CN2762357Y - Light-emitting diode device and light-emitting diode cooling device - Google Patents

Abstract

The utility model provides a light emitting diode device and light emitting diode heat abstractor. The light emitting diode device includes: a heat dissipation body having an opening; a bearing seat arranged on the heat dissipation body and provided with a first surface and a second surface, wherein the second surface is positioned on the opposite side of the first surface and is abutted against the opening of the heat dissipation body, and a cavity is formed between the second surface and the heat dissipation body; at least one LED crystal grain arranged on the first surface of the bearing seat and a cooling liquid filled in the cavity.

Description

Light-emitting diode device and light-emitting diode cooling device

technical field

The utility model relates to a light emitting diode device, in particular to a light emitting diode device with a heat dissipation structure.

Background technique

Light Emitting Diode (LED for short) is widely used in various display products because of its advantages of high brightness, small size, light weight, unbreakable, low power consumption and long life. Its light emitting principle is as follows : Apply a voltage to the diode to drive electrons and holes in the diode to combine and further generate light.

Referring to FIG. 1 for a commercially available LED 10 , it has an LED chip 11 placed on a lead frame 14 , and the LED chip 11 is electrically connected to the lead frame 14 by wires 12 . In addition, the LED 10 further includes an encapsulation material 13 covering the LED chip 11 and the lead frame 14 and exposing pins 15 for protecting the LED chip 11 and the wires 12 . Although light-emitting diodes are called cold light sources, the temperature of the central light-emitting layer can reach as high as about 400 degrees because the chip emits light and part of the energy is converted into heat. However, the packaging material used to package diodes is usually a resinous compound with heat-insulating effect, and its thermal conductivity is not good, so the heat cannot be conducted upwards by epoxy resin and dissipated to the air, but can only be slowly conducted downwards by wires .

When the heat accumulation in the light-emitting diode 10 is too high, it is easy to cause the packaging material 13 covering the light-emitting diode 10 to have different expansion degrees due to different heating, resulting in a gap between the lead frame 14 and the packaging material 13, which is easy to make air or moisture The infiltration of gas will affect the use and shorten the life, and even cause the solder joints or wires 12 to fall off in severe cases.

On the other hand, if the heat generated by the diode chip is not dissipated and continues to accumulate, the excessively high operating temperature will cause the energy gap (junction) of the light-emitting layer at the p-n junction of the light-emitting diode to collapse. In this way, the unit current can make the light-emitting diode The resulting brightness will be greatly reduced, so the luminous efficiency will be reduced or even destroyed. Because heat limits the higher current the LEDs can inject, the LEDs can't meet the standards that really set the specs.

Please refer to FIG. 2 , which shows a light emitting diode device array 50 , which is a further application of light emitting diodes. The light emitting diode device array 50 includes a plurality of light emitting diodes 10 adhered to a substrate 60 in a high-density array. Since the heat source is more concentrated, the above-mentioned degradation phenomenon of the light emitting diode crystal grains caused by the heat will not occur in the light emitting diode device array 50. more obvious in .

In order to solve the above problems and obtain higher brightness LEDs, many improved methods have been proposed by the industry. Wherein the most successful typical example is the ^Luxeon® light-emitting diode 100 of the U.S. LumiLeds company, please refer to Fig. 3, and its characteristic is to utilize the metal base 110 of relatively large area, and adopts aluminum substrate 130 as heat sink, with chip 120 produced The heat conduction to the air, only 18 LEDs can be equivalent to the brightness of 100 traditional LEDs. However, the operating current of the light emitting diode 100 is limited to about 20mA at a proper operating temperature, and has not been widely adopted due to high production cost.

In order to meet the needs of the current market, it is imperative to break through the limitation of the operating current of the LED to improve the luminous efficiency of the LED device. Therefore, developing a light emitting diode device with higher heat dissipation efficiency has become an urgent problem to be solved for light emitting diodes.

Utility model content

In view of this, the purpose of the present invention is to provide a light-emitting diode device with a heat dissipation structure, which includes a heat conductor, and the heat conductor is a heat dissipation column or a heat dissipation seat. Wherein, one end of the heat conduction body is used as a bearing seat for LED crystal grains, and the other end of the heat conduction body directly extends to a heat dissipation body, and the heat dissipation body is a high-efficiency cooling cavity. Due to the relationship between the temperature difference between the crystal grain and the heat dissipation body, the heat generated when the LED grain emits light can be quickly transferred to the outside of the LED grain through the heat conductor and the heat dissipation body. In this way, even if the LED is further improved The operating current is increased to increase the brightness, and the diode light-emitting grains can still be pushed and maintained at a suitable working temperature, effectively avoiding the deterioration of the grains.

Another object of the present utility model is to provide a light-emitting diode cooling device, which combines one or more light-emitting diode devices and one or more cooling liquid supply devices to form a liquid-cooled circulation heat dissipation system, which can more effectively improve light emission Diode heat dissipation problem.

