CN2667664Y - heat sink - Google Patents
heat sink Download PDFInfo
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- CN2667664Y CN2667664Y CN 200320121833 CN200320121833U CN2667664Y CN 2667664 Y CN2667664 Y CN 2667664Y CN 200320121833 CN200320121833 CN 200320121833 CN 200320121833 U CN200320121833 U CN 200320121833U CN 2667664 Y CN2667664 Y CN 2667664Y
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- heat dissipation
- fan cover
- radiator
- heat
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Abstract
一种散热装置,包括有一散热器及一风扇罩。其中,该散热器由多个散热鳍片及热管组成。所述散热鳍片上开设有多个穿孔,所述热管插入所述穿孔中。在所述散热鳍片两侧的对应边上分别设置有嵌入部。一风扇罩覆盖在该散热器的表面上,该风扇罩的两个侧板上分别设有容置部,该容置部与散热鳍片的嵌入部对应设置并相互配合。由此,将该嵌入部放置在该容置部内,可使该散热器与风扇罩形成紧密地结合,增加了散热装置整体的稳定性及结合的紧密度。
A cooling device includes a radiator and a fan cover. Wherein, the radiator is composed of a plurality of cooling fins and heat pipes. A plurality of perforations are opened on the heat dissipation fins, and the heat pipes are inserted into the perforations. Embedded parts are respectively provided on the corresponding sides of the two sides of the heat dissipation fins. A fan cover covers the surface of the heat sink, and two side plates of the fan cover are respectively provided with accommodating parts, and the accommodating parts are arranged correspondingly to the embedded parts of the cooling fins and cooperate with each other. Therefore, placing the embedding part in the accommodating part can make the radiator and the fan cover form a tight combination, which increases the overall stability of the heat dissipation device and the tightness of the combination.
Description
技术领域technical field
本实用新型涉及一种散热装置,尤其涉及一种将散热鳍片与风扇罩相互嵌入配合,使该散热器与风扇罩形成紧密地结合,用来增加该散热装置整体结构的稳定性及结合的紧密度。The utility model relates to a heat dissipation device, in particular to a method for embedding heat dissipation fins and a fan cover so that the heat sink and the fan cover form a tight combination, which is used to increase the stability and combination of the overall structure of the heat dissipation device. Tightness.
背景技术Background technique
用散热器加散热风扇所构成的散热装置来解决中央处理器(CPU)运行时所产生的高热量已经成为目前计算机行业普遍所采用的散热方式。尤其是近年来中央处理器的时钟频率已经超过3GHz,所产生的热量相当高,严重威胁着中央处理器的性能与运行的稳定性。因此,一般厂家通过增大散热风扇的尺寸或提高转速来增加散热装置的散热效果,但同时也使得散热装置的整体结构强度面临极大的考验,本实用新型的目的是为了增加散热装置的结构强度。It has become a heat dissipation method commonly used in the computer industry to solve the high heat generated by the central processing unit (CPU) when the central processing unit (CPU) is running with a heat dissipation device composed of a heat sink and a heat dissipation fan. Especially in recent years, the clock frequency of the central processing unit has exceeded 3GHz, and the generated heat is quite high, seriously threatening the performance and operation stability of the central processing unit. Therefore, general manufacturers increase the heat dissipation effect of the heat dissipation device by increasing the size of the heat dissipation fan or increasing the rotating speed, but at the same time the overall structural strength of the heat dissipation device is faced with a great test. The purpose of this utility model is to increase the structure of the heat dissipation device. strength.
