CN2922126Y - Thin-film flipchip package structure and COF thin-film winding used for flip chip package - Google Patents
Thin-film flipchip package structure and COF thin-film winding used for flip chip package Download PDFInfo
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- CN2922126Y CN2922126Y CN 200620012274 CN200620012274U CN2922126Y CN 2922126 Y CN2922126 Y CN 2922126Y CN 200620012274 CN200620012274 CN 200620012274 CN 200620012274 U CN200620012274 U CN 200620012274U CN 2922126 Y CN2922126 Y CN 2922126Y
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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Abstract
The utility model is related to a thin-film flipchip package structure and COF thin-film winding used for flip chip. The thin-film flipchip package structure mainly comprises a COF thin-film winding, a chip and a packaging unit. The COF thin-film winding comprises a pliability dielectric layer and a down-lead layer. The pliability dielectric layer is defined with a chip joint area and has an opening which is provided in the chip joint area and is through an upper surface and a lower surface of the pliability dielectric layer. The chip is provided on the COF thin-film winding and the plural protruding blocks of the chip are electrically connected with plural first lead-downs and plural second lead-downs of the lead-down layer. The packaging unit is formed between the chip and the COP thin-film winding and is filled into the opening to seal the protruding blocks, plural first inner connection fingers of the first lead-downs and plural second inner connection fingers of the second lead-downs. The opening can avoid stress remnant after being sealed which causes the separation and crack of the pliability dielectric layer, the chip and the packaging unit and can improve the air exhaust.
Description
Technical field
The utility model relates to the COF film webs of a kind of thin-film flip-chip packaging construction and membrane of flip chip encapsulation, particularly relates to a kind of thin-film flip-chip packaging construction of stress and COF film webs of chip package of reducing.
Background technology
Past, global drive IC major part was based on the TCP packaged type, comprise LCD (liquidcrystal display, LCD) drive IC also adopts the TCP packaged type, but based on cost consider, fine pin under the factor affecting such as lift-launch of (Fine Pitch), substrate pliability and passive device, the ratio that adopts the COF packaged type to be applied to the LCD liquid crystal panel also increases gradually.In the known TCP packaged type, substrate is at least 3 layers structure, it is to be base material (most of PI of being), adhesion layer (Adhesive) and copper layer, wherein the thickness of base material is to be about 75 microns (μ m), the thickness of adhesion layer is to be about 10 microns (μ m), and the thickness of copper layer is to be about 18-25 micron (μ m), add the thickness of wafer and adhesive body, the gross thickness of TCP packaging structure is to be about the 600-1000 micron, in comparison, in the COF packaged type, substrate is the structure for 2 layers, be respectively pliability dielectric layer (most of PI of being) and copper layer, the thickness of pliability dielectric layer is to be about 25-38 micron (μ m), and the thickness of copper layer is to be about 8 microns (μ m), add the thickness of wafer and adhesive body, the gross thickness of COF packaging structure is about the 400-700 micron, and the thickness of COF packaging structure is the thickness that is significantly less than the packaging structure of TCP, and the substrate of TCP haves three layers, when being assembled in the LCD liquid crystal panel, have the shortcoming that bending is difficult for, and pin density is less.
See also shown in Figure 1ly, known thin-film flip-chip packaging construction 100 mainly comprises a COF film webs 110, a wafer 120 and an adhesive body 130.This COF film webs 110 is to include a pliability dielectric layer 111 and a trace layer 112, this pliability dielectric layer 111 is to have a upper surface 113 and a lower surface 114, this trace layer 112 is to comprise a plurality of first lead-in wires 115 and a plurality of second lead-in wire 116, and those first lead-in wires 115 are to have to connect in a plurality of first to refer to connect in the 115a and a plurality of second to refer to 116a with those second lead-in wires 116.One active surface 121 of this wafer 120 is to have a plurality of golden projections 122, this wafer 120 is to be arranged on this COF film webs 110, and those projections 122 are to electrically connect those to connect in first and refer to that 115a and those meet finger 116a in second, this adhesive body 130 is to be formed between this wafer 120 and this COF film webs 110, with seal those projections 122, those connect in first and refer to that 115a and those meet finger 116a in second.Yet, the pre-cure phase of this thin-film flip-chip packaging construction 100 necessary lower temperature of process earlier behind this adhesive body 130 of spot printing, the outward appearance curing earlier of this adhesive body 130 is finished, then improve temperature again, to carry out the inside solidification program of this adhesive body 130, thereby make residual stress become big and cause this upper surface 113 of this pliability dielectric layer 111 of this COF film webs 110 and this lower surface 114 towards these wafer 120 direction contraction distortions, thereby influence outward appearance, more can cause this adhesive body 130 in addition, this trace layer 112 and wafer 120 forms layerings, makes aqueous vapor enter this thin-film flip-chip packaging construction 100 and influences the electric connection of this wafer 120 and this trace layer 112.