Another object of the present invention is to provide a lighting device with high luminous efficiency, wherein the lighting device comprises the LED device with heat dissipation structure described in the present invention.

To achieve the above purpose, a light emitting diode device with a heat dissipation structure described in the present invention includes: a heat dissipation body having an open end; a substrate disposed on the heat dissipation body and having a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and abuts against the opening end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; At least one heat conductor is disposed on the substrate in a manner of penetrating the substrate, and the heat conductor has an extension portion and a bearing portion, wherein the extension portion is located in the first cavity; and at least one light emitting diode die, It is arranged on the bearing part of the heat conductor.

In addition, according to the light emitting diode device with heat dissipation structure described in the present invention, it may also include: a heat dissipation body with an opening; a bearing seat, arranged on the heat dissipation body, with a first surface and a second surface, Wherein the second surface is located on the opposite side of the first surface and abuts against the opening of the heat dissipation body, and a cavity is formed between the second surface and the heat dissipation body; at least one light emitting diode crystal grain is arranged on the heat dissipation body The first surface of the bearing base and a coolant are filled in the cavity.

In the light emitting diode device described in the present invention, the heat dissipation body has a plurality of engaging parts for fixing the supporting seat.

The light emitting diode device described in the present invention further includes a circuit board electrically connected to the light emitting diode crystal grain.

In the light emitting diode device described in the present invention, the bearing seat has a through hole directly below the light emitting diode grain, the light emitting diode grain completely covers the through hole, and the bottom of the light emitting diode grain is Contact with the cooling liquid through the through hole.

In the light emitting diode device described in the present invention, the first surface of the bearing seat is a plane.

According to the light emitting diode device of the present invention, the first surface of the bearing base has a recessed part, and the light emitting diode crystal grain is located on the recessed part.

According to the light emitting diode device of the present invention, the first surface of the bearing seat has a protruding part, and the light emitting diode crystal grain is located on the protruding part.

In the light emitting diode device described in the present invention, the heat dissipation body extends from the lower side of the bearing seat to the upper side around the light emitting diode crystal grain.

According to the light-emitting diode device described in the utility model, there is 5% to 20% air in the cavity of the heat dissipation body.

In the light emitting diode device described in the utility model, the heat dissipation body is integrally formed with the bearing seat.

According to the light-emitting diode device described in the utility model, there is 5% to 50% air in the cavity of the heat dissipation body.

In order to achieve another purpose of the utility model, the utility model is to provide a light emitting diode cooling device, which includes: one or more coolant supply devices; and one or more light emitting diode devices with heat dissipation structure, the A light emitting diode device with a heat dissipation structure communicates with the cooling liquid supply device. Wherein, the LED devices with heat dissipation structure respectively include: a heat dissipation body having an open end and communicating with the cooling liquid supply device; a substrate arranged on the heat dissipation body and having a first surface and a first Two surfaces, wherein the second surface is located on the opposite side of the first surface, and abuts against the opening end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body, wherein the cooling The liquid supply device is to supply a cooling liquid into the first cavity; at least one heat conductor is arranged on the substrate in the manner of penetrating the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part located in the first cavity; and at least one light emitting diode crystal grain disposed on the bearing portion of the heat conductor.

According to the light-emitting diode device with heat dissipation structure described in the present utility model, wherein the plurality of light-emitting diode devices with heat dissipation structure utilize at least one circulation pipeline and the cooling liquid supply device (various types of water tanks, buckets, water tanks, Example steam, locomotive cooling water tank) connected. In addition, the cooling liquid supply device is a cooling liquid tank with a pressurized pump or an injection cooling liquid tank, or it can be a closed self-circulation system without external power that only uses the heat energy absorbed by the cooling liquid to generate pressurized kinetic energy .

In the light-emitting diode cooling device described in the utility model, the cooling liquid tank is arranged at a position higher than the light-emitting diode device.

In the light-emitting diode heat dissipation device described in the utility model, the cooling liquid tank communicates with the heat dissipation body through a circulation pipeline.

The light-emitting diode cooling device described in the utility model further includes a booster pump or a self-circulation system without external power, which communicates with the cooling liquid tank and the light-emitting diode device.

In the light-emitting diode heat dissipation device described in the utility model, the heat dissipation body has a plurality of engaging parts for fixing the supporting seat.

The LED cooling device described in the present invention further includes a circuit board electrically connected to the LED die.

In the light-emitting diode cooling device described in the utility model, there is a through hole directly below the light-emitting diode grain that runs through the bearing seat, the light-emitting diode grain completely covers the through-hole, and the bottom of the light-emitting diode grain is Contact with the cooling liquid through the through hole.

In the light-emitting diode cooling device described in the utility model, the first surface of the bearing seat is a plane.

In the light emitting diode cooling device described in the utility model, the first surface of the supporting base has a recessed portion, and the light emitting diode crystal grain is located on the recessed portion.

In the light-emitting diode cooling device described in the utility model, the first surface of the bearing seat has a protruding part, and the light-emitting diode crystal grain is located on the protruding part.

