CN2696124Y - 散热装置 - Google Patents
散热装置 Download PDFInfo
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- CN2696124Y CN2696124Y CN200420045284.8U CN200420045284U CN2696124Y CN 2696124 Y CN2696124 Y CN 2696124Y CN 200420045284 U CN200420045284 U CN 200420045284U CN 2696124 Y CN2696124 Y CN 2696124Y
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种散热装置,包括一散热体及至少一热管,该热管包括吸热端及放热端;该散热体包括一本体,该本体包括一基座,所述热管的吸热端设于基座上,其中本体还包括设于该基座上的柱体,在该柱体至少一表面设有若干散热鳍片,上述热管的放热端贴设于该柱体上。本实用新型散热装置热管的吸热端与被冷却元件接触而放热端贴设于该柱体上,故可有效的将热量从被冷却元件传递到柱体上远离被冷却元件的区域,从而可充分利用散热体上的散热鳍片散热,提高散热鳍片的利用率。
Description
【技术领域】
本实用新型是关于一种散热装置,尤其是指一种应用于电子元件的散热装置。
【背景技术】
随着电子产业的迅速发展,如中央处理器等电子元件的运算速度大幅度提高,其产生的热量也随之剧增,如何将电子元件的热量散发出去,以保证其正常运作,一直是业界在研究的问题。为有效散发中央处理器在运行过程中产生的热量,业界通常在中央处理器表面加装一散热器辅助其散热,从而使中央处理器自身温度维持在正常运行范围内。
常用的散热器是铝挤型散热器,其在高温下将一半熔融态金属铝一体挤出成型,而使其具有一扁平本体以及由该本体向上凸伸出的若干散热鳍片,由本体吸收热量传到散热鳍片再进一步散发出去。由于散热器是通过本体吸收热量,再由散热鳍片向外散发,因此,通常来讲,本体水平尺寸越大,散热鳍片面积越大,则散热器散热能力越强,但目前主机板上中央处理器周围电子元件更加密集,增大散热器本体的水平尺寸势必与周围电子元件发生干涉;另一方面,由于热量由本体传到散热鳍片底边,再沿鳍片本体向上传导,进而散发出去,热量沿鳍片向上传导过程中也向外散发,当散热鳍片纵向尺寸较大时,散热鳍片上远离本体的区域温度较低,与周围的热交换量小,散热鳍片利用率不高,当然,增加散热鳍片的横向尺寸也存在同样问题,而且,由于散热鳍片都是设在本体上,因此,在本体大小一定条件下,散热鳍片数量受限,整体散热器的散热面积受限。因此,散热性能不能显著提高。随着中央处理器的运行速度越来越快,这种单纯利用金属热传导方式来提高散热器的性能已无法满足实际散热的需要。
为克服上述问题,业界采用热管传导热量的散热装置日益增多,热管是在金属管体内密封装入毛细结构物(如金属粉末烧结物、沟槽结构、丝网结构等)及工作液体(如水、酒精等),然后抽至真空状态,依赖工作液体受热后进行液气两相变化而吸收、释放热量,且由于热管有一定的长度,可将热量传递至较远端。中国专利申请公开第1417660A号揭示一种运用热管的电子元件散热装置,其热管大致呈“U”形,热管两端分别插设在两对叠的散热器本体内,其中一本体的外表面与电子元件接触。该种方式较好利用了热管和散热器各自的优点,使热量充分向外散发。但是,该种方式仍然存在两散热器的散热鳍片顶端未能充分散热,散热要求较高时,不能满足散热要求的问题。
【发明内容】
本实用新型的目的在于提供一种有效提高散热鳍片利用率、从而具有高效热传导性能的热管型散热装置。
本实用新型的目的是通过以下技术方案实现的:本实用新型的散热装置包括一散热体及至少一热管,该热管包括吸热端及放热端;该散热体包括一本体,该本体包括一基座,所述热管的吸热端设于基座上,其中该本体还包括设于该基座上的柱体,在该柱体至少一表面设有若干散热鳍片,上述热管的放热端贴设于该柱体上。
本实用新型散热装置热管的吸热端固定于基座上而放热端贴设于柱体上,故可有效的将基座从被冷却元件处吸收的热量传递到柱体上远离被冷却元件的区域,使柱体成为新的热源,通过其表面的散热鳍片将热量散失掉,从而可充分利用散热体上的散热鳍片散热,提高散热鳍片的利用率;并且柱体成为新的热源后,可在其表面增加散热鳍片的数量而不受空间的限制,即在不增加被冷却元件与散热体接触面积的情况下,提高散热体的散热面积,故本实用新型的散热装置可有效提高散热鳍片的利用率、具有高效热传导性能。
下面参照附图结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型散热装置第一实施例的立体分解示意图。
图2是图1的组装后示意图。
图3是本实用新型散热装置第二实施例的立体分解示意图。
【具体实施方式】
图1及图2所示为本实用新型散热装置第一实施例,该散热装置1包括一导热板10、一“U”形热管20及一散热体30。其中热管20包括两放热端22及将两放热端22连接成一体的一吸热端24;导热板10由导热性能良好的金属如铜等制成,其包括第一面14及与第一面14相对的第二面16,在导热板10第一面14上设有一沟槽12用以容置热管20的吸热端24,而第二面16用以与被冷却元件接触(图中未示);散热体30包括一呈“工”形的本体31,该本体31包括基座39、位于本体31一端且与基座39相对的顶部34及位于二者之间并将二者连成一体的柱体32,在顶部34与基座39之间的柱体32相对两侧面及顶部34上表面分别设有若干散热鳍片35。上述柱体32从基座39一端向顶部34一端渐缩,在柱体32不设散热鳍片35的另两侧面及基座39底面设有一呈“U”形的沟槽33用以安装热管20,使热管20的两放热端22分别固定于柱体32的两侧面上并使吸热端24固定于基座39底面。此外,在基座39的底面上设有两凸起37,导热板10固定于该两凸起37之间。导热板10与散热体30、导热板10与热管20及散热体30与热管20间可通过焊接或过盈配合等方式连接。