See also shown in Figure 2ly, it is for improving the another kind of known thin-film flip-chip packaging construction 200 that above-mentioned known thin-film flip-chip packaging construction 100 is created, mainly comprising a COF film webs 210, a wafer 220, an adhesive body 230 and a supporting bracket 240.This COF film webs 210 is to include a pliability dielectric layer 211 and a trace layer 212, this pliability dielectric layer 211 is to have a upper surface 213 and a lower surface 214, and this trace layer 212 is to comprise a plurality of first lead-in wires 215 and a plurality of second lead-in wire 216.This wafer 220 be arranged on this COF film webs 210 and an active surface 221 of this wafer 220 on plurality of bump 222 be electrically connect those first lead-in wires 215 a plurality of first in connect refer to 215a and those second lead-in wires 216 a plurality of second in meet finger 216a, this adhesive body 230 is to be formed between this wafer 220 and this COF film webs 210, with seal those projections 222, those connect in first and refer to that 215a and those meet finger 216a in second.This supporting bracket 240 is that this upper surface 213 that is arranged at this pliability dielectric layer 211 produces fold to prevent this pliability dielectric layer 211 because of contraction, but, have the puzzlement that adhesive force is not good and these thin-film flip-chip packaging construction 200 thickness are increased because the material of this supporting bracket 240 and the material of this pliability dielectric layer 211 are inequality.
This shows that above-mentioned existing thin-film flip-chip packaging construction obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that existing thin-film flip-chip packaging construction exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel thin-film flip-chip packaging construction, just becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing thin-film flip-chip packaging construction exists, the design people is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel thin-film flip-chip packaging construction, can improve general existing thin-film flip-chip packaging construction, make it have more practicality.Through constantly research, design, and, create the utility model that has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing thin-film flip-chip packaging construction exists, and provide a kind of novel thin-film flip-chip packaging construction, technical problem to be solved is that to make one COF film webs be to include a pliability dielectric layer and a trace layer, this pliability dielectric layer is to have an opening, and this opening is a upper surface and a lower surface that is positioned at a wafer bonding land of this pliability dielectric layer and runs through this pliability dielectric layer, one wafer is to be arranged on this COF film webs and with this COF film webs to electrically connect, this adhesive body is to be formed between this wafer and this COF film webs and to insert this opening, to seal the plurality of bump on this wafer, connect in the finger and a plurality of second in this trace layer a plurality of first and connect finger.Can avoid stress-retained after the sealing by this opening, and can improve the exhaust effect in this thin-film flip-chip packaging construction, avoid this thin-film flip-chip packaging construction to divide fault rupture, thereby be suitable for practicality more.
