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DE10130998A1 - Vorrichtung zur Herstellung von Halbleiterbauelementen und Flachbildschirmen - Google Patents

Vorrichtung zur Herstellung von Halbleiterbauelementen und Flachbildschirmen

Info

Publication number
DE10130998A1
DE10130998A1 DE2001130998 DE10130998A DE10130998A1 DE 10130998 A1 DE10130998 A1 DE 10130998A1 DE 2001130998 DE2001130998 DE 2001130998 DE 10130998 A DE10130998 A DE 10130998A DE 10130998 A1 DE10130998 A1 DE 10130998A1
Authority
DE
Germany
Prior art keywords
product
robots
robot
semiconductor
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2001130998
Other languages
German (de)
English (en)
Inventor
Lyul Han Jum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DMS Co Ltd
D M S CO
Original Assignee
DMS Co Ltd
D M S CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DMS Co Ltd, D M S CO filed Critical DMS Co Ltd
Publication of DE10130998A1 publication Critical patent/DE10130998A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
DE2001130998 2000-06-29 2001-06-27 Vorrichtung zur Herstellung von Halbleiterbauelementen und Flachbildschirmen Withdrawn DE10130998A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020000036453A KR20010034990A (ko) 2000-06-29 2000-06-29 반도체 및 평판디스플레이용 멀티기능을 갖춘 집적제조장치

Publications (1)

Publication Number Publication Date
DE10130998A1 true DE10130998A1 (de) 2002-03-14

Family

ID=19674791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001130998 Withdrawn DE10130998A1 (de) 2000-06-29 2001-06-27 Vorrichtung zur Herstellung von Halbleiterbauelementen und Flachbildschirmen

Country Status (5)

Country Link
JP (1) JP2002076088A (zh)
KR (1) KR20010034990A (zh)
CN (1) CN1342998A (zh)
DE (1) DE10130998A1 (zh)
TW (1) TW504737B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2004303916A (ja) * 2003-03-31 2004-10-28 Seiko Epson Corp 製造対象物の搬送装置および製造対象物の搬送方法
CN100403145C (zh) * 2005-01-31 2008-07-16 中华映管股份有限公司 工厂生产加工系统及其操作方法
WO2007141649A1 (en) * 2006-06-06 2007-12-13 Abb Research Ltd Improved method and system for operating a cyclic production machine in coordination with a loader or unloader machine
JP4849969B2 (ja) 2006-06-15 2012-01-11 東京エレクトロン株式会社 基板処理システムおよび基板搬送方法
JP2011018731A (ja) * 2009-07-08 2011-01-27 Rayresearch Corp ウェハ分岐搬送装置
CN103782239B (zh) * 2011-08-30 2017-09-05 株式会社尼康 基板处理装置及基板处理方法、曝光方法及曝光装置、以及元件制造方法、及平板显示器的制造方法
CN102642162A (zh) * 2012-05-08 2012-08-22 广东新海岸机械有限公司 玻璃双边磨削抛光设备
KR101439168B1 (ko) * 2012-09-19 2014-09-12 우범제 웨이퍼 상에 잔존하는 공정가스를 제거하는 웨이퍼 퍼징 카세트를 갖춘 웨이퍼 처리장치
KR101458626B1 (ko) * 2012-11-01 2014-11-11 우범제 웨이퍼 퍼징 카세트

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980075658A (ko) * 1997-03-31 1998-11-16 윤종용 포토리소그래피 공정설비의 웨이퍼 이송시스템 및 웨이퍼 이송방법
JP3884170B2 (ja) * 1998-06-18 2007-02-21 大日本スクリーン製造株式会社 基板処理装置
JP3576831B2 (ja) * 1998-09-18 2004-10-13 東京エレクトロン株式会社 処理装置
JP2000138276A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 基板処理装置

Also Published As

Publication number Publication date
JP2002076088A (ja) 2002-03-15
CN1342998A (zh) 2002-04-03
KR20010034990A (ko) 2001-05-07
TW504737B (en) 2002-10-01

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination