DE102005025013A1 - Conductor structure manufacturing method for e.g. chip card, involves punching metal foil in electrically conducing layer, where foil is laminated on carrier and punching process is implemented using roller punch - Google Patents

Abstract

The method involves punching a metal foil in an electrically conducing layer that is arranged on a carrier, where the foil is laminated on the carrier by cold or warm lamination. The punching process is implemented using a roller punch and the carrier is formed as a carrier strip that is made of plastic or paper. The layer is applied on an adhesive foil before the punching process.

Description

The The invention relates to a method for producing arranged on a support Conductor structures in which arranged from one on the carrier electrically conductive layer structures are punched.

Such methods are used, for example, for producing printed conductor structures for chip cards or for antenna structures for, for example, mobile telephones. Such methods are for example off DE 100 16 037 known. Here it is described that a conductor track structure is produced by means of a steel strip having a punching tool.

Roll punching methods have heretofore been used for punching paper labels, for example US 5,217,259 known. Out US 6,153,280 It is known to mark predetermined breaking points in magnetic cards by means of a roller punch. Common methods for separating electrical connections on laminated plastic laminated IC frames include, among others DE 103 18 688 known. It is described here that a cutting of electrical connections takes place by cutting processes or by laser treatment, without severing the substrate material.

Of the Invention is based on the object, the known methods of generic type, in particular for the production of antenna structures, improve and high Accuracy of material separation to ensure.

The The object is achieved by the Characteristics of claim 1 solved. Characterized in that the punching is carried out by means of a roller punch, can extremely thin and bending-stressed conductor tracks on carrier foils, For example, manufactured UHF antenna parts for mobile phones become. The risk of hairline cracks is significantly reduced. Preferably be additional in a separate process or at the same time structures by Hubstanzen in the electrically conductive layer, in particular a metal layer, punched, which can be made very narrow column. Of the carrier is preferably as a carrier tape, in particular designed as a so-called endless belt and preferably made of Plastic or paper formed. In particular, it is appropriate to a on the carrier laminating laminated metal foil as an electrically conductive layer, wherein the carrier itself expediently is not severed. It may be beneficial to do that before punching another layer, such as an adhesive film, onto the Metal layer is applied to some stabilization during the manufacturing process to secure. Under roll punching is also a not complete severing one or more of the layers understood (roll embossing or roll notches).

The Method can be as single-stage process or multiple roll punching executed consecutively be punched in the same metal layer or in a mounted on the lower side on the substrate second Metal layer.

One multilayer construction, for example, plastic-metal-plastic or Metal-plastic-metal is possible. Each of the layers can over the entire width or only in strips. During the Rolling or blanking can be a surface structuring imprinted or it may be a stiffening / solidification of certain areas respectively. Furthermore, punching can be combined with etching (endless etching), laminating or printing layers, in particular electrically conductive Layers.

following is an embodiment of Invention explained in more detail with reference to a drawing. In the drawing shows:

1 the schematic sequence of roll punching,

2 a cross section through the film composite to be processed,

3 a punched structure in plan view and

4 a stamped structure in cross section.

In the exemplary method is of a carrier roll 1 a paper backing having a transfer adhesive film thereon and a paper protective cover unwound. The paper protective cover is attached to a roller 2 pulled off and on a spool 3 wound. Thereafter, a metal foil of a metal foil coil 4 unwound. The metal foil (eg copper or a copper alloy) may possibly be specially surface treated for later bonding. It has a thickness of about 2 to 80 .mu.m, in particular 45 .mu.m. The metal foil is at the laminating station 5 applied to the transfer adhesive film of the substrate by cold or hot lamination. At another laminating station 7 For example, other films, such as adhesive tapes or metal foils, may be used by a film spool 6 unwound be laminated. The transfer adhesive film may have a thickness of about 50 microns and be applied to an approximately 80 micron thick substrate made of silicone paper.

The resulting film composite is in 2 shown in cross section. Instead of a single band-shaped film structure, a plurality of such film structures, optionally on a common substrate, side by side to go through the entire process, the number of juxtaposed film strips is limited only by the width of the system. After lamination, the adhesive film adheres to the metal and is severed together with the metal during rotary punching, whereby the silicone carrier paper is not severed. At the end, one can peel off the structured metal from the backing paper, the adhesive adheres to the metal and then serves to bond / secure the metal structure to the particular application part, for example a device housing.

After lamination, the film composite passes through the roller punch with the rotary punching cylinder 8th on the one hand and the counter-cylinder 9 on the other side of the film composite. Through the rotary punching cylinder 8th one or more (if necessary, all) layers of the film composite are severed according to the predetermined punching pattern. At the following removal station 10 The stamped waste grate, which is no longer needed after punching, is drawn off and onto a roll 11 wound. Subsequently, the film composite passes through a lifting punch 12 in which additional patterns are punched. The feed and the lateral guidance of the film composite is carried out by feed and guide rollers 13 , Ultimately, the processed film composite on a transport spool 14 wound.

2 shows the already mentioned cross section through the film composite with a carrier film 15 made of paper, an adhesive film arranged thereon 16 , On it is the metal foil 17 (in the example copper or a copper alloy). Other slides 18 such as a plastic adhesive tape or a metal foil may be on the metal foil 17 be arranged.

In 3 a film composite is shown in sections in plan view. A punching structure 19 has been produced by roller punching or in combination with a Hubstanzwerkzeug. The film composite also has so-called guide or positioning holes 20 on.

4 shows a section through the finished die-cut in 3 illustrated film with the already in 2 illustrated basic layer structure. The dividing slot 21 with a width of about 1 mm can be done by roll punching, optionally in two punching operations in succession or by the lamination of two juxtaposed metal foils.

In principle, the application of the additional film 18 also at a different one than at the 1 shown location of the process flow done, for example, after removing the waste grid or after the Hubstanzen.

The outer layers can a whole area or selective electroplated surface coating.

In the 3 stacked punching structures 19 are later separated (singular) and used as a UHF antenna for mobile phones.

Claims (6)

Method for producing conductor track structures arranged on a carrier in which structures are punched from an electrically conductive layer arranged on the carrier, characterized in that the punching is carried out by means of a roller punch. Method according to claim 1, characterized in that that in addition in a separate process or at the same time structures by means of lifting in the electrically conductive layer are punched. Method according to claim 1 or 2, characterized that the carrier designed as a carrier tape is. Method according to claim 3, characterized that a carrier tape made of plastic or paper is used. Method according to one of claims 1 to 4, characterized that one laminated on the carrier Metal foil is punched as an electrically conductive layer. Method according to one of claims 1 to 5, characterized in that prior to punching, a further layer, preferably an adhesive film, is applied to the electrically conductive layer.