Another purpose of the present utility model is, a kind of novel thin-film flip-chip packaging construction is provided, technical problem to be solved is to make its opening have at least one corner and this corner is to have an arc angle, avoid stress to concentrate on this corner and cause the fracture of this pliability dielectric layer, thereby be suitable for practicality more.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to a kind of thin-film flip-chip packaging construction that the utility model proposes, comprise: a COF film webs, it is to include a pliability dielectric layer and a trace layer, this pliability dielectric layer is to have a upper surface, an a lower surface and an opening and definition have a wafer bonding land, wherein this opening is to be positioned at this wafer bonding land and to run through this upper surface and this lower surface, this trace layer is to be formed on this pliability dielectric layer, this trace layer is to comprise a plurality of first lead-in wires and a plurality of second lead-in wire, those first lead-in wires are to have in a plurality of first to connect finger, and those second lead-in wires are to have in a plurality of second to connect finger; One wafer, it is to have plurality of bump, this wafer is to be arranged on this COF film webs, and those projections are to electrically connect those to connect in first and refer to connect finger with those in second; And an adhesive body, it is to be formed between this wafer and this COF film webs and to insert this opening, with seal those projections, those connect in first and refer to connect finger with those in second.
The purpose of this utility model and solve its technical problem and can also be able to be further achieved by the following technical measures.
Aforesaid thin-film flip-chip packaging construction, wherein said opening are to have at least one corner and this corner is to have an arc angle.
Aforesaid thin-film flip-chip packaging construction, the arc length radius of wherein said arc angle are to be 0.2 millimeter (mm).
Aforesaid thin-film flip-chip packaging construction, the width of wherein said opening are the distances that equals between those first lead-in wires and those second lead-in wires.
Aforesaid thin-film flip-chip packaging construction, the width of wherein said opening are the width less than this wafer.
The purpose of this utility model and solve its technical problem and also realize by the following technical solutions.COF film webs according to a kind of chip package that the utility model proposes, comprise: a pliability dielectric layer, it is to have a upper surface, a lower surface and an opening and define a wafer bonding land is arranged, and wherein this opening is to be positioned at this wafer bonding land and to run through this upper surface and this lower surface; And a trace layer, it is to be formed on this pliability dielectric layer, and this trace layer is to comprise a plurality of first lead-in wires and a plurality of second lead-in wire, and those first lead-in wires are to have in a plurality of first to connect finger, and those second lead-in wires are to have in a plurality of second to connect finger.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
The COF film webs of aforesaid chip package, wherein said opening are to have at least one corner and this corner is to have an arc angle.
The COF film webs of aforesaid chip package, the arc length radius of wherein said arc angle are to be 0.2 millimeter (mm).
The COF film webs of aforesaid chip package, the width of wherein said opening are the distances that equals between those first lead-in wires and those second lead-in wires.
Via as can be known above-mentioned, the utility model mainly comprises a COF film webs, a wafer and an adhesive body relevant for a kind of thin-film flip-chip packaging construction.This COF film webs is to include a pliability dielectric layer and a trace layer, this pliability dielectric layer is that definition has a wafer bonding land, this pliability dielectric layer has an opening, this opening is a upper surface and a lower surface that is positioned at this wafer bonding land and runs through this pliability dielectric layer, this wafer is to be arranged on this COF film webs and the plurality of bump of this wafer is a plurality of first lead-in wires and a plurality of second lead-in wire that electrically connects this trace layer, this adhesive body is to be formed between this wafer and this COF film webs and to insert this opening, to seal those projections, those first lead-in wires a plurality of first in connect refer to and those second lead-in wires a plurality of second in connect finger, this opening is can avoid stress-retained after the sealing and cause this pliability dielectric layer, this wafer and this adhesive body form the effect of dividing fault rupture and improving exhaust.
By technique scheme, the utility model thin-film flip-chip packaging construction has following advantage at least:
1, can avoid stress-retained after the sealing and cause this thin-film flip-chip packaging construction to divide fault rupture;
Exhaust when 2, improving sealing is coated on this adhesive body to avoid bubble;
3, this opening of the COF film webs of chip package has arc angle, can avoid stress to concentrate and causes this pliability dielectric layer fracture.
In sum, the utlity model has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing thin-film flip-chip packaging construction has the multinomial effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section of known thin-film flip-chip packaging construction.
Fig. 2 is the schematic cross-section of known another kind of thin-film flip-chip packaging construction.
Fig. 3 is according to a specific embodiment of the present utility model, a kind of schematic cross-section of thin-film flip-chip packaging construction.
