder according to 3 claim 1, characterized in that "the polyamide a mixture of an elastic, essentially linear reaction product from equivalent compounds dimerizes linoleic acid and ethylene diamine with a molecular weight of 3000 . up to 9000 and an amine number of 4, from a reaction product equivalent proportions of dimerized linoleic acid and one Alkylenediamine with a min number of -i - 3, and from a brittle one Polyamide with an amin number of 3 and a sharp, The softening point determined by the ring and ball method is 130-190 ° C. claim 3) Solder according to 1 and 2, characterized in that the polyamide components are present in a proportion of Isl4: 4. claim 4) Loc according to 1-3, characterized in that the epoxidized macerial is epoxidized soybean oil with a viscosity at 25 ° C of 332 centischokes , a molecular weight of 940 and an epoxy equivalent of 246 to 267. 5) solder according to claims 1-4, characterized in that the filler from a mixture of Zinkscaub, an-imonoxyU, with 3tearate treated calcium carbonate and magnesium aluminum silicate bescehc. 5S1 BATH ORIGINAL - OK - softening point determined using the ring and ball method from 160 - 168 ° C. 7) Method for applying d @ ® in claim I - S- Lots on metal bodywork parts * are made by the fact that
the metal is heated so that the solder is in a good condition
is applied to the metal, that the @ Einhs.ife gefeitilfc wied, and that the © surface of the solder is ground to a desired shape »- BATH ORIGINAL