公知的散热装置,如图1所示,包括有一散热器10a及一风扇罩20a。其中,散热器10a包括有一底板11a、一热管12a及多个散热鳍片13a。散热鳍片13a开设有多个穿孔14a,热管12a插入穿孔14a中,热管12a的底面平贴在底板11a上,由此形成散热器10a。一风扇罩20a覆盖在散热器10a的表面上。风扇罩20a用金属板片弯折成形并呈“ㄇ”字形。在风扇罩20a的两个侧板底部开设有孔洞,用螺丝等固定连接组件插入该孔洞将风扇罩20a固定安装在散热器10a上。A known heat dissipation device, as shown in FIG. 1 , includes a radiator 10a and a fan cover 20a. Wherein, the radiator 10a includes a bottom plate 11a, a heat pipe 12a and a plurality of cooling fins 13a. The heat dissipation fins 13a are provided with a plurality of through holes 14a, and the heat pipes 12a are inserted into the through holes 14a, and the bottom surface of the heat pipes 12a is flatly attached to the bottom plate 11a, thereby forming the heat sink 10a. A fan cover 20a covers the surface of the radiator 10a. The fan cover 20a is formed by bending a metal sheet and is in the shape of "ㄇ". Bottoms of the two side plates of the fan cover 20a are provided with holes, and screws and the like are used to fix the connection components into the holes to fix the fan cover 20a on the radiator 10a.
公知的散热装置具有如下缺陷:由于风扇罩20a与散热器10a不是相互扣固连接,因此在搬运或运输过程中如果不慎失手掉落时,易使散热器10a与风扇罩20a产生松脱分离的现象,从而使散热鳍片13a弯曲变形或散热器10a损坏,因此,风扇罩20a将无法达到保护散热器10a的目的。The known heat dissipation device has the following defects: Since the fan cover 20a and the radiator 10a are not fastened to each other, the radiator 10a and the fan cover 20a are likely to be loosened and separated if they are accidentally dropped during handling or transportation. phenomenon, so that the heat dissipation fins 13a are bent and deformed or the heat sink 10a is damaged. Therefore, the fan cover 20a will not be able to achieve the purpose of protecting the heat sink 10a.
本设计人鉴于上述现有技术中存在的缺陷,凭借从事研发多年的经验,针对可进行改进的不便与缺陷,经过潜心研究并配合实际的运用,本着精益求精的精神,终于提出一种设计合理且有效改进上述缺陷的本实用新型。In view of the defects in the above-mentioned prior art, the designer finally proposes a design with reasonable And effectively improve the utility model of above-mentioned defect.
本实用新型的内容Contents of the utility model
本实用新型的主要目的在于提供一种散热装置,利用将散热器的散热鳍片的嵌入部放置在风扇罩的容置部内,可使该散热器与风扇罩形成紧密地结合,用来增加散热装置整体的稳定性及结合的紧密度。The main purpose of this utility model is to provide a heat dissipation device. By placing the embedded part of the heat dissipation fin of the radiator in the accommodating part of the fan cover, the radiator and the fan cover can be tightly combined to increase heat dissipation. The overall stability of the device and the tightness of the combination.
本实用新型的另一目的在于提供一种散热装置,当散热风扇向散热器吹送气流时,可以从风扇罩的容置部将内部气流导出,减轻了风力背压从而提高了散热效率。Another object of the present invention is to provide a heat dissipation device. When the heat dissipation fan blows airflow to the radiator, the internal airflow can be led out from the accommodating part of the fan cover, which reduces the wind back pressure and improves heat dissipation efficiency.
为了达到上述目的,本实用新型提供一种散热装置,包括有一散热器及一风扇罩。其中,该散热器由多个散热鳍片及热管组成。在所述散热鳍片上开设有多个穿孔,所述热管插入该穿孔中。在该散热鳍片的相对应边上分别设置有嵌入部。一风扇罩覆盖在该散热器的表面上,在该风扇罩的两个侧板上分别设有容置部,该容置部与所述散热鳍片的嵌入部对应设置并相互配合,从而同时达到上述的目的。In order to achieve the above purpose, the utility model provides a heat dissipation device, which includes a radiator and a fan cover. Wherein, the radiator is composed of a plurality of cooling fins and heat pipes. A plurality of perforations are opened on the heat dissipation fins, and the heat pipes are inserted into the perforations. Embedded parts are respectively arranged on the corresponding sides of the cooling fins. A fan cover covers the surface of the radiator, and two side plates of the fan cover are respectively provided with accommodating parts. achieve the above purpose.
本实用新型的散热装置具有以下优点:The cooling device of the utility model has the following advantages:
1.本实用新型的散热装置的嵌入部可放置在容置部内,可以使该散热器与风扇罩形成紧密结合,在不慎失手掉落时,也不会造成散热鳍片及热管破裂损坏。1. The embedded part of the heat sink of the present invention can be placed in the accommodating part, so that the heat sink can form a tight connection with the fan cover, and the heat dissipation fins and heat pipes will not be broken or damaged even if it is accidentally dropped.
2.通过本实用新型的风扇罩的容置部的设计,可使内部气流从容置部导出,以减轻风力所造成的背压,从而提高散热装置整体的散热效果。2. Through the design of the accommodating part of the fan cover of the utility model, the internal air flow can be led out from the accommodating part to reduce the back pressure caused by the wind force, thereby improving the overall heat dissipation effect of the heat sink.
3.本实用新型的散热装置具有高稳定性并且连接的紧密度好,在增大散热风扇的尺寸或提高转速时,也不会产生扰人的噪音。3. The heat dissipation device of the present invention has high stability and good connection tightness, and will not generate disturbing noise when the size of the heat dissipation fan is increased or the speed is increased.
附图的简要说明Brief description of the drawings
图1为公知的散热装置的散热鳍片与风扇罩的结构示意图;FIG. 1 is a structural schematic diagram of a heat dissipation fin and a fan cover of a known heat dissipation device;
图2为本实用新型第一实施例的散热装置的立体分解图;Fig. 2 is a three-dimensional exploded view of the heat dissipation device of the first embodiment of the present invention;
图3为本实用新型第一实施例的散热装置的组合示意图;Fig. 3 is a schematic diagram of the combination of the heat dissipation device of the first embodiment of the present invention;
图4为本实用新型第一实施例的散热装置的组合剖视图;Fig. 4 is a combined cross-sectional view of the heat dissipation device of the first embodiment of the present invention;
图5为本实用新型第二实施例的散热装置的侧视图;Fig. 5 is a side view of the heat dissipation device of the second embodiment of the present invention;
图6为本实用新型第三实施例的散热装置的侧视图;Fig. 6 is a side view of the heat dissipation device of the third embodiment of the present invention;
图7为本实用新型第四实施例的散热装置的组合剖视图。FIG. 7 is a combined cross-sectional view of a heat dissipation device according to a fourth embodiment of the present invention.
附图中,各标号所代表的部件列表如下:In the accompanying drawings, the list of parts represented by each label is as follows:
10a-散热器
11a-底板 12a-热管
13a-散热鳍片 14a-穿孔
20a-风扇罩
10-散热器10-radiator
11-散热鳍片 111-穿孔
112-凸缘 113-筒柱
114-流道 115-嵌入部
12-热管 13-底板
131-螺孔
20-风扇罩
21-容置部 22-孔洞
23-半圆球 24-螺孔
30-散热风扇30-cooling fan
具体实施方式Detailed ways
为了使本领域技术人员进一步了解本实用新型的特征及技术内容,请参阅以下有关本实用新型的详细说明与附图,而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。In order for those skilled in the art to further understand the features and technical content of the utility model, please refer to the following detailed description and accompanying drawings of the utility model, and the attached drawings are only for reference and description, and are not used to explain the utility model limit.
本实用新型提供一种散热装置,图2、图3及图4分别为本实用新型第一实施例的立体分解图、组合示意图及组合剖视图。如图2、图3及图4所示,包括有一散热器10及一风扇罩20,其中:The utility model provides a heat dissipation device. FIG. 2 , FIG. 3 and FIG. 4 are a three-dimensional exploded view, a combined schematic diagram and a combined sectional view of the first embodiment of the utility model, respectively. As shown in Fig. 2, Fig. 3 and Fig. 4, include a
散热器10包括多个散热鳍片11及热管12。散热鳍片11用铝、铜或具有良好导热性的金属板片制成。在散热鳍片11上开设有多个穿孔111,在穿孔111的周边设置有凸缘112。在散热鳍片11前端的两个角设置有筒柱113。凸缘112及筒柱113可使各散热鳍片11堆叠排列时形成间隔流道114。在散热鳍片11两侧的对应边上分别设置有嵌入部115,嵌入部115可以是一凸块或凹口。在本实施例中为凸块。穿孔111可供热管12穿设连接,热管12可以是“L”字形或“U”字形,在热管12内部具有毛细组织及工作流体,利用该毛细组织及工作流体的热传导功能,可以将发热源所产生的热量迅速带离。热管12底面贴平固定设置在底板13上,在底板13的两个侧边上开设有多个螺孔131。The
风扇罩20用金属板片弯折成形并呈“ㄇ”字形,可覆盖在散热器10的表面上。在风扇罩20的两个侧板上分别开设有容置部21,容置部21与散热鳍片11的嵌入部115对应设置并相互配合。容置部21可为一贯穿或凹入折边的孔槽(如图7),本实施例为一贯穿矩形孔槽。在容置部21下方开设有多个孔洞22,用螺栓等固定连接组件插入孔洞22及螺孔131从而将风扇罩20与底板13固定连接。在风扇罩20的顶面设置有多个凸出的半圆球23,半圆球23正对在散热鳍片11的穿孔111上。在风扇罩20的后侧的各角端弯折有平板,在该平板上分别开设有螺孔24。The
在组装时可将散热器10的嵌入部115放置在风扇罩20的容置部21内,可使散热器10与风扇罩20形成紧密结合,增加了散热装置整体结构的稳定性及结合的紧密度。During assembly, the embedded
图5及图6为分别本实用新型第二实施例及第三实施例的侧视图。如图5及图6所示,本实用新型进一步包括一散热风扇30。散热风扇30安装在风扇罩20的后侧边上,用螺纹连接组件插入螺孔24,将散热风扇30与风扇罩20固定连接。风扇罩20的容置部21可为菱形(如图5所示)或不连续的多个矩形槽(如图6所示)或其它各种不同的几何形状。同理,各散热鳍片11的嵌入部112需要配合风扇罩20的容置部21的形状制造。当散热风扇30向散热器10吹送气流时,可以从风扇罩20的容置部21将内部气流导出,以减轻风力背压从而提高散热效果。5 and 6 are side views of the second embodiment and the third embodiment of the present utility model respectively. As shown in FIG. 5 and FIG. 6 , the utility model further includes a cooling
综上所述,本实用新型的散热装置具有实用性、新颖性与创造性,并且本实用新型的结构也不曾见于同类产品及公开使用过,申请前更未刊登在任何刊物上,完全符合实用新型专利的申请要件。To sum up, the heat dissipation device of the present utility model has practicality, novelty and creativity, and the structure of the utility model has never been seen in similar products and has been used publicly, and has not been published in any publications before the application, which is completely in line with the utility model. Patent application requirements.
以上所述仅为本实用新型的实施例,并非因此即限制本实用新型的专利范围,凡是运用本实用新型说明书及附图内容所作的等效结构变化,或直接或间接运用在其它相关的技术领域,同理皆包括在本实用新型所涵盖的专利范围内。The above descriptions are only embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. All equivalent structural changes made by using the description of the utility model and the contents of the accompanying drawings are directly or indirectly used in other related technologies. Fields are all included in the patent scope covered by the utility model in the same way.
Claims (8)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103429047A (en) * | 2013-02-27 | 2013-12-04 | 上海理工大学 | Radiating device |
CN111050522A (en) * | 2018-10-12 | 2020-04-21 | 英业达科技有限公司 | Heat radiation structure |
-
2003
- 2003-11-26 CN CN 200320121833 patent/CN2667664Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103429047A (en) * | 2013-02-27 | 2013-12-04 | 上海理工大学 | Radiating device |
CN111050522A (en) * | 2018-10-12 | 2020-04-21 | 英业达科技有限公司 | Heat radiation structure |
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Granted publication date: 20041229 Termination date: 20121126 |