In the light emitting diode heat dissipation device of the present invention, the heat dissipation body extends from the lower side of the bearing seat to the upper side around the light emitting diode crystal grains.

According to the light-emitting diode cooling device described in the utility model, there is 5% to 20% air in the cavity of the cooling body.

In the light-emitting diode heat dissipation device described in the utility model, the heat dissipation body is integrally formed with the bearing seat.

According to the light-emitting diode cooling device described in the utility model, there is 5% to 50% air in the cavity of the cooling body.

To achieve another objective of the present utility model, the utility model provides a lighting device, which includes: a control unit; and at least one light emitting diode device with a heat dissipation structure, electrically connected to the control unit. Wherein, the light-emitting diode device with heat dissipation structure respectively includes: a heat dissipation body with an open end; a substrate, arranged on the heat dissipation body, with a first surface and a second surface, wherein the second surface is located on the The opposite side of the first surface is in contact with the opening end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least one heat conductor is arranged on the substrate in a manner penetrating through the substrate on the substrate, and the heat conductor has an extension part and a bearing part, wherein the extension part is located in the first cavity; and at least one LED die is arranged on the bearing part of the heat conductor, wherein the control The unit is to turn on or off the LED die.

According to the light emitting diode device with heat dissipation structure of the present invention, it may further include a cooling liquid filled in the cavity. In addition, at least a portion of the extension of the heat conductor may be in contact with the cooling liquid.

According to the light emitting diode device with heat dissipation structure of the present invention, it may further include a lens formed on the first surface, wherein the lens forms a second cavity with the first surface, and the second cavity includes at least one LED die.

According to the light-emitting diode device with heat dissipation structure of the present invention, it further includes a predetermined printed, coated pure silver or pure copper high-thickness, high-conductivity circuit pattern formed on the first surface of the substrate and connected with the The LEDs are electrically connected.

Description of drawings

1 is a schematic diagram illustrating a cross-sectional structure of a known light-emitting diode device;

FIG. 2 is a top view illustrating a known light emitting diode device array;

3 is a schematic cross-sectional view showing a known light-emitting diode device with a heat dissipation structure;

4a to 4l are schematic cross-sectional structure diagrams illustrating the light emitting diode device according to the preferred embodiment of the present invention;

5a to 5h are schematic diagrams illustrating the relative relationship between the heat dissipation column and the substrate of the light emitting diode device described in the present invention;

6a to 6y are three-dimensional cross-sectional views illustrating a heat dissipation body having a geometric shape according to the present invention;

Figures 7a to 7y are cross-sectional views of the heat dissipation body having a geometric shape corresponding to Figures 6a to 6y;

FIG. 8 is a three-dimensional assembly diagram illustrating the arrayed light-emitting diode device described in Embodiment 1 of the present invention;

Fig. 9a and Fig. 9b are diagrams illustrating the steps of bonding the light-emitting diode die to the bearing surface of the heat dissipation column described in Embodiment 1 of the present utility model;

FIG. 10 is a three-dimensional assembly diagram illustrating the arrayed light-emitting diode device described in Embodiment 2 of the present invention;

Fig. 11a is a block diagram showing a light-emitting diode cooling device according to a preferred embodiment of the present invention;

Fig. 11b is a perspective view showing a light-emitting diode cooling device according to a preferred embodiment of the present invention;

Fig. 12 is a block diagram illustrating a display device according to a preferred embodiment of the present invention;

Fig. 13 is a schematic diagram illustrating a display device according to a preferred embodiment of the present invention;

Fig. 14 is a schematic perspective view showing a car light system according to a preferred embodiment of the present invention;

15 to 18 are schematic cross-sectional structural diagrams illustrating the light emitting diode device according to the preferred embodiment of the present invention;

FIG. 19 and FIG. 20 are block diagrams illustrating the LED cooling device according to the preferred embodiment of the present invention.

Detailed ways

In order to make the above-mentioned and other purposes, features, and advantages of the present utility model more obvious and understandable, the preferred embodiments are specifically listed below, and are described in detail as follows in conjunction with the accompanying drawings:

Light emitting diode device with heat dissipation structure

The utility model discloses a light-emitting diode device with a heat dissipation structure. The light-emitting diode device has excellent heat dissipation capability and can avoid problems such as low luminous efficiency and grain deterioration of light-emitting diodes caused by poor heat conduction efficiency of known light-emitting diode devices.

First, please refer to FIGS. 4a and 4b, which show a single-chip LED device 200 (ie, 200A, 200B, 200C, 200D, 200E) according to the present invention to illustrate the basic structure of the present invention. The LED device 200 includes an LED die 210 , a plurality of heat conductors 220 , a substrate 230 , a heat dissipation body 240 , and an optical lens 250 .

