CN2752774Y - Exposed thin film probe - Google Patents

Abstract

The utility model relates to an expose type film probe, a subassembly for testing utensil array conductive contact structure, be provided with the several conductive contact on each subassembly, it includes a film structure to expose type film probe, be provided with the several busbar on its surface, busbar one end sets up on film structure one side, and be provided with a conductive area on each busbar, it comprises the electrically conductive lug of number, the conductive area provides and connects a test machine, and the busbar other end extends outside the film structure opposite side, and contact with each conductive contact, in order to utilize the test machine to test the subassembly of utensil array conductive contact structure. The utility model discloses outside extending the busbar to the thin film structure surface, can be applied to the subassembly of the electrically conductive contact structure of test utensil array to reducible test time and cost make the test simple change.

Description

Exposed Thin Film Probes

technical field

The utility model relates to a thin film probe, in particular to an exposed thin film probe.

Background technique

An array refers to a series of objects of the same structure arranged in an equidistant or unequal manner. An array with a single column is called a one-dimensional array, and an array with vertical and horizontal columns is called a two-dimensional array. Nowadays, many components are also structurally This kind of array conductive contact structure has already appeared, such as Ball Grid Arrays (BGA), conductive pads on chips (Chip), etc., and the test effect is achieved by testing the conductive pads on it.

When it is time to test the wafer (Wafer), each die on the chip will be needle-tested, and the probe (probe) made of gold wire as thin as a hair will be used to contact the pad on the die. Test its electrical characteristics, the unqualified die will be marked, and then when the chip is cut into independent dies according to the die, the marked unqualified die will be eliminated, and the next one will not be carried out. process, so as not to increase the manufacturing cost.

A component with an array structure is usually provided with a few conductive contacts, such as the grains on the above-mentioned chip. However, when testing such a component with an array structure in the past, traditional probes can only detect a few conductive contacts on the edge of the array. The conductive contact in the middle is not easy to test. If a comprehensive test is to be carried out, the manufactured probe card is expensive and difficult to maintain, which increases the test cost a lot.

Contents of the invention

The main purpose of this utility model is to provide an exposed thin film probe, which extends the conductive strip to the side of the thin film structure, so that the conductive strip is in contact with the conductive contacts on the component with an array structure, so that the thin film probe can be used For testing components with array structures.

Another object of the present invention is to provide an exposed thin film probe that can test multiple conductive contacts at one time, thereby shortening the testing time and reducing the cost.

The above-mentioned object of the utility model is achieved in this way, an exposed thin film probe is used to connect a testing machine to test a component with an array conductive contact structure, and several conductive contacts are arranged on the component, and the exposed thin film probe The needle includes a thin film structure, and several conductive strips are arranged on its surface. It is characterized in that: one end of each conductive strip is arranged on one side of the thin film structure, and each conductive strip is provided with a conductive area, which consists of several conductive bumps. The conductive area is used to connect to the testing machine, and the other end of the conductive strip extends out of the other side of the film structure to contact with each conductive contact on the component.

Through the following detailed description of the specific embodiments in conjunction with the accompanying drawings, it is easier to understand the purpose, technical content, characteristics and effects of the utility model.

Description of drawings

Fig. 1 is the schematic diagram of the utility model;

Fig. 2 is another embodiment of the utility model;

FIG. 3 is a schematic diagram of the components of the array conductive contact structure of the multiple exposed thin film probe test tool of the present invention.

Explanation of reference numerals: 20 exposed thin film probe; 202 thin film structure; 204 conductive strip; 206 conductive area; 208 conductive bump; 209 elliptical;

Detailed ways

The utility model proposes an exposed thin-film probe. FIG. 1 is a schematic diagram of an exposed thin-film probe. The exposed thin-film probe 20 includes a thin-film structure 202 whose material can be a polymer material (Polymer) or a flexible material. Several conductive strips 204 are arranged on the surface of the thin film structure 202, and the material of the conductive strips 204 is metal, such as copper or its alloy. 206 , each conductive area 206 is composed of several conductive bumps 208 , the material of the conductive bumps 208 is nickel alloy, and the other end of the conductive strip 204 extends from the other side of the film structure 202 .

Wherein, in another embodiment shown in FIG. 2, one end of each conductive strip 204 is arranged on the surface of one side of the film structure 202, while the other end can extend to the other side of the film structure 202 and be divided into two parts. Form an ellipse 209, or present an S shape and then merge into one.

Fig. 3 is the schematic diagram that utilizes a plurality of exposed thin film probes to test the component of array conductive contact structure at the same time, utilizes a testing machine to test the component 210 of tool array conductive contact structure, such as ball grid array substrate (Ball Grid Arrays Substrate; BGA Substrate) or die (Die), and the number of conductive contacts 212 is set on the component 210, the conductive bump 208 at one end of the exposed thin film probe 20 is connected to the testing machine with a wire, and each conductive strip 204 extending from the other end is connected to the testing machine. Each conductive contact 212 on the component 210 is in contact to achieve the test effect, and if the exposed thin film probe 20 with the oval shape 209 shown in FIG. When the conductive contact 212 contacts, because of the feature of the ellipse 209, the conductive strip 204 is used to press down, so that the part of the conductive strip 204 extending out of the side of the film structure 202 can be compared with the conductive contact 212 on the component 210. Elastic and good contact.

Wherein, because the thin film structure 202 is a flexible material, if the conductive contacts 212 on the component 210 are arranged in an irregular shape, the thin film structure 202 can be twisted in a curved shape, so that the conductive strips 204 on the thin film structure 202 can contact to each conductive contact 212 .

The utility model provides an exposed film probe, which is used to provide a connection testing machine to test components with an array conductive contact structure. By extending one end of the conductive strip to one side of the film structure, the extended conductive strip is connected to the component. When the thin film probe is applied to test components with an array conductive contact structure, multiple conductive contacts can be tested at one time, thus shortening the test time, reducing costs, and achieving simplification of the array conductive contact structure test. .

The above description utilizes the embodiment to illustrate the characteristics of the utility model, and its purpose is to enable those skilled in the art to understand the content of the utility model and implement it accordingly, rather than limit the scope of the utility model, so others do not depart from the utility model Equivalent modifications or modifications accomplished with the disclosed spirit should still be included within the scope of protection defined by the appended claims.

Claims (9)

1, a kind of exposed conveying appliance film probe, for connecting a test machine, assembly in order to test tool arrays of conductive contact point structure, several conductive junction points are set on this assembly, this exposed conveying appliance film probe comprises membrane structure, its surface is provided with several buss, it is characterized in that: each bus one end is arranged on this membrane structure one side, and each bus is provided with a conduction region, it is made up of several conductive projections, this conduction region is for connecting this test machine, and the bus other end extends to outside this membrane structure opposite side, in order to contact with each conductive junction point on this assembly.

2, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, assembly is the ball grid array base material.

3, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, assembly is a crystal grain.

4, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, the material of membrane structure is a macromolecular material.

5, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, this membrane structure is a flexible structure.

6, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, these buss are made of metal material.

7, exposed conveying appliance film probe as claimed in claim 6 is characterized in that, this metal material is copper or aldary.

8, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, each this bus extends to this membrane structure one side and integrates outward and after formation one ellipticity that is divided into two again, to contact with each this conductive junction point of this assembly.

9, exposed conveying appliance film probe as claimed in claim 1 is characterized in that, this bus other end extends to this membrane structure opposite side and forms S shape outward.

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