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DE112015002642A5 - Optoelektronisches Bauelement - Google Patents

Optoelektronisches Bauelement Download PDF

Info

Publication number
DE112015002642A5
DE112015002642A5 DE112015002642.8T DE112015002642T DE112015002642A5 DE 112015002642 A5 DE112015002642 A5 DE 112015002642A5 DE 112015002642 T DE112015002642 T DE 112015002642T DE 112015002642 A5 DE112015002642 A5 DE 112015002642A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112015002642.8T
Other languages
English (en)
Inventor
Hubert Halbritter
Britta Göötz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015002642A5 publication Critical patent/DE112015002642A5/de
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8515Wavelength conversion means not being in contact with the bodies
DE112015002642.8T 2014-06-05 2015-06-02 Optoelektronisches Bauelement Ceased DE112015002642A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014107960.4 2014-06-05
DE102014107960.4A DE102014107960A1 (de) 2014-06-05 2014-06-05 Optoelektronisches Bauelement
PCT/EP2015/062255 WO2015185549A1 (de) 2014-06-05 2015-06-02 Optoelektronisches bauelement

Publications (1)

Publication Number Publication Date
DE112015002642A5 true DE112015002642A5 (de) 2017-02-23

Family

ID=53274552

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014107960.4A Withdrawn DE102014107960A1 (de) 2014-06-05 2014-06-05 Optoelektronisches Bauelement
DE112015002642.8T Ceased DE112015002642A5 (de) 2014-06-05 2015-06-02 Optoelektronisches Bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014107960.4A Withdrawn DE102014107960A1 (de) 2014-06-05 2014-06-05 Optoelektronisches Bauelement

Country Status (4)

Country Link
US (1) US10483439B2 (de)
CN (1) CN106463581B (de)
DE (2) DE102014107960A1 (de)
WO (1) WO2015185549A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10153414B2 (en) 2015-03-20 2018-12-11 Osram Opto Semiconductors Gmbh Optoelectronic component

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015121720A1 (de) * 2015-12-14 2017-06-14 Osram Opto Semiconductors Gmbh Konversionselement, optoelektronisches Bauelement und Verfahren zur Herstellung eines Konversionselements
DE102016114474A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden Bauelement
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung

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JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置
CN1189951C (zh) 2000-04-24 2005-02-16 罗姆股份有限公司 侧发射型半导体光发射器件及其制造方法
CN2658728Y (zh) * 2003-09-26 2004-11-24 玉山奈米机电股份有限公司 热电堆红外线感测组件的封装结构
US20050067681A1 (en) 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
JP2006049657A (ja) * 2004-08-06 2006-02-16 Citizen Electronics Co Ltd Ledランプ
US7623252B2 (en) * 2005-08-01 2009-11-24 Cree, Inc. Methods, apparatus and computer program products for controlling a volume of liquid in semiconductor processing based on reflected optical radiation
US7196354B1 (en) * 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
US8941293B2 (en) * 2006-05-11 2015-01-27 Samsung Electronics Co., Ltd. Solid state lighting devices comprising quantum dots
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
US20080149166A1 (en) * 2006-12-21 2008-06-26 Goldeneye, Inc. Compact light conversion device and light source with high thermal conductivity wavelength conversion material
US20100110728A1 (en) * 2007-03-19 2010-05-06 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
DE102007041133A1 (de) * 2007-08-30 2009-03-05 Osram Opto Semiconductors Gmbh Gehäuse mit einem Gehäuseunterteil, sowie Verfahren zur Aussendung elektromagnetischer Strahlung
DE102008022941A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Sensorsystem mit einer Beleuchtungseinrichtung und einer Detektoreinrichtung
US10121950B2 (en) * 2008-03-01 2018-11-06 Goldeneye, Inc. Lightweight solid state light source with common light emitting and heat dissipating surface
KR100962733B1 (ko) * 2008-04-14 2010-06-10 삼성에스디아이 주식회사 필름 유닛 및 이를 구비하는 플라즈마 디스플레이 패널
KR101018111B1 (ko) * 2008-10-07 2011-02-25 삼성엘이디 주식회사 양자점-금속산화물 복합체, 양자점-금속산화물 복합체의 제조방법 및 양자점-금속산화물 복합체를 포함하는 발광장치
US9048404B2 (en) * 2009-07-06 2015-06-02 Zhuo Sun Thin flat solid state light source module
KR20120013758A (ko) * 2010-08-06 2012-02-15 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
CN103384794B (zh) * 2010-12-23 2018-05-29 三星电子株式会社 包含量子点的光学元件
JP5937521B2 (ja) * 2011-01-28 2016-06-22 昭和電工株式会社 量子ドット蛍光体を含む組成物、量子ドット蛍光体分散樹脂成形体、量子ドット蛍光体を含む構造物、発光装置、電子機器、機械装置及び量子ドット蛍光体分散樹脂成形体の製造方法
DE102011113963A1 (de) * 2011-09-21 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US8952406B2 (en) * 2012-07-12 2015-02-10 Micron Technology, Inc. Lighting devices including patterned optical components and associated devices, systems, and methods
US20140049939A1 (en) * 2012-08-20 2014-02-20 GE Lighting Solutions, LLC Lamp with integral speaker system for audio
US20140264419A1 (en) * 2013-03-15 2014-09-18 University-Industry Foundation (Uif) Phosphor film, and light emitting device and system using the same
CN103219449B (zh) * 2013-04-18 2016-12-28 东莞帝光电子科技实业有限公司 Led封装结构及led封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10153414B2 (en) 2015-03-20 2018-12-11 Osram Opto Semiconductors Gmbh Optoelectronic component

Also Published As

Publication number Publication date
US20170125646A1 (en) 2017-05-04
WO2015185549A1 (de) 2015-12-10
CN106463581A (zh) 2017-02-22
CN106463581B (zh) 2018-12-11
US10483439B2 (en) 2019-11-19
DE102014107960A1 (de) 2015-12-17

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R082 Change of representative

Representative=s name: SCHEELE JAEGER WETZEL PATENTANWAELTE PARTNERSC, DE

Representative=s name: ZACCO PATENTANWALTS- UND RECHTSANWALTSGESELLSC, DE

R082 Change of representative

Representative=s name: SCHEELE JAEGER WETZEL PATENTANWAELTE PARTNERSC, DE

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final