The heat conductor 220 is divided into a carrying portion 222 and an extending portion 224 . The extension portion 224 is a portion of the heat conductor 220 protruding downward from the second surface 233 of the substrate 230 , please refer to FIG. 5 a . The carrying portion 222 is used to place the LED die 210 . The substrate 230 has a first surface 231 and a second surface 233 , and the second surface 233 is located on the opposite side of the first surface 231 . The substrate 230 further includes a through hole 234 , and the through hole 234 penetrates from a first surface 231 of the substrate to the second surface 233 . The heat conductor 220 passes through the substrate 230 through the through hole 234 , and is disposed on the substrate 230 in a manner of penetrating the substrate 230 , with its extension portion 224 on the same side as the second surface 233 of the substrate. The LED device 200 can have a single or multiple LED dies 210 . The heat conductor 220 can be designed as a strip-shaped heat conduction column (as shown in Figure 4a to Figure 4c), a ring-shaped heat conduction column (as shown in Figure 4d to Figure 4f), a m-shaped heat conduction column (as shown in Figure 4g to Figure 4i ), or a strip-shaped heat conduction column (as shown in Figure 4j to Figure 4l), if the heat conductor 220 is an annular heat conduction column, a rice-shaped heat conduction column or a strip-shaped heat conduction column, the heat conductor 220 can simultaneously have multiple light-emitting The diode dies 210 are arranged in a linear arrangement (one-dimensional array) on a carrying surface 227 of the carrying portion 222 thereof.

One of the main functions of the substrate 230 is to fix the heat conductor 220, and the first surface 231 of the substrate 230 can have a patterned circuit 236, which can be electrically connected with the LED die 210 by wires, as its drive circuit. In the LED device 200, the substrate 230 is in contact with the heat dissipation body 240 with the second surface 233, and the substrate 230 and the heat dissipation body 240 form a completely sealed cavity 260, wherein the heat conductor 220 The extension part 224 is disposed in the cavity 260 . In the light emitting diode device of the present invention, the cavity 260 may further contain a fixed amount of cooling liquid 280 , the purpose of which is to accelerate the heat dissipation from the diode die 210 to the heat conductor 220 more quickly.

According to the light-emitting diode device described in the present utility model, the bearing part 222 and the extension part 224 of the heat conductor 220 both have high heat conduction ability, and can be made of the same or different heat conduction materials respectively, wherein the heat conduction The material can be, for example, metals such as silver, copper, aluminum or alloys thereof, ceramic composite materials, metal oxides or mixtures thereof. The heat dissipation body can be formed by stamping, die-casting, powder metallurgy, injection, lathe processing or welding. The carrying portion 222 has a carrying surface 227 with an area of 0.5-2mm ² , and the carrying portion 222 may further include a reflective layer 228 formed thereon, please refer to FIG. 5d and FIG. 5g, wherein the reflective layer may be gold , silver, aluminum, silicon, copper, chromium, titanium, tungsten or molybdenum and other metals or their alloy materials. The present invention has no limitation on the type of LED crystal grains 210 used, which can be blue light, green light, red light, white light or electroluminescent light emitting diodes. Since the main heat dissipation path of the present invention is the heat conductor 220 rather than the substrate 230, the present invention has no limitation on the selection of the type of the substrate 230, it can be a general printed circuit board, and the substrate can deposit a A reflective layer, such as a silver layer. The heat dissipation column is arranged on the substrate in a manner that penetrates the substrate, and the relative relationship between the heat conductor 220 and the substrate 230 is not limited, and can be adjusted as required. Please refer to FIG. 5a to FIG. 5c and 5e. Show. In addition, the width of the extending portion 224 of the heat conductor 220 can be greater than the width of the through hole, as shown in FIG. 5f and FIG. 5h . The carrying surface 227 can be a plane or a concave surface.

In addition, the heat dissipation body 240, such as a heat dissipation cup, can further have a plurality of protrusions, which can be formed on the inside or outside of the heat dissipation body, wherein the material of the heat dissipation body 240 can be silver, copper, tungsten, Nickel, silicon, aluminum, molybdenum, ceramic composites, diamond-like carbon materials, metal oxides or mixtures thereof. The utility model has no further limitation on the shape of the heat dissipation body, which can be a cylinder or a cube with an opening.

In addition, the geometric heat dissipation body 240, such as a heat dissipation bucket, can further have various high heat dissipation geometric shapes to highlight the heat transfer energy of phonons, free electrons, and holes in metal materials. The material can be silver, Copper, aluminum, ceramic composites, metal oxides or mixtures thereof. The geometric heat dissipation body described in the present invention can have many kinds of changes, as shown in Figure 6a to Figure 6y, it can be preferably divided into four types: round barrel, tetrahedron barrel, polyhedron barrel, ellipse barrel and so on. Large shape, and the heat dissipation body can also have one or more retracted holes. Please refer to Fig. 6a to Fig. 6y, which are three-dimensional cross-sectional views of 25 kinds of heat dissipation bodies with geometric shapes according to the utility model, and please refer to Fig. 7a to Fig. 7y, which are the corresponding cross-sections of Fig. 6a to Fig. 6y picture. The cooling body with a geometric shape described in the utility model can be enlarged, reduced, and changed in height due to the working environment and power requirements. In addition, the liquid level of the injected cooling liquid 280 in the cavity 260 is preferably in contact with the cooling post 220 or various heat-conducting seats, and it is more preferable if it is in contact with the second surface 233 of the substrate 230 . In the present utility model, the applicable cooling liquid 280 can be various high endothermic liquids such as water, organic solution, liquid hydrocarbon, liquid helium, liquid nitrogen, wherein the organic solution can be, for example, alcohols, alkanes, ethers, etc. class or ketones.