本实用新型散热装置1在使用时,导热板10的第二面16与被冷却元件接触,吸收被冷却元件产生的热量后将热量传递给热管20的吸热端24及散热体30本体31的基座39,热管20的吸热端24内的工作液体吸热变成汽态后流向热管20的两放热端22,工作液体在放热端22冷凝变成液态释放出热量,将一部分热量散失到周围环境,一部分热量传递给散热体30的本体31,使散热体30本体31上远离导热板10的区域具有较高的温度,同时散热体30本体31的基座39也将其吸收的热量传递到本体31的其余部分,从而将热量传递到本体31各部分,本体31再通过其表面的若干散热鳍片35将热量散失掉。
图3所示为本实用新型散热装置的第二实施例的示意图,该散热装置1B与第一实施例不同之处在于热管的结构,在本实施例中包括两个呈“L”形的热管20B,每一热管20B包括一放热端22B及一吸热端24B,两热管20B的放热端22B分别固定于柱体32的两侧面上,并使两吸热端24B固定于基座39底面的沟槽33内,从而使两热管20B组成“U”形。
上述为本实用新型散热装置的两个具体实施例,但本实用新型散热装置并不仅限于此,上述实施例中导热板10及本体31上对应设有沟槽12、33用以安装热管,根据需要还可在导热板10及本体31上对应设有若干沟槽用以安装若干热管以更好的将热量传递到散热体30上;本实施例中散热体30本体31略呈“工”形,其也可制成矩形等不同形状;在柱体32的一侧面及基座39底面可设有一呈“L”形的沟槽,该沟槽内相应设有一呈“L”形的热管;柱体32的基座39底面可不设凸起37,从而使热管及散热体30可直接固定于被冷却元件表面而不需要导热板10;此外,上述沟槽33也可为孔道,将热管插入孔道内以达到将热管固定的目的。
Claims (6)
1.一种散热装置,包括一散热体及至少一热管,该热管包括吸热端及放热端;散热体包括一本体,该本体包括一基座,所述热管的吸热端设于基座上,其特征在于:该本体还包括设于该基座上的柱体,在该柱体至少一表面设有若干散热鳍片,上述热管的放热端贴设于该柱体上。
2.如权利要求1所述的散热装置,其特征在于:该柱体上与基座相对一端设有一顶部,使本体呈“工”形,上述若干散热鳍片设置于该顶部与基座之间的柱体相对两侧面及顶部外表面。
3.如权利要求2所述的散热装置,其特征在于:该热管的放热端贴设于该柱体至少另一侧面上。
4.如权利要求1所述的散热装置,其特征在于:该热管呈“L”形。
5.如权利要求1所述的散热装置,其特征在于:该热管呈“U”形。
6.如权利要求1所述的散热装置,其特征在于:该散热体上设有容置热管的沟槽。
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CN200420045284.8U CN2696124Y (zh) | 2004-04-22 | 2004-04-22 | 散热装置 |
US10/893,214 US7000687B2 (en) | 2004-04-22 | 2004-07-16 | Heat dissipating device |
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CN200420045284.8U CN2696124Y (zh) | 2004-04-22 | 2004-04-22 | 散热装置 |
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CN206909011U (zh) * | 2017-04-19 | 2018-01-19 | 西门子公司 | 散热器和变频器 |
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CN114123610B (zh) * | 2021-12-02 | 2022-08-09 | 南昌三瑞智能科技有限公司 | 一种电机内改善铁芯温度分布的风冷散热片 |
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US6779595B1 (en) * | 2003-09-16 | 2004-08-24 | Cpumate Inc. | Integrated heat dissipation apparatus |
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- 2004-04-22 CN CN200420045284.8U patent/CN2696124Y/zh not_active Expired - Fee Related
- 2004-07-16 US US10/893,214 patent/US7000687B2/en not_active Expired - Fee Related
Cited By (2)
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US7802616B2 (en) | 2007-06-01 | 2010-09-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus with heat pipes |
CN103369922A (zh) * | 2012-04-10 | 2013-10-23 | 奇鋐科技股份有限公司 | 散热模组结构 |
Also Published As
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US7000687B2 (en) | 2006-02-21 |
US20050247437A1 (en) | 2005-11-10 |
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