Fig. 4 is according to a specific embodiment of the present utility model, the top view of the COF film webs of this thin-film flip-chip packaging construction.
100: thin-film flip-chip packaging construction 110:COF film webs
111: pliability dielectric layer 112: trace layer
113: upper surface 114: lower surface
115: the first lead-in wire 115a: connect finger in first
116: the second lead-in wire 116a: connect finger in second
120: wafer 121: active surface
122: projection 130: adhesive body
200: thin-film flip-chip packaging construction 210:COF film webs
211: pliability dielectric layer 212: trace layer
213: upper surface 214: lower surface
215: the first lead-in wire 215a: connect finger in first
216: the second lead-in wire 216a: connect finger in second
220: wafer 221: active surface
222: projection 230: adhesive body
240: supporting bracket 300: thin-film flip-chip packaging construction
310:COF film webs 311: pliability dielectric layer
312: trace layer 313: upper surface
314: lower surface 315: opening
315a: corner 316: wafer bonding land
317: the first lead-in wire 317a: connect finger in first
318: the second lead-in wire 318a: connect finger in second
319: solder mask 320: wafer
321: active surface 322: projection
Distance between 330: adhesive body D: first lead-in wire and second lead-in wire
Wi: A/F W2: wafer width
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of thin-film flip-chip packaging construction, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
See also shown in Figure 3ly, a specific embodiment of the present utility model is to disclose a kind of thin-film flip-chip packaging construction 300, mainly comprises a COF film webs 310, a wafer 320 and an adhesive body 330.This COF film webs 310 is to include a pliability dielectric layer 311 and a trace layer 312, this pliability dielectric layer 311 is to have a upper surface 313, an a lower surface 314 and an opening 315 and definition have a wafer bonding land 316, the thickness of this pliability dielectric layer 311 is to be about 20-35 micron (μ m), its material is to can be polyimides (PI), see also shown in Figure 4, in the present embodiment, this opening 315 is to be positioned at this wafer bonding land 316 and to run through this upper surface 313 and this lower surface 314, wherein this opening 315 is to have a plurality of corner 315a and those corners 315a has arc angle, avoid stress to concentrate on those corners 315a and cause 311 fractures of this pliability dielectric layer by arc angle, the arc length radius of arc angle is to be 0.2 millimeter (mm), and the width W 1 of this opening 315 is the width W 2 less than this wafer 320.This trace layer 312 is to be formed on this pliability dielectric layer 311, the thickness of this trace layer 312 is to be about 5-12 micron (μ m), this trace layer 312 is to comprise a plurality of first lead-in wires 317 and a plurality of second lead-in wire 318, those first lead-in wires 317 are to be copper with the material of those second lead-in wires 318, wherein those first lead-in wires 317 are to have to connect in a plurality of first to refer to 317a, those second lead-in wires 318 are to have to connect in a plurality of second to refer to 318a, in the present embodiment, the width W 1 of this opening 315 is to equal those first lead-in wires 317 and those second go between distance D of 318.Please consult shown in Figure 3 again, one active surface 321 of this wafer 320 is to have plurality of bump 322, those projections 322 are to be golden projection, this wafer 320 is to be arranged at this wafer bonding land 316, and those projections 322 are to electrically connect those to connect in first and refer to that 317a and those meet finger 318a in second, this adhesive body 330 is to be formed between this wafer 320 and this COF film webs 310 and to insert this opening 315, with seal those projections 322, those connect in first and refer to that 317a and those meet finger 318a in second.In addition; this COF film webs 310 is to include a solder mask 319 (solder resist) in addition; it is to be formed on this pliability dielectric layer 311 and to appear those to connect in first and refer to that 317a and those meet finger 318a in second; to protect those first lead-in wires 317 and those second lead-in wires 318; when this COF film webs 310 included this solder mask 319 in addition, the arc length radius of the arc angle of those corners of this opening was to be 0.4 millimeter (mm).This opening 315 of this COF film webs 310 is to avoid stress-retained after the sealing, and can improve the exhaust effect in this thin-film flip-chip packaging construction 300, avoids the fault rupture in 300 fens of this thin-film flip-chip packaging construction.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art are not in breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (9)
1, a kind of thin-film flip-chip packaging construction is characterized in that it comprises:
One COF film webs, it is to include a pliability dielectric layer and a trace layer, this pliability dielectric layer is to have a upper surface, a lower surface and an opening and define a wafer bonding land is arranged, wherein this opening is to be positioned at this wafer bonding land and to run through this upper surface and this lower surface, this trace layer is to be formed on this pliability dielectric layer, this trace layer is to comprise a plurality of first lead-in wires and a plurality of second lead-in wire, those first lead-in wires have in a plurality of first and connect finger, and those second lead-in wires are to have in a plurality of second to connect finger;
One wafer, it is to have plurality of bump, this wafer is to be arranged on this COF film webs, and those projections are to electrically connect those to connect in first and refer to connect finger with those in second; And
One adhesive body, it is to be formed between this wafer and this COF film webs and to insert this opening, with seal those projections, those connect in first and refer to connect finger with those in second.
