CN2617040Y - Light-emitting diode bulb - Google Patents
Light-emitting diode bulb Download PDFInfo
- Publication number
- CN2617040Y CN2617040Y CNU03224052XU CN03224052U CN2617040Y CN 2617040 Y CN2617040 Y CN 2617040Y CN U03224052X U CNU03224052X U CN U03224052XU CN 03224052 U CN03224052 U CN 03224052U CN 2617040 Y CN2617040 Y CN 2617040Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- wafer
- light
- patch
- bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000006260 foam Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052721 tungsten Inorganic materials 0.000 abstract description 5
- 239000010937 tungsten Substances 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract 2
- 210000004508 polar body Anatomy 0.000 abstract 2
- 238000005034 decoration Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses a new type luminescent two polar body bulb, which aims to provide a patch luminescent diode or the wafer to replace the tungsten wires as the lighting bulbs in the low voltage space and narrow environment; the luminescent two polar body bulb of the utility model comprises a bulb body, an inside luminophor and a metallic decoration lamp holder, the luminophor is a patch luminescent diode wafer or a patch luminescent diode; the patch luminescent diode wafer is single particle, the cathode of the wafer is connected with the metal shell, the anode is connected with the exterior tin points through the current-limiting resistance, or the patch luminescent diode is formed by internal multiple particles wafer series connected.
Description
Technical field
The utility model relates to a kind of bulb, particularly a kind of light-emittingdiode bulb.
Background technology
At present, commercially available be used for low-voltage, space-constrained environment such as flashlight or automotive lighting light fixture use the illuminating lamp major part to be tungsten lamp, this bulb brightness height, low price, but luminous efficiency is low, power consumption is high, and the shock resistance of tungsten filament is poor, the manufacturing process complexity need charge into inert gas or is evacuated in bulb, and useful life is very short.At this situation, a kind of new LED led lamp arises at the historic moment, the LED lamp low in energy consumption, thermal losses is little, and long service life, but LED lamp in the market is generally used for decorative model lamp or low-voltage indicator light, also is useful on the LED lamp of illumination, but in foam, be provided with the PCB printed circuit board (PCB), its structure, complex process, electronic component is many, bulb can't be done try one's best little of to adapt to the use under the narrow space environment.
Summary of the invention
In order to overcome the deficiencies in the prior art, the utility model provides a kind of and replaces the novel light-emitting diode bulb of tungsten filament as the low-voltage lighting bulb with patch light-emitting diode or its wafer.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of novel light-emitting diode bulb comprises foam, luminous element and metallic lamp holder in it, and described luminous element is patch light-emitting diode wafer or patch light-emitting diode; Described patch light-emitting diode wafer is a simple grain, and the wafer negative electrode is connected with metal-back, and anode is connected with outside tin point by current-limiting resistance; Perhaps, described patch light-emitting diode is that built-in many wafer tandem form.
Above-mentioned wafer is covered by the fluorescent material parcel; The foam of above-mentioned light-emittingdiode bulb is transparent resin or glass shell.
The beneficial effects of the utility model are:
1, simple in structure: this bulb directly substitutes tungsten filament and existing bulb parts with brightness patch light-emitting diode or its wafer and directly combines.
2, manufacturing process is simple, and cost is lower, need not in the bubble to be evacuated or to charge into inert gas.Existing bulb manufacturer need not to increase any equipment, can produce in batches.
3, safe and reliable: do not produce high heat of high temperature and safe voltage when working owing to LED and drive, even bulb shell is broken accidentally, LED does as usual and works, can initiation fire or harm people fowl.
4, the long-life: the theoretical life-span, also can reach tens thousand of hours actual life more than 100,000 hours.
5, low-power consumption: ultra-high brightness LED need only just can send light by little electric current.Power consumption is generally below several watts, well below the power consumption of incandescent lamp bulb.
6, the scope of application is extensive: according to bulb power and volume size, can use in various fields and environment occasion, fill up general LED electricity-saving lamp environment and used the blank of being limited to.As can be used for flashlight, automobile, toy, electrical equipment etc.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the structural representation of second kind of embodiment of the utility model;
Fig. 3 is the structural representation of the third embodiment of the utility model;
Fig. 4 is the structural representation of the 4th kind of embodiment of the utility model.