The following example 1 is specifically cited, and an array-type light-emitting diode device is taken as an example to illustrate the manufacturing method of the light-emitting diode device with a heat dissipation structure described in the present utility model, and further measure its photoelectric properties, in order to make the utility model The characteristics and advantages of are more clear:

Example 1:

Please refer to FIG. 8 , which is an assembly diagram showing an array LED device 300 . Firstly, 20 cylindrical aluminum heat conductors 310 are taken, and a light-emitting diode die 320 (produced by Taiwan Guangga Corporation, model 514) is fixed on the bearing surface 312 on each heat dissipation column. The cylindrical heat dissipation column has a length of 25 mm and a diameter of 1.5 mm. The diameter of the light-emitting diode grain 320 is 14mil, and when its driving power is 20mA, its luminous brightness is 40-50mcd. The method of fixing the light emitting diode die 320 to the bearing surface 312 on the heat dissipation column includes the following steps: firstly, on the bearing surface 312, a plurality of grooves 313 with a length of about 3-6 mils and a width of about 0.1-2.0 mils are formed. , see Figure 9a. Next, an adhesive (or solder) is formed in the groove, and the LED die 320 is fixed on the carrying surface 312 by the adhesive (or solder), see FIG. 9 b. Using the above steps to bond the LED die 320 can not only increase the bonding strength between the die 320 and the bearing surface 312 , but also maintain a good heat conduction effect.

Next, take a 40*40mm printed circuit board 330 on which a circuit pattern has been completed. The thickness of the printed circuit board is 2 mm, and there are 20 through holes 332 on it, and the diameter of each through hole is 1.5 mm. Next, the above-mentioned cooling column passes through the substrate 330 through the through hole, and is disposed on the substrate 330 in a manner of penetrating the substrate 330 . Wherein, the supporting surface 312 of the heat conductor 310 is approximately aligned with the top 334 of the substrate 330 , and the rest of the heat conductor 310 exposes the bottom 336 of the substrate 330 . After completing the setting of the heat dissipation column, the light-emitting diode chip and the circuit pattern are electrically connected with gold wires.

Next, a heat dissipation body 340 is provided, such as a square heat dissipation barrel made of copper, silver, or aluminum, with an inner volume of 30ml. Next, take cooling liquid with a volume of 90-97% of the volume of the heat dissipation body and add it to the heat dissipation body 340, and fix the heat dissipation body 340 to the bottom of the substrate 330, so that the exposed part of the heat conductor 310 is completely covered by the heat dissipation body. Covered by the heat dissipation body 340 . Finally, a projection optical lens 360 is formed on the top 334 of the substrate 330 to cover the LED die 320, wherein the optical lens 360 is kept at a specific distance from the LED die, and the specific distance is not Less than 0.5mm. So far, the arrayed LED device 300 of the present invention is completed.

In order to further verify the excellent heat dissipation capability of the light-emitting diode device 300 with a heat dissipation structure described in the present invention, the array-type light-emitting diode device obtained from 20 crystal grains in Example 1 is tested with different operating voltages and currents. After being bright for eight hours, the brightness and the operating temperature of the crystal grains were measured, and the results are shown in Table 1.

Table 1 Operating voltage (V) Operating current (mA) Brightness (Start) (W) Brightness (after eight hours of lighting) (W) Brightness decay (%) Grain temperature (8 hours after lighting) (°C) 3.0 200(10/single) 3.5 3.4 <3 twenty three 3.3 400(20/single) 5 4.76 <5 29～33 3.6 800(40/single) 15 13.6 <10 40～50

When the LED grains are combined in multiple grains, it is easy to cause the working temperature of the LED grains to be too high due to the excessive concentration of heat sources and the reduction of the average heat dissipation area of each diode grain, which will cause a decrease in luminous efficiency and even cause the LED grain deterioration. The original maximum applicable current range of a single LED chip used in Example 1 is 20mA. In the above test, when the operating voltage is increased to 3.6V, each grain is lit up with twice the current (40mA) under normal conditions, so the operating current in Table 1 can reach 20×40=800mA . At this time, the operating temperature of the LED grain is still within the normal operating temperature range (80°C) of the LED. It can be seen from this that the LED device with a heat dissipation structure described in the present invention has an advantageous heat dissipation mechanism, which can quickly Conduct heat outside the diode die.

