CN207909913U - A kind of encapsulating structure of LED component - Google Patents
A kind of encapsulating structure of LED component Download PDFInfo
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- CN207909913U CN207909913U CN201820337042.8U CN201820337042U CN207909913U CN 207909913 U CN207909913 U CN 207909913U CN 201820337042 U CN201820337042 U CN 201820337042U CN 207909913 U CN207909913 U CN 207909913U
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Abstract
A kind of encapsulating structure of LED component, it includes a flip LED chips, pad in fluorescent colloid and the positive and negative electrode that is arranged on LED chip bottom surface, the fluorescent colloid is coated with top surface and the surrounding side of LED chip, further include bottom dielectric part, what the compound thin material that the bottom dielectric part is made of upper metal conducting layer and the superposition of lower insulating layer was made；The outer pad of anode, the outer pad of cathode and insulating layer block are respectively equipped on the bottom dielectric part, the outer pad of anode connect turning circuit with pad in anode, and the outer pad of the cathode connect turning circuit with pad in anode；The outer pad of the outer pad of the anode, cathode is to correspond to the spacing of pad in positive and negative electrode by upper metal conducting layer, be etched along its longitudinal direction and be formed by two unitary parts.The structure increases the spacing between the bonding area of electrode pad and electrode pad, reduces the requirement to mounted substrate flatness and mounting device precision, improves the stability that light source is made using the LED component.
Description
Technical field
The utility model is related to the technical field of LED device structure, the LED component of especially a kind of wafer-level package is sealed
Assembling structure.
Background technology
The full name of CSP is Chip Scale Package, and Chinese is meant " wafer-level package ".Using CSP packaging technologies
LED component, the features such as having fluorescent glue small, promote chip reliability, improve chip heat dissipation, save packaging cost.By
It is excessively small in the electrode pad area of wafer-level package LED component, thus it requires the flatness on mounted substrate surface is very high.Patch
When weldering, if the flatness of substrate surface not slight error occurs or subtle deviation occurs in chip mounter positioning, all can
Wafer-level package LED component is caused dry joint or easy desoldering occur so that yield rate reduces and reduce service life.And core
The spacing ten of the positive and negative electrode pad of the LED component of chip size package/small, when welding, are susceptible to short circuit.
The purpose of this utility model：To solve the above-mentioned problems, a kind of encapsulating structure of LED component is provided, it has big
The electrode pad of area, and the spacing between the outer pad of positive and negative electrode increases, and is reduced to the flatness requirement of mounted substrate.
Utility model content
The utility model is realized in this way：A kind of encapsulating structure of LED component, it includes flip LED chips, glimmering
Pad in optical cement body and the anode being symmetrical set on two side of LED chip bottom surface, pad in cathode, in anode pad with it is negative
There is certain insulation spacing between extremely interior pad, the fluorescent colloid is coated with top surface and the surrounding side of LED chip, fluorescent glue
The bottom surface of body is concordant with the bottom surface of LED chip, and in same level；
Further include bottom dielectric part, the bottom dielectric part is answered by what upper metal conducting layer and the superposition of lower insulating layer formed
Close what thin material was made；
The outer pad of anode, the outer pad of cathode and insulating layer block, the anode outside weld are respectively equipped on the bottom dielectric part
Disk connect turning circuit with pad in anode, and the outer pad of the cathode connect turning circuit with pad in anode；
The outer pad of the outer pad of the anode, cathode is to correspond to the spacing of pad in positive and negative electrode, along it by upper metal conducting layer
Longitudinal direction, which is etched, is formed by two unitary parts, and the direction at pad to fluorescent colloid edge is moved outside positive and negative electrode
Except the lower insulating layer of two sides of left and right, the exposing of metal conducting layer is made to form the welding region of outer pad.
The upper metal conducting layer is copper foil layer.
Further, the face of weld product of the outer pad of anode is more than the surface area of pad in LED chip anode；
The face of weld product of the outer pad of the cathode is more than the surface area of pad in LED chip cathode.
The length L of the insulating layer block is greater than or equal to the spacing of pad in positive and negative electrode.
A kind of encapsulating structure of LED component provided by the utility model is connected using bottom dielectric part and LED die bottom surfaces
After being connected into the LED component of integral type, it is originally that changing into bottom with circuit board welding manner by the interior pad in LED chip is situated between
Outer pad on matter part is welded with circuit board, and outer pad increases many, and positive and negative electrode outside weld than the bonding area of interior pad
The spacing of disk also increases so that the flatness requirement of mounted substrate and the precision of mounting device are wanted in LED component reduction
It asks, enhances the adhesive force of LED devices and mounted substrate, more consolidates, improve the stability for making light source using the LED component,
It is effectively reduced production cost.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural perspective of the utility model.
Specific implementation mode
The embodiment of the utility model is described in detail below in conjunction with the accompanying drawings, specific embodiment described herein is only
Only to explain the utility model, it is not used to limit the utility model.
As depicted in figs. 1 and 2, a kind of encapsulating structure of LED component, it includes a flip LED chips 1,2 and of fluorescent colloid
Be symmetrical set pad 3 in the anode on 1 bottom surface of LED chip, two side, pad 4 in cathode, in anode pad 3 in cathode
There is certain insulation spacing between pad 4, the fluorescent colloid 2 is coated with top surface and the surrounding side of LED chip 1, fluorescent glue
The bottom surface of body 2 is concordant with the bottom surface of LED chips 1, in same level；
Further include bottom dielectric part 5, the bottom dielectric part 5 is made of upper metal conducting layer and the superposition of lower insulating layer
What compound thin material was made；
The bottom dielectric part 5 is equipped with the outer pad 7 of the outer pad 6 of anode, cathode and insulating layer block 8, the anode outside weld
Disk 6 connect turning circuit with pad 3 in anode, and the outer pad 7 of the cathode connect turning circuit with pad 3 in anode.
The outer pad of the outer pad 6 of the anode, cathode 7 be by upper metal conducting layer 51 correspond to the spacing of pad in positive and negative electrode,
Be etched along its longitudinal direction and be formed by two unitary parts, and outside positive and negative electrode pad to fluorescent colloid edge side
To the lower insulating layer for removing two sides of left and right, make the exposing of metal conducting layer, to form the welding region of outer pad.
The upper metal conducting layer is copper foil layer.
Further, the face of weld product of the outer pad of the anode 6 is more than the surface area of pad 3 in LED chip anode；
The face of weld product of pad 7 is more than the surface area of pad 4 in LED chip cathode outside the cathode.
The length L of the insulating layer block 8 is greater than or equal to the spacing of pad in positive and negative electrode.
After the LED component for the formula that linked into an integrated entity using bottom dielectric part 5 and LED chip bottom surface, it is originally by LED chip
The outer pad changed on bottom dielectric part 5 of interior pad and circuit board welding manner welded with circuit board, outer pad ratio
The face of weld product of interior pad increases many, and the spacing between outer pad also increases so that the LED component is reduced to attachment
The requirement of the precision of the flatness requirement of substrate and mounting device enhances the adhesive force, more steady of LED component and mounted substrate
Gu improving the stability for making light source using the LED component, it is effectively reduced production cost.
The above-mentioned technical solution is only the preferred embodiments of the utility model.It should be pointed out that for ability
For the those of ordinary skill in domain, in the case where not departing from the utility model principle, it can also make several improvements and modification,
This is also considered as in the scope of protection of the utility model.
Claims (4)
1. a kind of encapsulating structure of LED component, it includes a flip LED chips, fluorescent colloid and is symmetrical set in LED core
Pad in anode on two side of piece bottom surface, pad in cathode, the fluorescent colloid are coated with the top surface and four sides of LED chip
Face, the bottom surface of fluorescent colloid are concordant with the bottom surface of LED chip and in same level, which is characterized in that further include bottom
Medium member, what the compound thin material that the bottom dielectric part is made of upper metal conducting layer and the superposition of lower insulating layer was made；
Be respectively equipped with the outer pad of the outer pad of anode, cathode and insulating layer block on the bottom dielectric part, the outer pad of anode and
Pad connects turning circuit in anode, and the outer pad of the cathode connect turning circuit with pad in anode；
The outer pad of the outer pad of the anode, cathode is to correspond to the spacing of pad in positive and negative electrode, along its longitudinal direction by upper metal conducting layer
Direction, which is etched, is formed by two unitary parts, and the direction at pad to fluorescent colloid edge removes a left side outside positive and negative electrode
The lower insulating layer of right two sides, makes the exposing of metal conducting layer form the welding region of outer pad.
2. a kind of encapsulating structure of LED component according to claim 1, which is characterized in that the upper metal conducting layer is
Copper foil layer.
3. a kind of encapsulating structure of LED component according to claim 1, which is characterized in that the weldering of the outer pad of anode
Connect surface area of the surface area more than pad in LED chip anode；
The face of weld product of the outer pad of the cathode is more than the surface area of pad in LED chip cathode.
4. a kind of encapsulating structure of LED component according to claim 1, which is characterized in that the length L of the insulating layer block
More than or equal to the spacing of pad in positive and negative electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820337042.8U CN207909913U (en) | 2018-03-12 | 2018-03-12 | A kind of encapsulating structure of LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820337042.8U CN207909913U (en) | 2018-03-12 | 2018-03-12 | A kind of encapsulating structure of LED component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207909913U true CN207909913U (en) | 2018-09-25 |
Family
ID=63558138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820337042.8U Active CN207909913U (en) | 2018-03-12 | 2018-03-12 | A kind of encapsulating structure of LED component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207909913U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257872A (en) * | 2018-10-23 | 2019-01-22 | 广东晶科电子股份有限公司 | A kind of Mini LED module and preparation method thereof |
| CN113039653A (en) * | 2018-11-13 | 2021-06-25 | 科锐Led公司 | Light emitting diode package |
| CN118136757A (en) * | 2024-05-10 | 2024-06-04 | 安徽泓冠光电科技有限公司 | A cylindrical blind-stick LED |
-
2018
- 2018-03-12 CN CN201820337042.8U patent/CN207909913U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257872A (en) * | 2018-10-23 | 2019-01-22 | 广东晶科电子股份有限公司 | A kind of Mini LED module and preparation method thereof |
| CN109257872B (en) * | 2018-10-23 | 2024-03-26 | 广东晶科电子股份有限公司 | Mini LED module and manufacturing method thereof |
| CN113039653A (en) * | 2018-11-13 | 2021-06-25 | 科锐Led公司 | Light emitting diode package |
| CN113039653B (en) * | 2018-11-13 | 2024-09-20 | 科锐Led公司 | Light Emitting Diode Package |
| CN118136757A (en) * | 2024-05-10 | 2024-06-04 | 安徽泓冠光电科技有限公司 | A cylindrical blind-stick LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211116 Address after: 528400 building 1-10 / building 11, first floor / building 12-15, No. 1, MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province (two business places are added, No. 6, Yucheng Third Street, Xiaolan Town, No. 1, Nantai street, Xiaolan Town) Patentee after: Zhongshan MuLinSen Electronics Co., Ltd Address before: 528415 one of the first and second floors of Building 9, No. 45, Industrial Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: Zhongshan stereoscopic Photoelectric Technology Co., Ltd |
|
| TR01 | Transfer of patent right |