2, thin-film flip-chip packaging construction according to claim 1 is characterized in that wherein this opening is to have at least one corner and this corner is to have an arc angle.
3, thin-film flip-chip packaging construction according to claim 2 is characterized in that wherein the arc length radius of this arc angle is to be 0.2 millimeter (mm).
4, thin-film flip-chip packaging construction according to claim 1 is characterized in that wherein the width of this opening is the distance that equals between those first lead-in wires and those second lead-in wires.
5, thin-film flip-chip packaging construction according to claim 1 is characterized in that the width of this opening wherein is the width less than this wafer.
6, a kind of COF film webs of chip package is characterized in that it comprises:
One pliability dielectric layer, it is to have a upper surface, a lower surface and an opening and define a wafer bonding land is arranged, wherein this opening is to be positioned at this wafer bonding land and to run through this upper surface and this lower surface; And
One trace layer, it is to be formed on this pliability dielectric layer, and this trace layer is to comprise a plurality of first lead-in wires and a plurality of second lead-in wire, and those first lead-in wires are to have in a plurality of first to connect finger, and those second lead-in wires are to have in a plurality of second to connect finger.
7, the COF film webs of chip package according to claim 6 is characterized in that wherein this opening is to have at least one corner and this corner is to have an arc angle.
8, the COF film webs of chip package according to claim 6 is characterized in that wherein the arc length radius of this arc angle is to be 0.2 millimeter (mm).
9, the COF film webs of chip package according to claim 6 is characterized in that wherein the width of this opening is the distance that equals between those first lead-in wires and those second lead-in wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620012274 CN2922126Y (en) | 2006-04-24 | 2006-04-24 | Thin-film flipchip package structure and COF thin-film winding used for flip chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620012274 CN2922126Y (en) | 2006-04-24 | 2006-04-24 | Thin-film flipchip package structure and COF thin-film winding used for flip chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2922126Y true CN2922126Y (en) | 2007-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620012274 Expired - Lifetime CN2922126Y (en) | 2006-04-24 | 2006-04-24 | Thin-film flipchip package structure and COF thin-film winding used for flip chip package |
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| CN (1) | CN2922126Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943788A (en) * | 2014-04-02 | 2014-07-23 | 京东方科技集团股份有限公司 | Flexible display device and packaging method thereof |
| WO2020062423A1 (en) * | 2018-09-30 | 2020-04-02 | 武汉华星光电技术有限公司 | Curved surface array substrate and preparation method therefor |
-
2006
- 2006-04-24 CN CN 200620012274 patent/CN2922126Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943788A (en) * | 2014-04-02 | 2014-07-23 | 京东方科技集团股份有限公司 | Flexible display device and packaging method thereof |
| CN103943788B (en) * | 2014-04-02 | 2016-04-06 | 京东方科技集团股份有限公司 | Flexible display apparatus and method for packing thereof |
| WO2020062423A1 (en) * | 2018-09-30 | 2020-04-02 | 武汉华星光电技术有限公司 | Curved surface array substrate and preparation method therefor |
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