Example 2:

Carry out in the same manner as in Example 1, but replace the 20 cylindrical aluminum heat conductors 310 with 3 annular heat conductors (25mm-85mm in length, 0.5mm, 1.0mm and 1.5mm in diameter, And the thickness of the ring piece is 0.1mm˜0.5mm), and the bearing surface 312 of each ring-shaped heat conductor is fixedly bonded with 3, 7 and 10 light-emitting diode crystal grains 320 respectively. In addition, the square cooling bucket is replaced with a round cooling bucket, as shown in FIG. 10 .

LED cooling device

The utility model also relates to a light-emitting diode cooling device according to the second law of thermodynamics: the one-way flow law that heat will never automatically flow from cold objects to hot objects, and the basic concept of a heat engine, heat can be obtained by flowing from high temperature to low temperature Mechanical work, while the heat engine does work when it operates between the two temperatures of T _hot and T _cold , that is, the theory that the temperature difference after the action of the heat sink of the heat dissipation body is used as the internal energy or work of the automatic cycle, which is to use At least one light-emitting diode device with heat sink structure described in the present invention communicates its heat-radiating body with a cooling liquid supply device through at least one circulation pipeline, so as to achieve the purpose of circulating cooling the light-emitting diode device. Please refer to FIG. 11 a and FIG. 11 b , which are block diagrams showing a preferred embodiment of the LED heat sink 400 of the present invention. In this preferred embodiment, the LED cooling device includes four LED devices 300, a cooling liquid circulation pipeline 410, a hot water curved circulation pipe 410A pressurized after the temperature is raised, and a cooling liquid supply device 420 , and the coolant supply device 420 provides a coolant 430 to circulate in the system formed by the heat dissipation body 340 and the circulation pipelines 410 and 410A of the LED device 300 . Wherein the cooling liquid supply device can be a cooling liquid tank containing a pressurized pump or an injection cooling liquid tank or a closed self-circulation system without external power that only utilizes the heat energy absorbed by the cooling liquid to generate pressurized kinetic energy. Among them, the curved hot water circulation pipe 410A, which is pressurized after the temperature is raised, can control the energy point for pressurization and heating during circulation, and has the special function of cooling while circulating.

The light-emitting diode heat dissipation device described in the utility model can be further applied to the integration of vehicle-use light-emitting diode lighting equipment, such as headlights, fog lamps, Turning lights and brake lights or lighting systems for household and people's livelihood only need to be combined with a pressurized water tank, or use the pressurized kinetic energy of the thermal expansion of the coolant to form an automatic circulation system.

lighting device

Please refer to FIG. 12 , the light emitting diode device 300 with a heat dissipation structure described in the present invention can further utilize a circuit 510 to be electrically connected with a control unit 520 to form a lighting device 500, which can be, for example, an indoor lamp, a large outdoor lamp, etc. lights, projection lights, traffic lights, street lights and car lights. Wherein, the control unit is used to turn on or off the LED chip of the LED device, such as a switch. Please refer to FIG. 13 , which is a schematic diagram of a preferred embodiment of the lighting device 500 described in the present invention. The lighting device 500 can be, for example, a car lamp, which has a plurality of LED devices 300 with a heat dissipation system structure, and It is arranged on a control unit 520 , and the control unit 520 is electrically connected with the LED device 300 through the circuit 510 . In addition, the lighting device 500 has a wide-angle lampshade 530 with a plurality of protruding lens parts 540 thereon, which can increase the illumination angle of the LED devices 300 . In addition, please refer to FIG. 14 , which shows a car light system 600 combined with a light emitting diode device 300 and a mesh radiator radiator 610 for a vehicle.

In summary, the light-emitting diode device with heat dissipation system structure described in the present invention, no matter it uses a closed or circulating liquid cooling system, it uses various heat-conducting seats or heat-conducting seats as light-emitting diode chips. The column absorbs the heat generated by the light-emitting diode chip with the cooling liquid in the first time, and then transmits the heat to the heat dissipation body, and dissipates it directly into the environment. In this way, under the premise of keeping the LED at a normal operating temperature, the LED can be driven with a higher current to exert higher power.

In addition, the traditional LED device uses a large-area metal substrate as the heat dissipation component of the LED device. However, the substrate also has a plurality of wires (usually gold wires) for electrical connection with the LED die. Therefore, when the substrate absorbs the heat generated by the crystal grains and the temperature rises, the excessively high temperature will cause the wires on the substrate to fall off or even break. The light-emitting diode device with heat dissipation structure of the utility model utilizes different components to conduct multiple heat conduction or heat dissipation, thus avoiding the problems caused by the known technology.

Please refer to FIG. 15 , which shows a light emitting diode device 700 with a heat dissipation structure according to another preferred embodiment of the present invention. The LED device 700 has a heat dissipation body 701 , a carrier 702 , a cavity 703 , a plurality of LED chips 704 , and a cooling liquid 705 . Wherein, the heat dissipation body 701 has an opening, and the bearing seat has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface.