Embodiment
With reference to Fig. 1, a kind of novel light-emitting diode bulb, comprise foam 1, luminous element and metallic lamp holder 3 in the foam, foam 1 adopts transparent resin, anti-ly beats, durable in use, luminous element is the patch light-emitting diode wafer 2 of simple grain, its negative electrode pin 5 is connected with metallic lamp holder 3, and anode pin 6 is connected with outside tin point 8 by current-limiting resistance 4, tin point 8 and metallic lamp holder 3 insulation.The outside fluorescent material 7 that covers of wafer presents white light behind the rayed fluorescent material that wafer is sent.
With reference to Fig. 2, the structural representation of second kind of embodiment of the utility model, luminous element in the present embodiment adopts many patch light-emitting diode wafer 2 to be in series, the pin of many wafers joins end to end, negative electrode pin 5 is connected with metallic lamp holder 3, anode pin 6 is connected with outside tin point 8 by current-limiting resistance 4, can realize high power work.
With reference to Fig. 3, the structural representation of the third embodiment of the utility model, this embodiment directly adopts single patch light-emitting diode 8 as luminous element in the foam 1 of transparent resin, also can adopt a plurality of patch light-emitting diode series connection as luminous element in addition, other syndetons are all identical with last two embodiment.
With reference to Fig. 4, the luminous element among this embodiment also is to adopt patch light-emitting diode, and this patch light-emitting diode 9 forms for built-in many wafer tandem, and the pin of many wafers joins end to end and connects, and can realize high power work equally.
Foam 1 in the foregoing description adopts transparent resin; anti-beat, durable in use; certainly; also can steep identical with ordinary incandescent lamp; also be to adopt the glass shell foam; different is; luminous element in it is simple grain or many patch light-emitting diode wafers 2; perhaps patch light-emitting diode 8,9; like this; just can make bulb have low in energy consumption, life-span long, antidetonation is swung, simple in structure, advantage such as thermal losses is little, and the manufacturing process of bulb is simple, the incandescent lamp bulb that can directly replace in the low-voltage electrical apparatuses such as existing flashlight, automotive lighting light fixture uses.
Claims (5)
1. a novel light-emitting diode bulb comprises foam (1), luminous element and metallic lamp holder (3) in it, it is characterized in that luminous element is patch light-emitting diode wafer or patch light-emitting diode.
2. a kind of novel light-emitting diode bulb according to claim 1 is characterized in that described patch light-emitting diode wafer is a simple grain, and the wafer negative electrode is connected with metal-back, and anode is connected with outside tin point by current-limiting resistance (4).
3. a kind of novel light-emitting diode bulb according to claim 1 is characterized in that described patch light-emitting diode is that built-in many wafer tandem form.
4. a kind of novel light-emitting diode bulb according to claim 1 is characterized in that described patch light-emitting diode wafer is covered by the fluorescent material parcel.
5. a kind of novel light-emitting diode bulb according to claim 1 is characterized in that described foam (1) is transparent resin or glass shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU03224052XU CN2617040Y (en) | 2003-03-05 | 2003-03-05 | Light-emitting diode bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU03224052XU CN2617040Y (en) | 2003-03-05 | 2003-03-05 | Light-emitting diode bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2617040Y true CN2617040Y (en) | 2004-05-19 |
Family
ID=34245537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU03224052XU Expired - Fee Related CN2617040Y (en) | 2003-03-05 | 2003-03-05 | Light-emitting diode bulb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2617040Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1837677B (en) * | 2006-01-19 | 2011-04-27 | 陈泽 | LED light source using mini-sized lamp as current-suppressing resistor |
| CN103241166A (en) * | 2013-04-28 | 2013-08-14 | 南宁桂格精工科技有限公司 | LED side turn signal lamp arranged in rearview mirror |
-
2003
- 2003-03-05 CN CNU03224052XU patent/CN2617040Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1837677B (en) * | 2006-01-19 | 2011-04-27 | 陈泽 | LED light source using mini-sized lamp as current-suppressing resistor |
| CN103241166A (en) * | 2013-04-28 | 2013-08-14 | 南宁桂格精工科技有限公司 | LED side turn signal lamp arranged in rearview mirror |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |