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DE1301378B - Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis - Google Patents

Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis

Info

Publication number
DE1301378B
DE1301378B DEJ33027A DEJ0033027A DE1301378B DE 1301378 B DE1301378 B DE 1301378B DE J33027 A DEJ33027 A DE J33027A DE J0033027 A DEJ0033027 A DE J0033027A DE 1301378 B DE1301378 B DE 1301378B
Authority
DE
Germany
Prior art keywords
metal
ceramic
metallic
capillary system
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEJ33027A
Other languages
German (de)
English (en)
Inventor
Schwartz Bernard
Ahn Junghi
Wilcox David Lavern
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1301378B publication Critical patent/DE1301378B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Conductive Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
DEJ33027A 1966-03-30 1967-02-17 Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis Pending DE1301378B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53877066A 1966-03-30 1966-03-30

Publications (1)

Publication Number Publication Date
DE1301378B true DE1301378B (de) 1969-08-21

Family

ID=24148353

Family Applications (1)

Application Number Title Priority Date Filing Date
DEJ33027A Pending DE1301378B (de) 1966-03-30 1967-02-17 Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis

Country Status (8)

Country Link
BE (1) BE694305A (uk)
CH (1) CH452016A (uk)
DE (1) DE1301378B (uk)
ES (1) ES338549A1 (uk)
FR (1) FR1512995A (uk)
GB (1) GB1178745A (uk)
NL (1) NL144473B (uk)
SE (1) SE337856B (uk)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2306236A1 (de) * 1973-02-08 1974-08-15 Siemens Ag Verfahren zur herstellung von schichtschaltungen mit leitenden schichten auf beiden seiten eines keramiksubstrates
EP0089550A2 (de) * 1982-03-19 1983-09-28 DRALORIC Electronic GmbH Monolithischer Kondensator und Verfahren zu seiner Herstellung

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL169260C (nl) * 1971-04-16 1982-06-16 Tam Ceramics Inc Werkwijze om gesinterde keramische voorwerpen te vervaardigen, welke geleiders bevatten.
US3999004A (en) * 1974-09-27 1976-12-21 International Business Machines Corporation Multilayer ceramic substrate structure
GB2103422B (en) * 1981-07-30 1985-02-27 Standard Telephones Cables Ltd Ceramic capacitors
US4584629A (en) * 1984-07-23 1986-04-22 Avx Corporation Method of making ceramic capacitor and resulting article
JP2579937B2 (ja) * 1987-04-15 1997-02-12 株式会社東芝 電子回路装置およびその製造方法
KR920006856B1 (ko) * 1990-04-07 1992-08-20 한국과학기술연구원 주입전극법에 의한 다층세라믹 축전기의 제조방법
KR20080023303A (ko) * 2005-05-18 2008-03-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 마이크로유체 그물구조 내 전도성 경로, 마이크로회로 및마이크로구조물의 제작
US9823221B2 (en) 2012-02-17 2017-11-21 STRATEC CONSUMABLES GmbH Microstructured polymer devices
CN109511218A (zh) * 2018-12-16 2019-03-22 天津荣事顺发电子有限公司 一种多层陶瓷电路板制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189978A (en) * 1962-04-27 1965-06-22 Rca Corp Method of making multilayer circuits

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189978A (en) * 1962-04-27 1965-06-22 Rca Corp Method of making multilayer circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2306236A1 (de) * 1973-02-08 1974-08-15 Siemens Ag Verfahren zur herstellung von schichtschaltungen mit leitenden schichten auf beiden seiten eines keramiksubstrates
EP0089550A2 (de) * 1982-03-19 1983-09-28 DRALORIC Electronic GmbH Monolithischer Kondensator und Verfahren zu seiner Herstellung
EP0089550A3 (de) * 1982-03-19 1984-09-26 DRALORIC Electronic GmbH Monolithischer Kondensator und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
NL144473B (nl) 1974-12-16
SE337856B (uk) 1971-08-23
GB1178745A (en) 1970-01-21
ES338549A1 (es) 1968-04-01
CH452016A (de) 1968-05-15
FR1512995A (fr) 1968-02-09
NL6704510A (uk) 1967-10-02
BE694305A (uk) 1967-07-31

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