The bearing seat 702 is arranged on the heat dissipation body 701, and abuts against the opening of the heat dissipation body 701, and the second surface of the bearing seat 702 forms a cavity 703 with the heat dissipation body, and the cooling liquid 705 is filled in the cavity 703 . In the present invention, the injection method of the cooling liquid 705 is not particularly limited, it can be injected through the opening at the beginning, or injected through an injection port of the cooling body 701 . Here, the heat dissipation body 701 may have a plurality of engaging portions 708 for fixing the bearing seat 702 . In addition, in terms of design, the heat dissipation body 701 and the bearing seat 702 can also be integrally formed. The plurality of LED chips 704 are disposed on the first surface of the carrier 702. It should be noted that the first surface of the carrier 702 can be a plane (as shown in FIG. 15 ), and the first The surface can also have a depression (as shown in FIG. 16 ) or a protrusion (as shown in FIG. 17 b ), and the LED die 704 can be disposed on the surface of the depression or the protrusion. The plurality of LED dies 704 can be electrically connected to a circuit board 706 by wires 707 .

Please refer to FIG. 17a and FIG. 17b. In some preferred embodiments of the present invention, the heat dissipation body is U-shaped in design, that is, the heat dissipation body 701 extends from the bottom of the bearing seat 702 to the top around the LED die 704. , to increase the heat dissipation efficiency, the reason is that when the light-transmitting cover covers and seals the LED die, since the heat energy will be concentrated on the upper side of the LED die 704 instead of under the bearing seat 702, by extending to the light-emitting The coolant in the heat dissipation body 701 above the diode grain 704 can absorb heat more quickly and effectively. In addition, please refer to FIG. 18 , a through hole 710 can be formed directly below the light emitting diode die 704 , passing through the carrier 702 , and the light emitting diode die 704 completely covers the through hole (that is, the through hole 710 is enclosed by the LED die 704). The purpose of designing the through hole is to make the bottom of the LED chip contact with the cooling liquid through the through hole, so as to increase the heat dissipation efficiency. In the design of the diode chip, the conductive part can be made on the top, or the bottom of the diode chip (such as the silicon substrate) can be made non-conductive, so the luminous efficiency of the LED chip will not be affected.

Please refer to FIG. 19 , which is a block diagram showing a light emitting diode device 800 with a heat dissipation structure according to another preferred embodiment of the present invention. In this preferred embodiment, the LED cooling device 800 includes the LED device 700, a cooling fluid circulation pipeline 730 and a cooling fluid tank 720, and the cooling fluid tank utilizes the cooling fluid circulation pipeline 730 and the cooling fluid circulation pipeline 730 The light emitting diode device 700 communicates. The cooling liquid tank 720 utilizes the heat convection principle, so that the heat dissipation body and the circulation pipeline 730 of the LED device 700 form an internal circulation system. It is worth noting that the cooling liquid tank 720 is preferably disposed at a higher position than the LED device in order to facilitate heat convection and increase heat dissipation efficiency.

In addition, please refer to FIG. 20 , the light emitting diode device 900 with a heat dissipation structure described in the present invention can be further equipped with a booster pump or a self-circulation system 740 without external power to communicate with the cooling liquid tank and the light emitting diode device , so that the heat dissipation efficiency can be greatly increased.

In addition, 5%-50% of air can be filled in the cavity of the heat dissipation body in the above-mentioned embodiments, and the preferred embodiment is 5%-20%. Taking Fig. 17a and Fig. 17b as examples, when extending When there is air in the cavity of the cooling body above the light emitting diodes, not only can the heat circulation speed of the cooling liquid be accelerated, but also the cavity of the cooling body can be prevented from bursting due to the thermal expansion caused by the heat absorption of the cooling liquid.

The above description is only a preferred embodiment of the present utility model, but it is not intended to limit the scope of the present utility model, any person familiar with this technology, without departing from the spirit and scope of the utility model, can Further improvements and changes are made, so the protection scope of the present utility model should be determined by the scope defined in the claims of the present application.

A brief description of the symbols in the drawings is as follows:

LEDs: 10

LED chips: 11

Wires: 12

Package material: 13

Lead frame: 14

Pins: 15

Array of LED devices: 50

Substrate: 60

LEDs: 100

Metal base: 110

Radiator: 130

LED units: 200

LED grains: 210

Cooling column: 220

Bearing part: 222

Extension: 224

Bearing surface: 227

Reflective layer: 228

Substrate: 230

First surface: 231

Second surface: 233

Through hole: 234

Patterned circuits: 236

Cooling body: 240

Body wall of cooling body: 241

Lens: 250

Cavity: 260

Coolant: 280

Array LED device: 300

Various shapes of heat conduction seat or heat conduction column: 310

Bearing surface: 312

Groove: 313

Adhesive: 314

LED grains: 320

PCB: 330

Through hole: 332

PCB Top: 334

PCB Bottom: 336

Cooling body: 340

Optical lens: 360

LED cooling device: 400

Circulation pipeline: 410

Coolant supply device: 420

Coolant: 430

Lighting fixtures: 500

Circuit: 510

Control unit: 520

Wide Angle Shade: 530

Lens part: 540

Headlight system: 600

Mesh type car cooling water tank: 610

LED units: 700

Cooling body: 701

Bearing seat: 702

Cavity: 703

LED Die: 704

Coolant: 705

Circuit board: 706

Wire: 707

Fitting part: 708

Through hole: 710

Cooling tank: 720

Circulation line: 730

Booster pump or self-circulating system without external power: 740

LED cooling device: 800, 900

Claims (25)

1, a kind of light-emitting diode assembly is characterized in that described light-emitting diode assembly comprises:

One heat radiator body has an opening;

One load bearing seat is arranged on this heat radiator body, has a first surface and a second surface, and wherein this second surface is positioned at the opposition side of this first surface, and with the opening butt of this heat radiator body, and be to constitute a cavity between this second surface and this heat radiator body;

At least one LED crystal particle is arranged on the first surface of this load bearing seat; And

One cooling fluid is filled in this cavity.

2, light-emitting diode assembly according to claim 1 is characterized in that: this heat radiator body has a plurality of holding sections, to fix this load bearing seat.

3, light-emitting diode assembly according to claim 1 is characterized in that: more comprise a circuit board, this this LED crystal particle of circuit board electrically connect.

4, light-emitting diode assembly according to claim 1, it is characterized in that: this load bearing seat be positioned at this LED crystal particle under locate to have a perforation, this LED crystal particle is to cover fully on this perforation, and the bottom of this LED crystal particle is to contact with this cooling fluid by this perforation.

5, light-emitting diode assembly according to claim 1 is characterized in that: the first surface of this load bearing seat is to be the plane.

6, light-emitting diode assembly according to claim 1 is characterized in that: the first surface of this load bearing seat is to have a depressed part, and this LED crystal particle is to be positioned on this depressed part.

7, light-emitting diode assembly according to claim 1 is characterized in that: the first surface of this load bearing seat is to have a protuberance, and this LED crystal particle is to be positioned on this protuberance.

8, light-emitting diode assembly according to claim 1 is characterized in that: this heat radiator body is the top around this load bearing seat below extends to this LED crystal particle.

9, light-emitting diode assembly according to claim 8 is characterized in that: have 5% to 20% air in the cavity of this heat radiator body.

10, light-emitting diode assembly according to claim 1 is characterized in that: this heat radiator body is to be formed in one with this load bearing seat.

11, light-emitting diode assembly according to claim 1 is characterized in that: have 5% to 50% air in the cavity of this heat radiator body.

12, a LED radiating device is characterized in that described LED radiating device comprises:

One cooling liquid bath; And

At least one light-emitting diode assembly is communicated with this cooling liquid bath;

Wherein, this luminous second tube sheet device comprises:

One heat radiator body has an opening;

One load bearing seat is arranged on this heat radiator body, has a first surface and a second surface, and wherein this second surface is positioned at the opposition side of this first surface, and with the opening butt of this heat radiator body, and be to constitute a cavity between this second surface and this heat radiator body;

At least one LED crystal particle is arranged on the first surface of this load bearing seat; And

One cooling fluid is filled in this cavity.

13, LED radiating device according to claim 12 is characterized in that: this cooling liquid bath is to be configured in the position high than this light-emitting diode assembly.

14, LED radiating device according to claim 12 is characterized in that: this cooling liquid bath is to utilize a circulation line to be communicated with this heat radiator body.

15, LED radiating device according to claim 12 is characterized in that: more comprise the self-circulation system of a force (forcing) pump or external power-free, be communicated with this cooling liquid bath and this light-emitting diode assembly.

16, LED radiating device according to claim 12 is characterized in that: this heat radiator body has a plurality of holding sections, to fix this load bearing seat.

17, LED radiating device according to claim 12 is characterized in that: more comprise a circuit board, this this LED crystal particle of circuit board electrically connect.

18, LED radiating device according to claim 12, it is characterized in that: have a perforation under this LED crystal particle and run through this load bearing seat, this LED crystal particle is to cover fully on this perforation, and the bottom of this LED crystal particle is to contact with this cooling fluid by this perforation.

19, LED radiating device according to claim 12 is characterized in that: the first surface of this load bearing seat is to be the plane.

20, LED radiating device according to claim 12 is characterized in that: the first surface of this load bearing seat is to have a depressed part, and this LED crystal particle is to be positioned on this depressed part.

21, LED radiating device according to claim 12 is characterized in that: the first surface of this load bearing seat is to have a protuberance, and this LED crystal particle is to be positioned on this protuberance.

22, LED radiating device according to claim 12 is characterized in that: this heat radiator body is the top around this load bearing seat below extends to this LED crystal particle.

23, LED radiating device according to claim 22 is characterized in that: have 5% to 20% air in the cavity of this heat radiator body.

24, LED radiating device according to claim 12 is characterized in that: this heat radiator body is to be formed in one with this load bearing seat.

25, LED radiating device according to claim 12 is characterized in that: have 5% to 50% air in the cavity of this heat radiator body.

Images